What are Translators, Level Shifters ?
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| Part & Mfr | Total Stock | Pricing & RFQ | Channel Type | Channels per Circuit | Data Rate | ESD Protection | Features | Input Signal | Lead Spacing | Mounting Type | Number of Circuits | Operating Temperature | Output Signal | Output Type | Storage Temperature | Supplier Device Package | Translator Type | Voltage | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology
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Unidirectional | 1 | - | - | - | LVPECL | - | Surface Mount | 1 | -40°C ~ 85°C (TA) | LVTTL | Non-Inverted | - | 8-SOIC | Mixed Signal | - | |
Microchip Technology
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Unidirectional | 2 | - | - | - | LVPECL | - | Surface Mount | 1 | -40°C ~ 85°C (TA) | LVTTL | Non-Inverted | - | 8-SOIC | Mixed Signal | - | |
Microchip Technology
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Unidirectional | 2 | - | - | - | PECL | - | Surface Mount | 1 | -40°C ~ 85°C (TA) | TTL | Non-Inverted | - | 8-SOIC | Mixed Signal | - | |
Analog Devices / Maxim Integrated
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Unidirectional | 4 | 16Mbps | - | Power Supply Decoupling, Thermal-Shutdown Protection | - | - | Surface Mount | 1 | -40°C ~ 85°C (TA) | - | Open Drain, Tri-State | - | 12-UCSP | Voltage Level | 1.2 V ~ 5.5 V | |
Microchip Technology
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Unidirectional | 2 | - | - | - | LVPECL | - | Surface Mount | 1 | -40°C ~ 85°C (TA) | LVTTL | Non-Inverted | - | 8-MLF® (2x2) | Mixed Signal | - | |
Analog Devices / Maxim Integrated
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Unidirectional | 1 | 400kbps | - | - | PECI | - | Surface Mount | 1 | -20°C ~ 150°C (TJ) | I²C | Non-Inverted | - | 10-uMAX/uSOP | Mixed Signal | - | |
Microchip Technology
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Unidirectional | 1 | - | - | - | ECL | - | Surface Mount | 1 | -40°C ~ 85°C (TA) | TTL | Non-Inverted | - | 8-SOIC | Mixed Signal | - | |
Analog Devices / Maxim Integrated
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Unidirectional | 1 | 400kbps | - | - | PECI | - | Surface Mount | 1 | -20°C ~ 150°C (TJ) | I²C | Non-Inverted | - | 10-uMAX/uSOP | Mixed Signal | - | |
Microchip Technology
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Unidirectional | 2 | - | - | - | LVCMOS, LVTTL | - | Surface Mount | 1 | -40°C ~ 85°C (TA) | LVPECL | Differential | - | 8-SOIC | Mixed Signal | - | |
Microchip Technology
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Unidirectional | 1 | 1.5Gbps | - | - | CML, PECL, LVPECL | - | Surface Mount | 1 | -40°C ~ 85°C (TA) | LVDS | Differential | - | 8-MLF® (2x2) | Mixed Signal | - | |
Analog Devices / Maxim Integrated
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Bidirectional | 8 | 50Mbps | - | Auto-Direction Sensing | - | - | Surface Mount | 1 | -40°C ~ 85°C (TA) | - | Tri-State, Non-Inverted | - | 20-WLCSP (2.5x2) | Voltage Level | 1.15 V ~ 5.5 V | |
Microchip Technology
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Unidirectional | 2 | - | - | - | LVPECL, LVTTL | - | Surface Mount | 1 | -40°C ~ 85°C (TA) | LVTTL, LVPECL | Differential, Single-Ended | - | 8-MSOP | Mixed Signal | - | |
Microchip Technology
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Unidirectional | 2 | - | - | - | LVPECL | - | Surface Mount | 1 | -40°C ~ 85°C (TA) | LVTTL | Non-Inverted | - | 8-MSOP | Mixed Signal | - | |
Microchip Technology
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Unidirectional | 2 | - | - | - | LVCMOS, LVTTL | - | Surface Mount | 1 | -40°C ~ 85°C (TA) | LVPECL | Differential | - | 8-MSOP | Mixed Signal | - | |
Microchip Technology
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Unidirectional | 1 | - | - | - | LVCMOS, LVTTL | - | Surface Mount | 1 | -40°C ~ 85°C (TA) | LVPECL | Differential | - | 8-SOIC | Mixed Signal | - | |
NXP Semiconductors
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- | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
Analog Devices / Maxim Integrated
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Bidirectional | 8 | 50Mbps | - | Auto-Direction Sensing | - | - | Surface Mount | 1 | -40°C ~ 85°C (TA) | - | Tri-State, Non-Inverted | - | 20-TSSOP | Voltage Level | 1.15 V ~ 5.5 V | |
Analog Devices / Maxim Integrated
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Bidirectional | 6 | 20Mbps | - | Auto-Direction Sensing, Power Supply Decoupling | - | - | Surface Mount | 1 | -40°C ~ 85°C (TA) | - | Open Drain | - | 16-TSSOP | Voltage Level | 0.9 V ~ 3.6 V | |
Microchip Technology
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Unidirectional | 1 | - | - | - | LVCMOS, LVTTL | - | Surface Mount | 1 | -40°C ~ 85°C (TA) | LVPECL | Differential | - | 8-MSOP | Mixed Signal | - | |
Analog Devices / Maxim Integrated
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Unidirectional | 8 | 35Mbps | - | Power Supply Decoupling | - | - | Surface Mount | 1 | -40°C ~ 85°C (TA) | - | Tri-State, Non-Inverted | - | 20-TSSOP | Voltage Level | 1.2 V ~ 5.5 V | |
Analog Devices / Maxim Integrated
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Bidirectional | 8 | 230kbps | - | Auto-Direction Sensing, Power-Supply Decoupling | - | - | Surface Mount | 1 | -40°C ~ 85°C (TA) | - | Tri-State, Non-Inverted | - | 20-TSSOP | Voltage Level | 1.2 V ~ 5.5 V | |
Microchip Technology
|
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Unidirectional | 1 | - | - | - | LVCMOS, LVTTL | - | Surface Mount | 1 | -40°C ~ 85°C (TA) | LVPECL | Differential | - | 8-MSOP | Mixed Signal | - | |
Analog Devices / Maxim Integrated
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Bidirectional | 1 | - | - | SIM Card Interface, Thermal-Shutdown Protection | - | - | Surface Mount | 1 | -40°C ~ 85°C (TA) | - | Open Drain | - | 16-SSOP | Voltage Level | 1.425 V ~ 4.4 V | |
Analog Devices / Maxim Integrated
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Unidirectional | 1 | 400kbps | - | - | PECI | - | Surface Mount | 1 | -20°C ~ 150°C (TJ) | I²C | Non-Inverted | - | 10-uMAX/uSOP | Mixed Signal | - | |
Renesas
|
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Unidirectional | 1 | - | - | - | HCSL, LVDS, LVHSTL, LVPECL, SSTL | - | Surface Mount | 1 | -40°C ~ 85°C (TA) | LVCMOS, LVTTL | Non-Inverted | - | 8-SOIC | Mixed Signal | - | |
Analog Devices / Maxim Integrated
|
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Unidirectional | 1 | 400kbps | - | - | PECI | - | Surface Mount | 1 | -20°C ~ 150°C (TJ) | I²C | Non-Inverted | - | 10-uMAX/uSOP | Mixed Signal | - | |
Renesas
|
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Unidirectional | 1 | - | - | - | HCSL, LVDS, LVHSTL, LVPECL, SSTL | - | Surface Mount | 1 | -40°C ~ 85°C (TA) | LVCMOS, LVTTL | Non-Inverted | - | 8-SOIC | Mixed Signal | - | |
Analog Devices / Maxim Integrated
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Bidirectional | 6 | 30Mbps | - | Power Supply Decoupling | - | - | Surface Mount | 1 | -40°C ~ 125°C (TA) | - | Open Drain | - | 16-TQFN (4x4) | Voltage Level | 3 V ~ 5.5 V | |
Microchip Technology
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Unidirectional | 2 | - | - | - | LVPECL, LVTTL | - | Surface Mount | 1 | -40°C ~ 85°C (TA) | LVTTL, LVPECL | Differential, Single-Ended | - | 8-MLF® (2x2) | Mixed Signal | - | |
Analog Devices / Maxim Integrated
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Bidirectional | 1 | - | - | SIM Card Interface, Thermal-Shutdown Protection | - | - | Surface Mount | 1 | -40°C ~ 85°C (TA) | - | Open Drain | - | 16-SSOP | Voltage Level | 1.425 V ~ 4.4 V | |
NXP Semiconductors
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- | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
Analog Devices / Maxim Integrated
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Bidirectional | 8 | 100Mbps | - | Power Supply Decoupling | - | - | Surface Mount | 1 | -40°C ~ 85°C (TA) | - | Open Drain, Push-Pull | - | 28-TQFN (3.5x5.5) | Voltage Level | 1.62 V ~ 3.2 V | |
Analog Devices / Maxim Integrated
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Bidirectional | 1 | - | - | SIM Card Interface, Thermal-Shutdown Protection | - | - | Surface Mount | 1 | 0°C ~ 70°C (TA) | - | Open Drain | - | 16-SSOP | Voltage Level | 1.8 V ~ 5.5 V | |
Analog Devices / Maxim Integrated
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Bidirectional | 1 | - | - | SIM Card Interface, Thermal-Shutdown Protection | - | - | Surface Mount | 1 | 0°C ~ 70°C (TA) | - | Open Drain | - | 20-SSOP | Voltage Level | 1.8 V ~ 5.5 V | |
Analog Devices / Maxim Integrated
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Bidirectional | 6 | 100Mbps | - | Power Supply Decoupling | - | - | Surface Mount | 1 | -40°C ~ 85°C (TA) | - | Open Drain, Push-Pull | - | 16-TQFN (4x4) | Voltage Level | 1.62 V ~ 3.2 V | |
Analog Devices / Maxim Integrated
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Bidirectional | 1 | - | - | SIM Card Interface, Thermal-Shutdown Protection | - | - | Surface Mount | 1 | -40°C ~ 85°C (TA) | - | Open Drain | - | 16-SSOP | Voltage Level | 1.8 V ~ 5.5 V | |
Analog Devices / Maxim Integrated
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Bidirectional | 1 | - | - | SIM Card Interface, Thermal-Shutdown Protection | - | - | Surface Mount | 1 | 0°C ~ 70°C (TA) | - | Open Drain | - | 16-SSOP | Voltage Level | 1.8 V ~ 5.5 V | |
On Semiconductor
|
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Unidirectional | 1 | 5Gbps | - | - | CML, HSTL, LVCMOS, LVDS, LVPECL, LVTTL | - | Surface Mount | 1 | -40°C ~ 85°C (TA) | CML | Differential | - | 16-QFN (3x3) | Mixed Signal | - | |
NXP Semiconductors
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Bidirectional | 1 | 10MHz | - | - | - | - | Surface Mount | 1 | -40°C ~ 85°C (TA) | - | Non-Inverted | - | 9-WLCSP (0.92x0.92) | Voltage Level | 1.08 V ~ 1.95 V | |
Analog Devices / Maxim Integrated
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Unidirectional | 2 | - | - | - | LVTTL, TTL | - | Surface Mount | 1 | -40°C ~ 85°C (TA) | LVPECL, PECL | Differential | - | 8-uMAX/uSOP | Mixed Signal | - | |
Analog Devices / Maxim Integrated
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Bidirectional | 1 | - | - | SIM Card Interface, Thermal-Shutdown Protection | - | - | Surface Mount | 1 | 0°C ~ 70°C (TA) | - | Open Drain | - | 20-SSOP | Voltage Level | 1.8 V ~ 5.5 V | |
Analog Devices / Maxim Integrated
|
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Unidirectional | 1 | - | - | - | LVTTL, TTL | - | Surface Mount | 1 | -40°C ~ 85°C (TA) | LVPECL, PECL | Differential | - | 8-SOIC | Mixed Signal | - |