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104146 Laird Technologies 104146 thermal pad, sheet. RoHS3 compliant thermal management component.
Mfr Part #:

104146

Available from 1 distributors
Mfr Name: Laird Technologies
Laird Technologies
Laird Technologies 104146 thermal pad, sheet. RoHS3 compliant thermal management component.
✓ Total Stock: 587 pcs
$ Price Range: $2.00

104146 Available from 1 distributor

✓ Authorised
✓ Non-Authorised
Distributor Stock Pricing MOQ PKG Lead Time Date Code On Order Quantity On Order Delivery
Husky International Electronic ✓
Non-Authorised Inventory information
587 pcs
On Request
587 pcs On Request 1 On Request On Request N/A On Request On Request
DistyParts aggregates offers from multiple distributors. Final prices, lead times and terms are subject to the distributors' discretion and may change without prior notice. DistyParts is not liable for any discrepancies.

104146 Specifications Quick View

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104146 Description

Short technical summary and product information.

The Laird Technologies 104146 is a thermal pad, sheet designed for thermal management in electronic assemblies. It is RoHS3 compliant, making it suitable for use in environmentally conscious designs. This component serves as a thermal interface material, aiding heat transfer between heat-generating devices and heat sinks. Typical applications include power electronics, LED lighting, and computing systems where reliable thermal management is required.

104146 Quick Information

Product Type: Thermal Pad, Sheet
Canonical Name: Laird Technologies 104146 Thermal Pad, Sheet
Subcategory: Sheet

104146 Compliance

RoHS Status: RoHS Compliant
Moisture Sensitivity Level (MSL): 1 Unlimited
REACH Status: REACH Unaffected

104146 Estimated Pricing

Qty Low High
1+ $2.00 $2.00

Estimated market price range - modelled values for guidance only, not live distributor offers.

104146 Features

  • RoHS3 compliant thermal pad.
  • Designed for thermal management.
  • Laird Technologies component.
  • Sheet form factor.
  • Thermal interface material.

104146 Applications

  • Thermal interface for CPU heat sinks.
  • Heat dissipation in power electronics.
  • Thermal management for LED arrays.
  • Cooling automotive control modules.
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