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Telecom

Telecom components facilitate communication by enabling the transmission of signals in electronic devices. Key attributes include Current, Function, and Voltage, which are essential for ensuring compatibility and performance in various applications. These components are commonly used in wireless and RF signal chains for new product design and prototyping.

4,360 active parts
37 manufacturers
25 distributors
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What are Telecom ?

Telecom components are specialized integrated circuits designed for communication applications, particularly in wireless and RF signal processing. They are utilized in various scenarios such as new product design, production electronics assembly, and maintenance. Important specifications for selection include Current, which affects power consumption; Function, which determines the component's role in the circuit; and Voltage, which ensures compatibility with the system's electrical requirements. Procurement teams should validate lifecycle status and consider alternate-source options to mitigate sourcing risks.

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Part & Mfr Total Stock Pricing & RFQ Approval Agency Bandwidth Cable Length Clock Frequency Compliance Current Data Rate Duplex Ethernet Failure Rate Features Frequency Frequency Range Function Gain Height Industrial Grade Interface Lead Spacing Lead Style Length Mounting Type Number of Channels Number of Circuits Number of Pins Number of Ports Operating Temperature Operating Voltage Output Current Output Voltage PSRR Package / Case Power Power (Watts) Power Consumption Power Dissipation Product Type Protocol Quiescent Current Receiver Hysteresis Standards Storage Temperature Supplier Device Package Supplier Package Supply Current Supply Voltage Switch Type Tape & Reel Technology Termination Style Type Voltage Voltage Supply Width
SI3230-E-FT
SI3230-E-FT
Skyworks Solutions
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 - - - - - 88mA - - - - - - - Subscriber Line Interface Concept (SLIC), CODEC - - - SPI - - - Surface Mount - 1 - - - - - - - - - 700 mW - - - - - - - - 38-TSSOP - - - - - - - - 3.13V ~ 5.25V - -
SI3211-E-FT
SI3211-E-FT
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Skyworks Solutions
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 - - - - - 88mA - - - - - - - Subscriber Line Interface Concept (SLIC), CODEC - - - PCM, SPI - - - Surface Mount - 1 - - 0°C ~ 70°C - - - - - - 700 mW - - - - - - - - 38-TSSOP - - - - - - - - 3.3V, 5V - -
XRT83L30IVTR-F
XRT83L30IVTR-F
Maxlinear
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 - - - - - - - - - - - - - Line Interface Unit (LIU) - - - LIU - - - Surface Mount - 1 - - -40°C ~ 85°C - - - - - - - - - - - - - - - 64-LQFP (10x10) - - - - - - - - 3.135V ~ 3.465V - -
PM8324-FEI
PM8324-FEI
Microchip Technology
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 - - - - - - - - - - - - - Framer - - - E1, T1 - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -
SI32292-A-GMR
SI32292-A-GMR
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Skyworks Solutions
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 - - - - - 51.71mA - - - - - - - Subscriber Line Interface Concept (SLIC) - - - 3-Wire, PCM, SPI - - - Surface Mount - 2 - - -40°C ~ 85°C - - - - - - - - - - - - - - - 68-QFN (8x8) - - - - - - - - 3.13V ~ 3.47V - -
CYV15G0404RB-BGXC
CYV15G0404RB-BGXC
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Infineon Technologies
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 - - - - - 900mA - - - - - - - Deserializer - - - LVTTL - - - Surface Mount - 4 - - 0°C ~ 70°C - - - - - - - - - - - - - - - 256-L2BGA (27x27) - - - - - - - - 3.135V ~ 3.465V - -
CYV15G0404DXB-BGXC
CYV15G0404DXB-BGXC
Infineon Technologies
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 - - - - - 900mA - - - - - - - - - - - LVTTL - - - Surface Mount - 4 - - 0°C ~ 70°C - - - - - - - - - - - - - - - 256-L2BGA (27x27) - - - - - - - - 3.135V ~ 3.465V - -
SI32290-A-GMR
SI32290-A-GMR
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Skyworks Solutions
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 - - - - - 51.71mA - - - - - - - Subscriber Line Interface Concept (SLIC) - - - 3-Wire, PCM, SPI - - - Surface Mount - 2 - - -40°C ~ 85°C - - - - - - - - - - - - - - - 68-QFN (8x8) - - - - - - - - 3.13V ~ 3.47V - -
PBL38780/1QSD
PBL38780/1QSD
Infineon Technologies
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 - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -
AK2363
AK2363
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Asahi Kasei Microdevices/AKM
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 - - - - - 3.8mA - - - - - - - DTMF Receiver - - - Serial - - - Surface Mount - 1 - - -40°C ~ 85°C - - - - - - - - - - - - - - - 24-QFNJ (4x4) - - - - - - - - 2.6V ~ 3.7V - -
BCM56242B0IFSBLG
BCM56242B0IFSBLG
Broadcom Limited
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 - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -
CYV15G0201DXB-BBXI
CYV15G0201DXB-BBXI
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Infineon Technologies
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 - - - - - 570µA - - - - - - - Transceiver - - - LVTTL - - - Surface Mount - 2 - - -40°C ~ 85°C - - - - - - - - - - - - - - - 196-FBGA (15x15) - - - - - - - - 3.135V ~ 3.465V - -
XRT5675D-F
XRT5675D-F
Maxlinear
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 - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -
XRT5675DTR-F
XRT5675DTR-F
Maxlinear
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 - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -
XRT5793IV
XRT5793IV
Maxlinear
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 - - - - - - - - - - - - - - - - - LIU - - - Surface Mount - - - - -40°C ~ 85°C - - - - - - - - - - - - - - - 80-TQFP (14x14) - - - - - - - - 4.75V ~ 5.25V - -
XRT5795IV
XRT5795IV
Maxlinear
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 - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -
XRT5897IV
XRT5897IV
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Maxlinear
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 - - - - - - - - - - - - - - - - - LIU - - - Surface Mount - 7 - - -40°C ~ 75°C - - - - - - - - - - - - - - - 100-TQFP (14x14) - - - - - - - - 3.135V ~ 3.465V - -
XRT59L81IG-F
XRT59L81IG-F
Maxlinear
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 - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -
XRT59L81IGTR
XRT59L81IGTR
Maxlinear
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 - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -
XRT71D04IVTR-F
XRT71D04IVTR-F
Maxlinear
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 - - - - - 140mA - - - - - - - Attenuator - - - Serial - - - Surface Mount - 1 - - -40°C ~ 85°C - - - - - - - - - - - - - - - 80-TQFP (14x14) - - - - - - - - 3.135V ~ 5.25V - -
CYV15G0201DXB-BBXC
CYV15G0201DXB-BBXC
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Infineon Technologies
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 - - - - - 570mA - - - - - - - Transceiver - - - LVTTL - - - Surface Mount - 2 - - 0°C ~ 70°C - - - - - - - - - - - - - - - 196-FBGA (15x15) - - - - - - - - 3.135V ~ 3.465V - -
78P2241B-IGT/F
78P2241B-IGT/F
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Analog Devices / Maxim Integrated
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 - - - - - 70mA - - - - - - - Line Interface Unit (LIU) - - - - - - - Surface Mount - 1 - - -40°C ~ 85°C - - - - - - - - - - - - - - - 48-TQFP (9x9) - - - - - - - - 3.3V, 5V - -
XRT59N97IV-F
XRT59N97IV-F
Maxlinear
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 - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -
VSC8530XMW-03
VSC8530XMW-03
Microchip Technology
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 - - - - - - - - - - - - - Ethernet - - - RMII - - - Surface Mount - 1 - - -40°C ~ 125°C - - - - - - - - - - - - - - - 48-QFN (6x6) - - - - - - - - - - -
SI32171-C-GM1
SI32171-C-GM1
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Skyworks Solutions
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 - - - - - - - - - - - - - Subscriber Line Interface Concept (SLIC), CODEC - - - GCI, PCM, SPI - - - Surface Mount - 1 - - -40°C ~ 85°C - - - - - - - - - - - - - - - 42-QFN (5x7) - - - - - - - - 3.3V - -
VSC8531XMW
VSC8531XMW
Microchip Technology
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 - - - - - - - - - - - - - Ethernet - - - RMII - - - Surface Mount - 1 - - -40°C ~ 125°C - - - - - - - - - - - - - - - 48-QFN (6x6) - - - - - - - - - - -
VSC8531XMW-03
VSC8531XMW-03
Microchip Technology
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 - - - - - - - - - - - - - Ethernet - - - RMII - - - Surface Mount - 1 - - -40°C ~ 125°C - - - - - - - - - - - - - - - 48-QFN (6x6) - - - - - - - - - - -
VSC8541XMV
VSC8541XMV
Microchip Technology
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 - - - - - - - - - - - - - Ethernet - - - RMII - - - Surface Mount - 1 - - -40°C ~ 125°C - - - - - - - - - - - - - - - 68-QFN (8x8) - - - - - - - - - - -
VSC8541XMV-03
VSC8541XMV-03
Microchip Technology
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 - - - - - - - - - - - - - Ethernet - - - RMII - - - Surface Mount - 1 - - -40°C ~ 125°C - - - - - - - - - - - - - - - 68-QFN (8x8) - - - - - - - - - - -
VSC8479SK
VSC8479SK
Microchip Technology
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 - - - - - - - - - - - - - Transceiver - - - I²C, SPI - - - Surface Mount - 1 - - -5°C ~ 90°C - - - - - - 1.15 W - - - - - - - - 244-FCBGA (17x17) - - - - - - - - 1.8V - -
VSC8558XHJ
VSC8558XHJ
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Microchip Technology
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 - - - - - 1.488A - - - - - - - Transceiver - - - JTAG, SerDes, Serial - - - Surface Mount - 8 - - 0°C ~ 90°C - - - - - - - - - - - - - - - 444-BGA (27x27) - - - - - - - - 1.14V ~ 1.26V, 3.13V ~ 3.47V - -
MT90826AV2
MT90826AV2
Microchip Technology
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 - - - - - 64mA - - - - - - - Switch - - - - - - - Surface Mount - 4 - - -40°C ~ 85°C - - - - - - - - - - - - - - - 144-LBGA (13x13) - - - - - - - - 3V ~ 3.6V - -
CYV15G0101DXB-BBXI
CYV15G0101DXB-BBXI
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Infineon Technologies
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 - - - - - 390mA - - - - - - - Transceiver - - - LVTTL - - - Surface Mount - - - - -40°C ~ 85°C - - - - - - - - - - - - - - - 100-TBGA (11x11) - - - - - - - - 3.135V ~ 3.465V - -
SI32182-A-GMR
SI32182-A-GMR
Download Datasheet for SI32182-A-GMR
Skyworks Solutions
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 - - - - - - - - - - - - - - - - - 3-Wire - - - Surface Mount - 1 - - -40°C ~ 85°C - - - - - - - - - - - - - - - 36-QFN (5x6) - - - - - - - - 3.3V - -
SI32183-A-FMR
SI32183-A-FMR
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Skyworks Solutions
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 - - - - - - - - - - - - - - - - - 3-Wire - - - Surface Mount - 1 - - 0°C ~ 70°C - - - - - - - - - - - - - - - 36-QFN (5x6) - - - - - - - - 3.3V - -
SI32183-A-GMR
SI32183-A-GMR
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Skyworks Solutions
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 - - - - - - - - - - - - - - - - - 3-Wire - - - Surface Mount - 1 - - -40°C ~ 85°C - - - - - - - - - - - - - - - 36-QFN (5x6) - - - - - - - - 3.3V - -
SI32183-A-GM
SI32183-A-GM
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Skyworks Solutions
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 - - - - - - - - - - - - - - - - - 3-Wire - - - Surface Mount - 1 - - -40°C ~ 85°C - - - - - - - - - - - - - - - 36-QFN (5x6) - - - - - - - - 3.3V - -
ISL1557AIRZ-T7S2705
ISL1557AIRZ-T7S2705
Renesas
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 - - - - - 6mA - - - - - - - Line Interface Unit (LIU) - - - - - - - Surface Mount - 1 - - -40°C ~ 85°C - - - - - - - - - - - - - - - 16-QFN (4x4) - - - - - - - - 4.5V ~ 13.2V - -
VSC8541XMV-01
VSC8541XMV-01
Microchip Technology
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 - - - - - - - - - - - - - Ethernet - - - RMII - - - Surface Mount - 1 - - 0°C ~ 125°C - - - - - - - - - - - - - - - 68-QFN (8x8) - - - - - - - - - - -
AS2524TT
AS2524TT
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Osram
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 - - - - - 3mA - - - - - - - Line Interface Unit (LIU) - - - Serial - - - Surface Mount - 1 - - -25°C ~ 70°C - - - - - - - - - - - - - - - 28-SOIC - - - - - - - - - - -
CYP15G0101DXB-BBXI
CYP15G0101DXB-BBXI
Download Datasheet for CYP15G0101DXB-BBXI
Infineon Technologies
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 - - - - - 390mA - - - - - - - Transceiver - - - LVTTL - - - Surface Mount - - - - -40°C ~ 85°C - - - - - - - - - - - - - - - 100-TBGA (11x11) - - - - - - - - 3.135V ~ 3.465V - -
XRT8220IW-F
XRT8220IW-F
Maxlinear
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 - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -
XRT8220IWTR-F
XRT8220IWTR-F
Maxlinear
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 - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -
XRT83L30ES
XRT83L30ES
Maxlinear
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 - - - - - - - - - - - - - Line Interface Unit (LIU) - - - LIU - - - Surface Mount - 1 - - - - - - - - - - - - - - - - - - 64-LQFP (10x10) - - - - - - - - 3.135V ~ 3.465V - -
SI32284-A-ZM2
SI32284-A-ZM2
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Skyworks Solutions
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 - - - - - 51.71mA - - - - - - - Subscriber Line Interface Concept (SLIC) - - - 3-Wire, PCM, SPI - - - Surface Mount - 2 - - 0°C ~ 70°C - - - - - - - - - - - - - - - 48-QFN (7x7) - - - - - - - - 3.13V ~ 3.47V - -
XRT83VSH316ES
XRT83VSH316ES
Maxlinear
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 - - - - - - - - - - - - - Line Interface Unit (LIU) - - - LIU - - - Surface Mount - 16 - - -40°C ~ 85°C - - - - - - - - - - - - - - - 316-STBGA (21x21) - - - - - - - - 3.14V ~ 3.47V - -
XRT86SH328IB
XRT86SH328IB
Maxlinear
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 - - - - - - - - - - - - - Line Interface Unit (LIU) - - - - - - - - - - - - -40°C ~ 85°C - - - - - - - - - - - - - - - - - - - - - - - - 3.3V - -
XRT86SH328IB-F
XRT86SH328IB-F
Maxlinear
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 - - - - - - - - - - - - - Line Interface Unit (LIU) - - - - - - - - - - - - -40°C ~ 85°C - - - - - - - - - - - - - - - - - - - - - - - - 3.3V - -
XRT86VX38AIB256-F
XRT86VX38AIB256-F
Maxlinear
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 - - - - - - - - - - - - - Line Interface Unit (LIU) - - - - - - - Surface Mount - - - - -40°C ~ 85°C - - - - - - - - - - - - - - - 256-FPBGA (17x17) - - - - - - - - 3.3V - -
HC9P-5509B-9
HC9P-5509B-9
Harris Semiconductor
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 - - - - - - - - - - - - - Subscriber Line Interface Concept (SLIC) - - - 2-Wire, 4-Wire - - - Surface Mount - 1 - - -40°C ~ 85°C - - - - - - 200 mW - - - - - - - - 28-SOIC - - - - - - - - -42V ~ -58V, 4.75V ~ 5.25V - -
Showing 3751-3800 of 4,360 products

About Telecom

The Telecom category within Integrated Circuits (ICs) > Interface offers a specialized selection of components that are essential for wireless and RF signal chains. These components are crucial for applications such as new product design, prototyping, and production electronics assembly.

When sourcing Telecom integrated circuits, it is important to focus on key attributes such as Current, Function, Interface, Mounting Type, Number of Circuits, Operating Temperature, Power (Watts), Supplier Device Package, and Voltage. These specifications will guide you in selecting the right components that meet your design requirements.

Applications for Telecom components include maintenance and field replacement, engineering evaluation, and procurement-driven multi-sourcing. Understanding these applications will help you make informed decisions when comparing different components.

Before submitting a Request for Quotation (RFQ), ensure that you validate the lifecycle status of the components and explore alternate-source options. Confirming mechanical and electrical compatibility with your existing design constraints is also critical to reduce sourcing risks.

Utilize parametric filtering to prioritize specifications over brand preferences, ensuring that you find the most suitable components for your needs. This approach will streamline your procurement process and enhance your sourcing efficiency.

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