| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
|
1,000 pcs
|
1000 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
| Category | |
| Manufacturer Name | |
| Board | |
| Cable Pitch | |
| Cable Termination | |
| Color | |
| Connector Type | |
| Contact Finish | |
| Contact Finish Thickness | |
| Features | |
| Lead Spacing | |
| Lead Style | |
| Mounting Type | |
| Number of Positions | |
| Number of Rows | |
| Row Spacing | |
| Tape & Reel | |
| Wire Gauge |
The TE Connectivity 111382-4 is a 20-position IDC DIP header designed for direct wiring to board applications. It features 2 rows with a 2.54mm row spacing, and a cable pitch of 1.27mm. The connector uses IDC termination for 28 AWG stranded or 26-30 AWG solid wire. Mounting is through-hole press-fit. The contact finish is tin-lead with a thickness of 100.0µin (2.54µm). The housing is black and includes a feed-through feature. This header is suitable for use in applications requiring a reliable connection between ribbon cable and PCB.
| Qty | Low | High |
|---|---|---|
| 1,400+ | $2.22 | $2.22 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
20 positions.
2.54mm (0.100").
1.27mm (0.050").
Through hole, press-fit.
Tin-lead, 100.0µin (2.54µm) thickness.
28 AWG stranded, 26-30 AWG solid.
IDC (Insulation Displacement Connection).