| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
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900 pcs
|
900 pcs | On Request | 1 | On Request | On Request | 1506+ | On Request | On Request |
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The Amphenol ICC 10080640-101LF is a high density backplane header designed for use in backplane and orthogonal midplane applications. It features 216 positions arranged in 18 rows with a 1.80mm pitch, providing a compact and high-density interconnect solution. The header uses male pins with a press-fit termination for reliable solderless connection to the PCB. The contact finish is gold or GXT™ for enhanced durability and conductivity. The connector is black in color and all positions are loaded. The contact layout includes 72 signal pairs and 72 ground contacts, optimizing signal integrity. This component is ideal for high-speed data transmission systems requiring robust mechanical and electrical performance.
| Qty | Low | High |
|---|---|---|
| 180+ | $10.64 | $10.64 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
The connector has 216 positions loaded.
The pitch is 1.80mm (0.071").
Mounting type is through hole with press-fit termination.
It has 18 rows and 12 columns.
Contact finish is gold or gold, GXT™.
High Density (HDC, HDI, HPC).
Typical contact layout is 72 signal pairs and 72 ground.