What are Motion Sensors - Vibration ?
Motion Sensors - Vibration are devices designed to detect and measure vibrations in their environment. They are commonly used in industrial sensing and monitoring applications, as well as in new product design and prototyping. Important specifications for selection include Sensitivity, which affects the sensor's ability to detect small vibrations; Sensing Range, which determines the range of vibrations the sensor can measure; and Operating Temperature, which ensures the sensor operates effectively in its intended environment. Validating these specifications is crucial for ensuring compatibility with existing systems.
Parts in this category
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| Part & Mfr | Features | Mounting Type | Operating Temperature | Output Type | Power | Sensing Range | Sensitivity | Sensor Type | Termination | |||
|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Amphenol Wilcoxon Sensing Technologies
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- | Chassis Mount | -40°C ~ 105°C | Analog | - | - | - | Vibration | Connector | |
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NI
|
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Coaxial Cable, Integrated Electronic Piezoelectric (IEPE) | Chassis Mount | - | - | - | - | 10mV/g | Accelerometer | - | |
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NI
|
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Coaxial Cable, Integrated Electronic Piezoelectric (IEPE) | Chassis Mount | - | - | - | - | 100mV/g | Accelerometer | - | |
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Amphenol Wilcoxon Sensing Technologies
|
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- | Chassis Mount | -40°C ~ 105°C | Analog | - | - | - | Vibration | Connector | |
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Phoenix Contact
|
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- | Chassis Mount | - | Analog | - | - | - | Accelerometer | Connector | |
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Omron
|
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- | Chassis Mount | -25°C ~ 60°C | Analog | - | - | - | Vibration | Quick Connect - 0.187" (4.7mm) | |
Broadsens Corporation
|
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Intrinsically Safe, Low Power, Waterproof, Wireless | Screw Mount, Magnet, Mounting Hole | -55°C ~ 85°C | Digital | 3.0 V ~ 5.5 V / 350µA | ±2g ~ ±8g | 0.3052mg/LSB | Accelerometer | - | |
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Broadsens Corporation
|
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- | Chassis Mount | -40°C ~ 85°C | - | - | ±2g ~ ±16g | - | Vibration, Acceleration | - | |
Broadsens Corporation
|
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- | Chassis Mount | -40°C ~ 85°C | - | - | ±8g ~ ±64g | - | Vibration, Acceleration | - | |
National Control Devices
|
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- | Chassis Mount | -40°C ~ 105°C | - | - | ±16g | - | Vibration, Acceleration | - | |
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Aaronia AG
|
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- | - | - | - | - | 4Hz ~ 1kHz | - | Vibration | - | |
Electro-Sensors, Inc.
|
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- | Panel Mount | -40°C ~ 80°C | Analog | - | 10Hz ~ 1kHz | - | Vibration | - | |
Beanair GmbH
|
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High Frequency | Chassis Mount | - | LAN, Wireless | - | ±2g | - | Vibration | Connector | |
Beanair GmbH
|
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High Frequency | Chassis Mount | - | LAN, Wireless | - | ±10g | - | Vibration | Connector | |
Beanair GmbH
|
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High Frequency | Chassis Mount | - | LAN, Wireless | - | ±10g | - | Vibration | Connector | |
Beanair GmbH
|
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High Frequency | Chassis Mount | - | - | - | ±1.2g, ±2.4g | - | Vibration | Connector | |
Beanair GmbH
|
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High Frequency | Chassis Mount | - | LAN, Wireless | - | ±2g | - | Vibration | Connector | |
Electro-Sensors, Inc.
|
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- | Chassis Mount | -40°C ~ 65°C | SPDT | 18V ~ 30V / 30mA | ±12g, 10Hz | - | Vibration, Acceleration | - | |
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Omron
|
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- | Through Hole | -30°C ~ 70°C | SPST-NO | 3V, 5µA ~ 3V, 1mA | 90 ~ 170 gal | - | Displacement | PC Pins | |
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Omron
|
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- | Through Hole | -30°C ~ 70°C | SPST-NO | 3V, 5µA ~ 3V, 1mA | 90 ~ 170 gal | - | Displacement | PC Pins | |
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Omron
|
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- | Chassis Mount | -30°C ~ 70°C | SPST-NO | 3V, 5µA ~ 3V, 1mA | 90 ~ 170 gal | - | Displacement | Wire Leads | |
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Omron
|
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- | Chassis Mount | -14°F ~ 158°F | SPDT | 125V, 10A ~ 250V, 10A | 100 ~ 170 gal | - | Displacement | Quick Connect | |
|
Knowles / Syfer
|
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- | Surface Mount | - | Voltage | - | - | -45dB ±4.5dB | Vibration, Acceleration | Solder Pads | |
Parallax Inc.
|
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- | Through Hole | - | Analog | - | - | 50mV/g | Acceleration | PC Pins | |
Analog Devices / Maxim Integrated
|
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Programmable | Screw Mount | -40°C ~ 125°C | Digital | 3.15 V ~ 3.6 V / 43mA | -70 ~ 70 g | 4.768mg/LSB | Vibration, Acceleration | Rectangular Connector - 14 Pos | |
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Mide Technology Corporation
|
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Piezoelectric Vibration Energy Harvesting, Hermetically Sealed | Through Hole | -40°C ~ 90°C | Analog | - | 120Hz ~ 360Hz | - | Acceleration | PC Pins | |
Mide Technology Corporation
|
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Piezoelectric Vibration Energy Harvesting, Hermetically Sealed | Through Hole | -40°C ~ 90°C | Analog | - | 26Hz ~ 110Hz | - | Acceleration | PC Pins | |
Mide Technology Corporation
|
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Piezoelectric Vibration Energy Harvesting, Hermetically Sealed | Through Hole | -40°C ~ 90°C | Analog | - | 80Hz ~ 205Hz | - | Acceleration | PC Pins | |
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Mide Technology Corporation
|
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Piezoelectric Vibration Energy Harvesting, Hermetically Sealed | Through Hole | -40°C ~ 90°C | Analog | - | 45Hz ~ 155Hz | - | Acceleration | PC Pins | |
Mide Technology Corporation
|
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Piezoelectric Vibration Energy Harvesting, Hermetically Sealed | Through Hole | -40°C ~ 90°C | Analog | - | 75Hz ~ 175Hz | - | Acceleration | PC Pins | |
Mide Technology Corporation
|
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Piezoelectric Vibration Energy Harvesting, Hermetically Sealed | Through Hole | -40°C ~ 90°C | Analog | - | 60Hz ~ 140Hz | - | Acceleration | PC Pins | |
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Analog Devices / Maxim Integrated
|
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Programmable | Screw Mount | -40°C ~ 125°C | Digital | 3.15 V ~ 3.6 V / 43mA | -70 ~ 70 g | 1.192mg/LSB | Acceleration | Rectangular Connector - 14 Pos | |
TE Connectivity
|
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- | User Defined | -40°C ~ 140°C | Voltage | - | - | - | Vibration, Acceleration | - | |
|
Analog Devices / Maxim Integrated
|
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Transceiver | Connector | -40°C ~ 125°C | Digital | 3.0 V ~ 3.6 V / 37mA | - | - | Vibration | Threaded | |
Analog Devices / Maxim Integrated
|
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Transceiver | Screw Mount, Mounting Hole | -40°C ~ 125°C | Digital | 3.0 V ~ 3.6 V / 39mA | ±18g | 0.3052mg/LSB | Accelerometer, 2 Axis | Threaded | |
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TE Connectivity
|
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- | - | - | - | - | - | - | - | - | |
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TE Connectivity
|
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- | - | - | - | - | - | - | - | - | |
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Vishay
|
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- | - | - | - | - | - | - | - | - | |
Mide Technology Corporation
|
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Piezoelectric Vibration Energy Harvesting, Hermetically Sealed | Chassis Mount | - | Voltage | - | - | - | Vibration, Piezo Film | Solder Pads | |
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Mide Technology Corporation
|
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Piezoelectric Vibration Energy Harvesting, Hermetically Sealed | Chassis Mount | - | Voltage | - | - | - | Vibration, Piezo Film | Solder Pads | |
Mide Technology Corporation
|
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Piezoelectric Vibration Energy Harvesting, Hermetically Sealed | Chassis Mount | - | Voltage | - | - | - | Vibration, Piezo Film | Solder Pads | |
Mide Technology Corporation
|
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Piezoelectric Vibration Energy Harvesting, Hermetically Sealed | Chassis Mount | - | Voltage | - | - | - | Vibration, Piezo Film | Solder Pads | |
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Panduit Corporation
|
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- | - | - | - | - | - | - | - | - | |
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Panduit Corporation
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Panduit Corporation
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Panduit Corporation
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- | - | - | - | - | - | - | - | - | |
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Advantech Corp
|
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- | Chassis Mount | -50°C ~ 125°C | Voltage | - | 0.3Hz ~ 10kHz | 250mV/g | Accelerometer | - | |
Seeed Technology Co., Ltd
|
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- | - | - | - | - | - | - | - | - | |
TE Connectivity
|
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- | Through Hole | 0°C ~ 85°C | Voltage | - | 0Hz ~ 180Hz | 50mV/g | Vibration | PC Pins | |
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Seeed Technology Co., Ltd
|
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- | - | - | - | - | - | - | - | - |
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