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110-83-632-41-001101 32-position open frame DIP IC socket with 0.6" row spacing and 2.54mm pitch. Features tin-plated beryllium copper contacts and through-hole solder termination.
Mfr Part #:

110-83-632-41-001101

Available from 1 distributors
Mfr Name: Preci-Dip
Preci-Dip
32-position open frame DIP IC socket with 0.6" row spacing and 2.54mm pitch. Features tin-plated beryllium copper contacts and through-hole solder termination.
Total Stock: 1,800 pcs

110-83-632-41-001101 Available from 1 distributor

Authorised
Non-Authorised
Distributor Stock Pricing MOQ PKG Lead Time Date Code On Order Quantity On Order Delivery
Non-Authorised Inventory information
1,800 pcs
1800 pcs On Request 1 On Request On Request 0921 On Request On Request

110-83-632-41-001101 Specifications Quick View

Most important parameters for selection – full specs in datasheet.
Category
Manufacturer Name
Automotive Grade
Contact Finish
Contact Finish Thickness
Contact Material
Features
Housing Material
Lead Spacing
Lead Style
Mounting Type
Number of Positions
Number of Positions or Pins (Grid)
Operating Temperature
Pitch
Row Spacing
Termination
Termination Style
Type

110-83-632-41-001101 Description

Short technical summary and product information.

The Preci-Dip 110-83-632-41-001101 is a 32-position (2 x 16) open frame DIP IC socket designed for through-hole mounting. It features a standard 0.6" (15.24mm) row spacing and 2.54mm (0.100") pin pitch, making it compatible with common DIP packages.

 

The socket is constructed with a PCT (polycyclohexylenedimethylene terephthalate) and polyester glass-filled housing, providing robust insulation and dimensional stability. Contacts are made from beryllium copper with a tin finish of 29.5µin (0.75µm) thickness, ensuring reliable electrical connections and corrosion resistance.

 

This DIP socket supports an operating temperature range of -55°C to 125°C, suitable for a variety of industrial and commercial applications. The open frame design allows for airflow and inspection of solder joints. Termination is via through-hole solder, providing a secure mechanical and electrical bond to the PCB.

110-83-632-41-001101 Quick Information

Product Type: DIP IC Socket
Series: 110-XX-PPP
Canonical Name: IC Socket, DIP 0.6" Row Spacing, 32 Positions, Through Hole, Solder, Tin Contact Finish
Subcategory: IC Sockets

110-83-632-41-001101 Compliance

RoHS Status: RoHS Compliant
Moisture Sensitivity Level (MSL): 1 Unlimited
REACH Status: REACH Unaffected

110-83-632-41-001101 Features

  • 32 DIP positions in 2 x 16 grid.
  • 0.6" row spacing with 2.54mm pitch.
  • Through-hole solder termination.
  • Tin-plated beryllium copper contacts.
  • Open frame PCT/Polyester glass filled housing.

110-83-632-41-001101 Applications

  • Ideal for mounting DIP-packaged ICs on PCBs.
  • Suitable for high-reliability socketing in prototyping.
  • Used in industrial and commercial electronic assemblies.

110-83-632-41-001101 FAQs

7 frequently asked questions generated from this part’s specifications.
How many positions does the 110-83-632-41-001101 have?

32 positions arranged in a 2 x 16 grid.

What is the pin pitch of this DIP socket?

2.54mm (0.100").

What is the row spacing of the 110-83-632-41-001101?

0.6" (15.24mm).

What is the mounting type?

Through hole with solder termination.

What is the operating temperature range?

-55°C to 125°C.

What is the contact material?

Beryllium copper with tin plating of 29.5µin (0.75µm).

What is the housing material?

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled.

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