| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
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330 pcs
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330 pcs | On Request | 1 | On Request | On Request | 1505+ | On Request | On Request |
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The 10076209-101LF is a 216-position high density receptacle from Amphenol ICC, designed for backplane and orthogonal interconnect systems. It utilizes female socket contacts arranged in 18 rows and 12 columns with a 1.80mm pitch, enabling dense signal routing in high-speed applications.
Termination is via press-fit, providing a reliable solderless connection to the PCB. The mounting style is board edge, through hole, right angle, allowing for compact and efficient board layouts. The contact finish is gold or Gold GXT™ with a thickness of 30.0µin (0.76µm), ensuring low contact resistance and durability.
This connector is rated for 72 signal pairs and 72 ground contacts, supporting high-speed data transmission. It is black in color and has a contact layout of 72 signal pairs and 72 ground. Compliance includes RoHS3, MSL 1 (Unlimited), and REACH Unaffected, though these are unverified. No datasheet or manufacturer page content is currently available.
| Qty | Low | High |
|---|---|---|
| 1+ | $36.43 | $36.43 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
216 positions (all loaded).
1.80mm (0.071").
Board edge, through hole, right angle.
Press-Fit.
Gold or Gold, GXT™, 30.0µin thickness.
18 rows and 12 columns.
RoHS3 compliant, MSL 1 (Unlimited), REACH Unaffected.