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| Part & Mfr | Total Stock | Pricing & RFQ | Active Pixel Array | Frames per Second | Operating Temperature | Pixel Size | Supplier Device Package | Type | Voltage | |
|---|---|---|---|---|---|---|---|---|---|---|
On Semiconductor
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1280H x 960V | 54 | -30°C ~ 70°C (TA) | 3.75µm x 3.75µm | 48-ILCC (10x10) | CMOS with Processor | 1.7V ~ 1.95V | |
On Semiconductor
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1280H x 960V | - | -40°C ~ 105°C | 3.75µm x 3.75µm | 63-iBGA (9x9) | CMOS | - | |
On Semiconductor
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1280H x 960V | - | -40°C ~ 105°C | 3.75µm x 3.75µm | 63-iBGA (9x9) | CMOS | - | |
On Semiconductor
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1280H x 960V | - | -40°C ~ 105°C | 3.75µm x 3.75µm | 63-iBGA (9x9) | CMOS | - | |
OmniVision Technologies Inc
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On Semiconductor
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3856H x 2764V | 30 | -30°C ~ 70°C (TJ) | 1.67µm x 1.67µm | 48-ILCC (10x10) | CMOS with Processor | 1.7V ~ 1.9V | |
On Semiconductor
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1280H x 1024V | 43 | -40°C ~ 85°C (TJ) | 4.8µm x 4.8µm | 48-LCC (14.22x14.22) | CMOS with Processor | 1.8V ~ 3.3V | |
On Semiconductor
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2592H x 2048V | 43 | - | 3.2µm x 3.2µm | 163-ILGA (16x16) | CMOS | - | |
On Semiconductor
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2592H x 2048V | 132 | - | 3.2µm x 3.2µm | 163-ILGA (16x16) | CMOS | - | |
Seek Thermal
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200H x 150V | 32 | -10°C ~ 60°C | 12µm x 12µm | Module | Thermal | 3.3V ~ 5V | |
Seek Thermal
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200H x 150V | 9 | -10°C ~ 60°C | 12µm x 12µm | Module | Thermal | 3.3V ~ 5V | |
On Semiconductor
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On Semiconductor
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2592H x 1944V | 53 | -30°C ~ 70°C | 2.2µm x 2.2µm | 48-iLCC (10x10) | CMOS | 1.7V ~ 1.9V, 2.6V ~ 3.1V | |
MELEXIS
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320H x 240V | 600 | -20°C ~ 85°C | 15µm x 15µm | 44-WLBGA (6.6x5.5) | 3D Time of Flight | 3V ~ 3.6V | |
ESPROS Photonics AG
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1024H x 1V | 50000 | -40°C ~ 85°C | 7.5µm x 120µm | 32-CSP (8.08x1.32) | CCD | 2.7V ~ 3.45V | |
ESPROS Photonics AG
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160H x 60V | 512 | -40°C ~ 105°C | 20µm x 20µm | 44-CSP (6.26x4.18) | CCD | 1.71V ~ 1.98V | |
ESPROS Photonics AG
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160H x 60V | 512 | -40°C ~ 85°C | 20µm x 20µm | 44-CSP (6.26x4.18) | CCD | 2.25V ~ 3.63V | |
On Semiconductor
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1280H x 960V | - | -30°C ~ 70°C | 3.75µm x 3.75µm | 63-iBGA (9x9) | CMOS | 1.8V ~ 2.8V | |
Terabee SAS
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- | 240 | - | - | - | 3D Time of Flight | 4.75V ~ 5.25V | |
OmniVision Technologies Inc
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On Semiconductor
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2592H x 2048V | 75 | 0°C ~ 70°C (TJ) | 4.8µm x 4.8µm | 68-LCC (24.13x24.13) | CMOS | 1.8V, 3.3V | |
Seek Thermal
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200H x 150V | 32 | -10°C ~ 60°C | 12µm x 12µm | Module | Thermal | 3.3V ~ 5V | |
Seek Thermal
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200H x 150V | 9 | -10°C ~ 60°C | 12µm x 12µm | Module | Thermal | 3.3V ~ 5V | |
Seek Thermal
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200H x 150V | 32 | -10°C ~ 60°C | 12µm x 12µm | Module | Thermal | 3.3V ~ 5V | |
Seek Thermal
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200H x 150V | 32 | -10°C ~ 60°C | 12µm x 12µm | Module | Thermal | 3.3V ~ 5V | |
Seek Thermal
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200H x 150V | 9 | -10°C ~ 60°C | 12µm x 12µm | Module | Thermal | 3.3V ~ 5V | |
Himax Technologies
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320H x 320V | 51 | -20°C ~ 85°C | 3.6µm x 3.6µm | - | CMOS | 1.5V ~ 2.8V | |
Himax Technologies
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640H x 480V | 60 | -20°C ~ 85°C | 3.6µm x 3.6µm | - | CMOS with Processor | 1.2V ~ 2.8V | |
Himax Technologies
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640H x 480V | 60 | -20°C ~ 85°C | 3.6µm x 3.6µm | - | CMOS with Processor | 1.2V ~ 2.8V | |
OmniVision Technologies Inc
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- | - | - | - | - | - | - | |
Himax Technologies
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640H x 480V | 60 | -20°C ~ 85°C | 3.6µm x 3.6µm | - | CMOS with Processor | 1.2V ~ 2.8V | |
OmniVision Technologies Inc
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640H x 480V | 100 | -30°C ~ 70°C | 3µm x 3µm | 35-CSP3 (3.91x3.41) | CMOS | 2.8V | |
Himax Technologies
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320H x 320V | - | - | 3.6µm x 3.6µm | - | CMOS | 1.5V ~ 2.8V | |
Fresnel Factory Inc.
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- | - | - | - | - | - | - | |
ESPROS Photonics AG
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320H x 240V | 158 | -40°C ~ 85°C | 20µm x 20µm | 68-CSP (9.7x8.66) | CCD | 2.25V ~ 3.63V | |
Seek Thermal
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320H x 240V | 9 | -10°C ~ 60°C | 12µm x 12µm | Module | Thermal | 3.3V ~ 5V | |
Seek Thermal
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320H x 240V | 27 | -10°C ~ 60°C | 12µm x 12µm | Module | Thermal | 3.3V ~ 5V | |
Seek Thermal
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320H x 240V | 9 | -10°C ~ 60°C | 12µm x 12µm | Module | Thermal | 3.3V ~ 5V | |
Seek Thermal
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320H x 240V | 27 | -10°C ~ 60°C | 12µm x 12µm | Module | Thermal | 3.3V ~ 5V | |
SparkFun Electronics
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3280H x 2464V | - | -20°C ~ 60°C | 1.12µm x 1.12µm | - | - | 1.08V ~ 3V | |
Terabee SAS
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- | - | -20°C ~ 75°C | - | - | 3D Time of Flight | 4.75V ~ 5.25V | |
Terabee SAS
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- | - | -20°C ~ 75°C | - | - | 3D Time of Flight | 4.75V ~ 5.25V | |
MELEXIS
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32H x 24V | - | -40°C ~ 85°C | - | TO-39 | Thermal | 2.9V ~ 3.6V | |
Terabee SAS
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- | 240 | - | - | - | 3D Time of Flight | 4.75V ~ 5.25V | |
On Semiconductor
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1280H x 1024V | 150 | -40°C ~ 85°C (TJ) | 4.8µm x 4.8µm | 48-LCC (14.22x14.22) | CMOS | 1.8V, 3.3V | |
Terabee SAS
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- | 240 | - | - | - | 3D Time of Flight | 12V ~ 24V | |
Seek Thermal
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320H x 240V | 9 | -10°C ~ 60°C | 12µm x 12µm | Module | Thermal | 3.3V ~ 5V | |
Seek Thermal
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200H x 150V | 9 | 0°C ~ 65°C | 12µm x 12µm | Module | Thermal | 3.3V ~ 5V | |
Seek Thermal
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200H x 150V | 9 | 0°C ~ 65°C | 12µm x 12µm | Module | Thermal | 3.3V ~ 5V | |
Banner Engineering Corporation
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752H x 480V | 48 | 0°C ~ 50°C | 6µm x 6µm | - | - | - |