What are Analog Switches - Special Purpose ?
Analog Switches - Special Purpose are specialized components designed to control the flow of analog signals within electronic circuits. They are commonly used in applications such as wireless communication, RF signal chains, and production electronics assembly. Important specifications for selection include Operating Temperature, which affects performance stability; Number of Channels, which determines the complexity of signal routing; and Voltage, which ensures compatibility with circuit requirements. Sourcing teams should validate lifecycle status and consider alternate-source options to mitigate supply chain risks.
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| Part & Mfr | Applications | Features | Mounting Type | Multiplexer | Number of Channels | On | Operating Temperature | Supplier Device Package | Switch Circuit | Voltage | ||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Analog Devices / Maxim Integrated
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70MHz | Video | Buffered, SPI | Surface Mount | 32:16 | 1 | - | -40°C ~ 85°C (TA) | 144-TQFP (20x20) | - | ±3V ~ 5V | |
Analog Devices / Maxim Integrated
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70MHz | Video | Buffered, SPI | Surface Mount | 32:16 | 1 | - | -40°C ~ 85°C (TA) | 128-LQFP (14x20) | - | ±3V ~ 5V | |
Analog Devices / Maxim Integrated
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70MHz | Video | Buffered, SPI | Surface Mount | 32:16 | 1 | - | -40°C ~ 85°C (TA) | 128-LQFP (14x20) | - | ±3V ~ 5V | |
Analog Devices / Maxim Integrated
|
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110MHz | Video | Buffered, SPI | Surface Mount | 16:16 | 1 | - | -40°C ~ 85°C (TA) | 128-LQFP (14x20) | - | ±3V ~ 5V | |
Analog Devices / Maxim Integrated
|
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70MHz | Video | Buffered, SPI | Surface Mount | 32:16 | 1 | - | -40°C ~ 85°C (TA) | 144-TQFP (20x20) | - | ±3V ~ 5V | |
Broadcom Limited
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- | PCI Express® | Configurable | Surface Mount | - | 4 | - | - | 128-TQFP (14x14) | - | - | |
Analog Devices / Maxim Integrated
|
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65MHz | Video | Bi-Directional, Buffered, T-Switch Configuration | Surface Mount | 8:8 | 1 | - | -40°C ~ 85°C (TA) | 44-PLCC (16.59x16.59) | - | ±4.5V ~ 5.5V | |
Analog Devices / Maxim Integrated
|
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65MHz | Video | Bi-Directional, Buffered, T-Switch Configuration | Surface Mount | 8:8 | 1 | - | 0°C ~ 70°C (TA) | 44-PLCC (16.59x16.59) | - | ±4.5V ~ 5.5V | |
Analog Devices / Maxim Integrated
|
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65MHz | Video | Bi-Directional, Buffered, T-Switch Configuration | Surface Mount | 4:4 | 1 | - | -40°C ~ 85°C (TA) | 24-SOIC | - | ±4.5V ~ 5.5V | |
Analog Devices / Maxim Integrated
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600MHz | Video | Buffered, RGB | Surface Mount | 32:32 | 1 | - | -40°C ~ 85°C (TA) | 304-BGA-ED (31x31) | - | ±2.5V | |
Analog Devices / Maxim Integrated
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600MHz | Video | Buffered, RGB | Surface Mount | 32:32 | 1 | - | -40°C ~ 85°C (TA) | 304-BGA-ED (31x31) | - | ±2.5V | |
Analog Devices / Maxim Integrated
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- | Video | TMDS, HDMI, DVI, Buffered | Surface Mount | 2:1 | 4 | - | -40°C ~ 85°C (TA) | 32-LFCSP (5x5) | - | 3V ~ 3.6V | |
Microchip Technology
|
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- | Networking | - | Surface Mount | 2:1 | 2 | - | -40°C ~ 85°C (TA) | 16-MLF® (3x3) | - | 1.2V, 1.8V, 2.5V | |
Analog Devices / Maxim Integrated
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35MHz | Video | Break-Before-Make, Buffers, T-Switch Configuration | Through Hole | 8:8 | 1 | - | -40°C ~ 85°C (TA) | 40-PDIP | - | - | |
Analog Devices / Maxim Integrated
|
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35MHz | Video | Break-Before-Make, Buffers, T-Switch Configuration | Surface Mount | 8:8 | 1 | - | 0°C ~ 70°C (TA) | 44-PLCC (16.59x16.59) | - | - | |
Analog Devices / Maxim Integrated
|
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35MHz | Video | Break-Before-Make, Buffers, T-Switch Configuration | Surface Mount | 8:8 | 1 | - | -40°C ~ 85°C (TA) | 44-PLCC (16.59x16.59) | - | - | |
Analog Devices / Maxim Integrated
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180MHz | Video | Break-Before-Make, SPI, T-Switch Configration | Surface Mount | 4:1 | 2 | 60Ohm | -40°C ~ 85°C (TA) | 28-SSOP | - | ±2.7V ~ 6V | |
Analog Devices / Maxim Integrated
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- | Audio, Video | Break-Before-Make, Clickless, I²C | Surface Mount | 4:2 | 2 | 80Ohm | 0°C ~ 70°C (TA) | 28-SOIC | - | ±2.7V ~ 5.5V | |
|
Analog Devices / Maxim Integrated
|
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- | Force Sense | - | Surface Mount | - | 2 | 6Ohm | 0°C ~ 70°C (TA) | 16-SOIC | 3PST | ±4.5V ~ 20V | |
Analog Devices / Maxim Integrated
|
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- | Audio | Break-Before-Make | Through Hole | 8:1 | 1 | 350Ohm | 0°C ~ 70°C (TA) | 20-PDIP | - | ±4.5V ~ 20V | |
Microchip Technology
|
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- | Ultrasound | - | Surface Mount | 1:1 | 16 | 38Ohm | 0°C ~ 70°C (TA) | 48-LQFP (7x7) | SPST | ±40V ~ 160V | |
Analog Devices / Maxim Integrated
|
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350MHz | Video | Bi-Directional, T-Switch Configuration | Through Hole | 1:1 | 4 | 60Ohm | 0°C ~ 70°C (TA) | 20-PDIP | SPST | ±2.7V ~ 6V | |
Analog Devices / Maxim Integrated
|
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300MHz | Video | Bi-Directional, T-Switch Configuration | Through Hole | 1:1 | 4 | 20Ohm | -40°C ~ 85°C (TA) | 20-PDIP | SPST | ±2.7V ~ 6V | |
Analog Devices / Maxim Integrated
|
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350MHz | Telecommunications | T1/E1 | Surface Mount | 2:1 | 2 | 5Ohm | -40°C ~ 85°C (TA) | 16-TQFN (5x5) | SPDT | ±3.3V ~ 5V | |
Analog Devices / Maxim Integrated
|
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550MHz | Telecommunications | T1/E1 | Surface Mount | 1:1 | 4 | 5Ohm | -40°C ~ 85°C (TA) | 16-TQFN (5x5) | SPST | ±3.3V ~ 5V | |
Analog Devices / Maxim Integrated
|
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550MHz | Telecommunications | T1/E1 | Surface Mount | 1:1 | 4 | 5Ohm | -40°C ~ 85°C (TA) | 16-TQFN (5x5) | SPST | ±3.3V ~ 5V | |
Analog Devices / Maxim Integrated
|
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550MHz | Telecommunications | T1/E1 | Surface Mount | 1:1 | 4 | 5Ohm | -40°C ~ 85°C (TA) | 16-TQFN (5x5) | SPST | ±3.3V ~ 5V | |
Analog Devices / Maxim Integrated
|
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300MHz | Video | Bi-Directional, T-Switch Configuration | Surface Mount | 1:1 | 4 | 20Ohm | -40°C ~ 85°C (TA) | 20-SOIC | SPST | ±2.7V ~ 6V | |
Analog Devices / Maxim Integrated
|
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27MHz | Audio | Break-Before-Make, Clickless | Surface Mount | 2:1 | 2 | 850mOhm | -40°C ~ 85°C (TA) | 10-uMAX/uSOP | SPDT | 1.8V ~ 5.5V | |
Analog Devices / Maxim Integrated
|
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135MHz | Audio, USB | Break-Before-Make, USB 1.1, USB 2.0 | Surface Mount | 2:1 | 2 | 9Ohm | -40°C ~ 85°C (TA) | 16-TQFN (3x3) | SPDT | 2V ~ 5.5V | |
Analog Devices / Maxim Integrated
|
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300MHz | Audio, Video | Break-Before-Make, SPI | Surface Mount | 4:1 | 1 | 65Ohm | -40°C ~ 85°C (TA) | 10-uMAX/uSOP | - | 2.7V ~ 5.5V | |
Analog Devices / Maxim Integrated
|
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35MHz | Video | Break-Before-Make, Buffers, T-Switch Configuration | Surface Mount | 8:8 | 1 | - | -40°C ~ 85°C (TA) | 44-PLCC (16.59x16.59) | - | - | |
Analog Devices / Maxim Integrated
|
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35MHz | Video | Break-Before-Make, Buffers, T-Switch Configuration | Surface Mount | 8:8 | 1 | - | 0°C ~ 70°C (TA) | 44-PLCC (16.59x16.59) | - | - | |
Analog Devices / Maxim Integrated
|
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- | Audio, Video | Break-Before-Make, Clickless, I²C | Surface Mount | 4:2 | 2 | 80Ohm | 0°C ~ 70°C (TA) | 28-SOIC | - | ±2.7V ~ 5.5V | |
Analog Devices / Maxim Integrated
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300MHz | Video | Bi-Directional, T-Switch Configuration | Surface Mount | 1:1 | 4 | 20Ohm | 0°C ~ 70°C (TA) | 20-SOIC | SPST | ±2.7V ~ 6V | |
Analog Devices / Maxim Integrated
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250MHz | Audio, Video | Break-Before-Make, I²C | Surface Mount | 3:2 | 3 | 35Ohm | -40°C ~ 85°C (TA) | 36-SSOP | - | 2.7V ~ 5.5V | |
Analog Devices / Maxim Integrated
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150MHz | Audio, Video | Clickless, I²C | Surface Mount | 1:1 | 11 | 35Ohm | 0°C ~ 70°C (TA) | 28-SSOP | SPST | 2.7V ~ 5.25V | |
Analog Devices / Maxim Integrated
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- | Audio, Video | Break-Before-Make, Clickless, I²C | Surface Mount | 4:2 | 2 | 80Ohm | 0°C ~ 70°C (TA) | 28-SSOP | - | ±2.7V ~ 5.5V | |
Analog Devices / Maxim Integrated
|
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180MHz | Video | Break-Before-Make, SPI, T-Switch Configration | Surface Mount | 4:1 | 2 | 60Ohm | 0°C ~ 70°C (TA) | 28-SSOP | - | ±2.7V ~ 6V | |
Analog Devices / Maxim Integrated
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- | Audio | Differential Compatibility | Surface Mount | 4:1 | 2 | 75Ohm | -40°C ~ 85°C (TA) | 20-SSOP | - | ±2.7V ~ 6V | |
|
Analog Devices / Maxim Integrated
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300MHz | Video | Bi-Directional, Break-Before-Make, T-Switch Configuration | Surface Mount | 2:1 | 2 | 20Ohm | -40°C ~ 85°C (TA) | 16-SOIC | SPDT | ±2.7V ~ 6V | |
|
Analog Devices / Maxim Integrated
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- | Force Sense | Break-Before-Make | Surface Mount | 2:1 | 3 | 6Ohm | -40°C ~ 85°C (TA) | 16-SOIC | SPDT | ±4.5V ~ 20V | |
|
Analog Devices / Maxim Integrated
|
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- | Force Sense | - | Surface Mount | - | 2 | 6Ohm | 0°C ~ 70°C (TA) | 16-SOIC | 3PST | ±4.5V ~ 20V | |
Analog Devices / Maxim Integrated
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300MHz | Video | Bi-Directional, Break-Before-Make, T-Switch Configuration | Surface Mount | 2:1 | 2 | 20Ohm | -40°C ~ 85°C (TA) | 16-QSOP | SPDT | ±2.7V ~ 6V | |
|
Analog Devices / Maxim Integrated
|
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300MHz | Video | Bi-Directional, Break-Before-Make, T-Switch Configuration | Surface Mount | 2:1 | 2 | 20Ohm | 0°C ~ 70°C (TA) | 16-SOIC | SPDT | ±2.7V ~ 6V | |
Analog Devices / Maxim Integrated
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300MHz | Video | Bi-Directional, Buffered, T-Switch Configuration | Surface Mount | 1:1 | 1 | 120Ohm | -40°C ~ 85°C (TA) | 8-SOIC | SPST | ±2.7V ~ 6V | |
Analog Devices / Maxim Integrated
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- | Audio | Break-Before-Make, Clickless | Surface Mount | 2:1 | 2 | 950mOhm | -40°C ~ 85°C (TA) | 10-uDFN (2x2) | SPDT | 1.8V ~ 5.5V | |
Analog Devices / Maxim Integrated
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- | Audio | Break-Before-Make, Clickless | Surface Mount | 2:1 | 2 | 950mOhm | -40°C ~ 85°C (TA) | 10-uDFN (2x2) | SPDT | 1.8V ~ 5.5V | |
Analog Devices / Maxim Integrated
|
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550MHz | Telecommunications | T1/E1 | Surface Mount | 1:1 | 4 | 5Ohm | -40°C ~ 85°C (TA) | 16-TQFN (5x5) | SPST | ±3.3V ~ 5V | |
Analog Devices / Maxim Integrated
|
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550MHz | Telecommunications | T1/E1 | Surface Mount | 1:1 | 4 | 5Ohm | -40°C ~ 85°C (TA) | 16-TQFN (5x5) | SPST | ±3.3V ~ 5V |
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