| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
|
140 pcs
|
140 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
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This TE Connectivity 1-216791-0 is a 10-position DIP IDC header designed for ribbon cable and board-in applications. It features a 2.54 mm row spacing and a 1.27 mm cable pitch, making it compatible with standard 0.100" x 0.100" grid patterns. The connector uses IDC (Insulation Displacement Connection) termination for reliable cable connections without stripping. The header is mounted via through-hole press-fit, ensuring secure attachment to the PCB. The contact finish is tin with a thickness of 3.00 µm, providing good solderability and corrosion resistance. The connector body is gray in color and includes a feed-through feature for pass-through wiring. This component is RoHS compliant (unverified) and has an MSL of 1 (unlimited moisture sensitivity). It is suitable for applications requiring direct wire-to-board connections in a compact 10-position format.
10 positions, arranged in 2 rows.
2.54 mm (0.100 inches).
1.27 mm (0.050 inches).
Through hole, press-fit.
IDC (Insulation Displacement Connection).
Tin, with 3.00 µm thickness.
Gray.