What are Microprocessors ?
Microprocessors are integrated circuits that serve as the central processing unit (CPU) in embedded systems, executing instructions and managing data flow. They are widely used in applications such as production electronics assembly and maintenance. Important specifications for selection include the Core Processor, which determines processing power; the Number of Cores, which affects multitasking capabilities; and Operating Temperature, which ensures reliability in various environments. Procurement teams should validate lifecycle status and consider alternate-source options to mitigate sourcing risks.
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| Part & Mfr | Co | Core Processor | Display & Interface Controllers | Ethernet | Frequency | Function | Graphics Acceleration | Mounting Type | Number of Cores | Operating Temperature | Output Type | RAM Controllers | SATA | Security Features | Speed | Supplier Device Package | USB | Voltage | |||
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Freescale Semiconductor
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NXP Semiconductors
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NXP Semiconductors
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Freescale Semiconductor
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Freescale Semiconductor
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Freescale Semiconductor
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Freescale Semiconductor
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Freescale Semiconductor
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Intel
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- | Intel® Core i5-3427U Processor | - | - | - | - | Yes | Surface Mount | 2 Core, 64-Bit | 105°C (TJ) | - | DDR3, DDR3L | - | AES, SecureKey | 1.8GHz | 1023-FCBGA (31x24) | - | - | |
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Intel
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- | Intel® Core i3-3110M Processor | - | - | - | - | Yes | Through Hole | 2 Core, 64-Bit | 90°C (TJ) | - | DDR3, DDR3L | - | - | 2.4GHz | 988-FCPGA (37.5x37.5) | - | - | |
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Intel
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- | Intel® Core i3-3227U Processor | - | - | - | - | Yes | Surface Mount | 2 Core, 64-Bit | 105°C (TJ) | - | DDR3, DDR3L | - | - | 1.9GHz | 1023-FCBGA (31x24) | - | - | |
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Rochester Electronics
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- | ARM® Cortex®-A53 | - | 1GbE (7) or 10GbE (1) & 1GbE (5) | - | - | No | Surface Mount | 4 Core, 64-Bit | -40°C ~ 105°C | - | DDR3L, DDR4 | SATA 6Gbps (1) | Secure Boot, TrustZone® | 1.0GHz | 621-FCPBGA (21x21) | USB 3.0 (3) + PHY | - | |
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NXP Semiconductors
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ARM® Cortex®-M4 | ARM® Cortex®-A53 | APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU | GbE | - | - | No | Surface Mount | - | -40°C ~ 105°C (TA) | - | DDR3, DDR3L, LPDDR2 | - | AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG | 1GHz | 621-FCPBGA (17x17) | - | 1V, 1.8V, 3.3V | |
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Rochester Electronics
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- | PowerPC 750FX | - | - | - | - | No | Surface Mount | 1 Core, 32-Bit | -40°C ~ 105°C (TJ) | - | - | - | - | 733MHz | 292-CBGA (21x21) | - | 2.5V | |
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NXP Semiconductors
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- | PowerPC e500 | - | 10/100/1000Mbps (3) | - | - | No | Surface Mount | 1 Core, 32-Bit | -40°C ~ 105°C (TA) | - | DDR2, DDR3 | SATA 3Gbps (2) | - | 1.5GHz | 783-FCPBGA (29x29) | USB 2.0 (3) | 1.8V, 2.5V, 3.3V | |
Freescale Semiconductor
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Multimedia; NEON SIMD | ARM® Cortex®-A7 | LVDS | 10/100Mbps (1) | - | - | No | Surface Mount | 1 Core, 32-Bit | 0°C ~ 95°C (TJ) | - | LPDDR2, DDR3, DDR3L | - | ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS | 528MHz | 289-MAPBGA (14x14) | USB 2.0 + PHY (1) | 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V | |
NXP Semiconductors
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Communications; RISC CPM | PowerPC G2 | - | 10/100Mbps (3) | - | - | No | Surface Mount | 1 Core, 32-Bit | -40°C ~ 105°C (TA) | - | DRAM, SDRAM | - | - | 266MHz | 480-TBGA (37.5x37.5) | - | 3.3V | |
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Nexperia USA Inc.
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Communications; RISC CPM | PowerPC G2_LE | - | 10/100Mbps (3) | - | - | No | Surface Mount | 1 Core, 32-Bit | 0°C ~ 105°C (TJ) | - | DRAM, SDRAM | - | - | 300MHz | 480-TBGA (37.5x37.5) | USB 2.0 (1) | 3.3V | |
NXP Semiconductors
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Communications; QUICC Engine | PowerPC e300c3 | - | 10/100Mbps (3) | - | - | No | Surface Mount | 1 Core, 32-Bit | 0°C ~ 105°C (TA) | - | DDR2 | - | - | 200MHz | 369-PBGA (19x19) | USB 2.0 (1) | 1.8V, 3.3V | |
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NXP Semiconductors
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Communications; RISC CPM | PowerPC G2 | - | 10/100Mbps (3) | - | - | No | Surface Mount | 1 Core, 32-Bit | -40°C ~ 105°C (TJ) | - | DRAM, SDRAM | - | - | 266MHz | 480-TBGA (37.5x37.5) | - | 3.3V | |
Texas Instruments
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- | - | - | - | 2.5MHz | Step-Down | - | Surface Mount | - | -40°C ~ 85°C (TA) | Adjustable (Programmable) | - | - | - | - | 16-DSBGA (2.24x2.16) | - | 2.5V | |
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Renesas
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Multimedia; NEON SIMD | ARM® Cortex®-A53 | - | GbE (1) | - | - | No | Surface Mount | 2 Core, 64-Bit | -40°C ~ 125°C (TJ) | - | LPDDR4 | - | - | - | 841-FBGA (15x15) | - | 1.8V, 3.3V | |
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Renesas
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Multimedia; NEON SIMD | ARM® Cortex®-A53 | - | GbE (1) | - | - | No | Surface Mount | 2 Core, 64-Bit | -40°C ~ 125°C (TJ) | - | LPDDR4 | - | - | - | 841-FBGA (15x15) | - | 1.8V, 3.3V | |
Renesas
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- | ARM® Cortex®-A57 | DU | 10/100Mbps (1), 100/1000Mbps (1) | - | - | No | Surface Mount | 2 Core, 64-Bit | -40°C ~ 85°C (TA) | - | LPDDR4 | - | - | 1.5GHz | 1022-FPBGA | USB (2) | 0.82V, 1.8V, 3.3V | |
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Renesas
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Multimedia; NEON SIMD | ARM® Cortex®-A53 | - | GbE (1) | - | - | Yes | Surface Mount | 2 Core, 64-Bit | -40°C ~ 125°C (TJ) | - | LPDDR4 | - | - | - | 841-FBGA (15x15) | - | 1.8V, 3.3V | |
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Zilog
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- | Z8S180 | - | - | - | - | No | Surface Mount | 1 Core, 8-Bit | -40°C ~ 100°C (TA) | - | DRAM | - | - | 20MHz | 68-PLCC | - | 5.0V | |
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Renesas
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Renesas
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NXP Semiconductors
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Multimedia; NEON SIMD | ARM® Cortex®-A9 | HDMI, Keypad, LCD, LVDS, MIPI/CSI, MIPI/DSI | 10/100/1000Mbps (1) | - | - | Yes | Surface Mount | 2 Core, 32-Bit | -40°C ~ 125°C (TJ) | - | DDR3, DDR3L, LPDDR2 | SATA 3Gbps (1) | ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS | 1GHz | 624-FCBGA (21x21) | USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1) | 1.8V, 2.5V, 2.8V, 3.3V | |
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Renesas
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- | ARM® Cortex®-A15 | - | - | - | - | - | - | - | -40°C ~ 85°C (TA) | - | - | - | - | 1.5GHz | - | - | - | |
Renesas
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Renesas
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Renesas
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Microchip Technology
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- | - | - | - | - | - | - | - | 1 Core, 64-Bit | - | - | DDR, SDRAM | - | - | 466MHz | - | - | 2.5V, 3.3V | |
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Broadcom Limited
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NXP Semiconductors
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Multimedia; NEON | ARM® Cortex®-A53, ARM® Cortex®-M7 | - | - | - | - | No | Surface Mount | - | -40°C ~ 105°C (TA) | - | - | - | - | - | 525-FCPBGA (19x19) | USB 2.0 OTG (1) | 1.8V, 3.3V | |
NXP Semiconductors
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Multimedia; NEON | ARM® Cortex®-A53, ARM® Cortex®-M7 | - | - | - | - | No | Surface Mount | - | -40°C ~ 105°C (TA) | - | - | - | - | - | 525-FCPBGA (19x19) | USB 2.0 OTG (1) | 1.8V, 3.3V | |
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Microchip Technology
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- | - | - | - | - | - | - | - | 1 Core, 64-Bit | - | - | DDR, SDRAM | - | - | 600MHz | - | - | 2.5V, 3.3V | |
NXP Semiconductors
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Multimedia; NEON | ARM® Cortex®-A53, ARM® Cortex®-M7 | - | - | - | - | No | Surface Mount | - | -40°C ~ 105°C (TA) | - | - | - | - | - | 525-FCPBGA (19x19) | USB 2.0 OTG (1) | 1.8V, 3.3V | |
Renesas
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Broadcom Limited
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Intel
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Data; Microengine | StrongARM | - | - | - | - | No | Surface Mount | 1 Core, 32-Bit | 0°C ~ 70°C (TA) | - | SDRAM | - | - | 166MHz | 432-BGA (40x40) | - | 3.3V | |
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Broadcom Limited
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