What are Microprocessors ?
Microprocessors are integrated circuits that serve as the central processing unit (CPU) in embedded systems, executing instructions and managing data flow. They are widely used in applications such as production electronics assembly and maintenance. Important specifications for selection include the Core Processor, which determines processing power; the Number of Cores, which affects multitasking capabilities; and Operating Temperature, which ensures reliability in various environments. Procurement teams should validate lifecycle status and consider alternate-source options to mitigate sourcing risks.
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| Part & Mfr | Co | Core Processor | Display & Interface Controllers | Ethernet | Graphics Acceleration | Mounting Type | Number of Cores | Operating Temperature | RAM Controllers | Security Features | Speed | Supplier Device Package | USB | Voltage | |||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
NXP Semiconductors
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Communications; CPM | MPC8xx | - | 10Mbps (1) | No | Surface Mount | 1 Core, 32-Bit | 0°C ~ 95°C (TA) | DRAM | - | 66MHz | 256-PBGA (23x23) | USB 1.x (1) | 3.3V | |
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Communications; CPM | MPC8xx | - | 10Mbps (1) | No | Surface Mount | 1 Core, 32-Bit | 0°C ~ 95°C (TA) | DRAM | - | 80MHz | 256-PBGA (23x23) | USB 1.x (1) | 3.3V | |
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Communications; CPM | MPC8xx | - | 10Mbps (1) | No | Surface Mount | 1 Core, 32-Bit | 0°C ~ 95°C (TA) | DRAM | - | 66MHz | 256-PBGA (23x23) | USB 1.x (1) | 3.3V | |
NXP Semiconductors
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Communications; CPM | MPC8xx | - | 10Mbps (1) | No | Surface Mount | 1 Core, 32-Bit | 0°C ~ 95°C (TA) | DRAM | - | 80MHz | 256-PBGA (23x23) | USB 1.x (1) | 3.3V | |
NXP Semiconductors
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Communications; CPM | CPU32+ | - | 10Mbps (1) | No | Surface Mount | 1 Core, 32-Bit | 0°C ~ 70°C (TA) | DRAM | - | 25MHz | 357-PBGA (25x25) | - | 5.0V | |
Texas Instruments
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Signal Processing; C55x, System Control; CP15 | ARM926EJ-S | Keyboard, LCD | - | No | Surface Mount | 1 Core, 32-Bit | -40°C ~ 85°C (TC) | LPDDR | Cryptography, Random Number Generator | 192MHz | 289-BGA MICROSTAR (12x12) | USB 1.1 (1), USB 1.x (2) | 1.8V, 2.75V, 3.3V | |
NXP Semiconductors
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- | EC000 | - | - | No | Surface Mount | 1 Core, 32-Bit | 0°C ~ 70°C (TA) | - | - | 16MHz | 68-PLCC (24.21x24.21) | - | 5.0V | |
NXP Semiconductors
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Communications; RISC CPM | M68000 | - | - | No | Surface Mount | 1 Core, 8/16-Bit | 0°C ~ 70°C (TA) | DRAM | - | 20MHz | 100-LQFP (14x14) | - | 3.3V | |
NXP Semiconductors
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Communications; RISC CPM | M68000 | - | - | No | Surface Mount | 1 Core, 8/16-Bit | -40°C ~ 85°C (TA) | DRAM | - | 16MHz | 100-LQFP (14x14) | - | 5.0V | |
NXP Semiconductors
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Communications; RISC CPM | M68000 | - | - | No | Surface Mount | 1 Core, 8/16-Bit | 0°C ~ 70°C (TA) | DRAM | - | 16MHz | 144-LQFP (20x20) | - | 5.0V | |
NXP Semiconductors
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Communications; RISC CPM | M68000 | - | - | No | Surface Mount | 1 Core, 8/16-Bit | 0°C ~ 70°C (TA) | DRAM | - | 16MHz | 144-LQFP (20x20) | - | 3.3V | |
NXP Semiconductors
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Communications; RISC CPM | M68000 | - | - | No | Surface Mount | 1 Core, 8/16-Bit | 0°C ~ 70°C (TA) | DRAM | - | 20MHz | 144-LQFP (20x20) | - | 5.0V | |
NXP Semiconductors
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Communications; RISC CPM | M68000 | - | - | No | Surface Mount | 1 Core, 8/16-Bit | 0°C ~ 70°C (TA) | DRAM | - | 25MHz | 144-LQFP (20x20) | - | 5.0V | |
NXP Semiconductors
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Communications; RISC CPM | M68000 | - | - | No | Surface Mount | 1 Core, 8/16-Bit | 0°C ~ 70°C (TA) | DRAM | - | 16MHz | 132-PQFP (46x46) | - | 5.0V | |
NXP Semiconductors
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Communications; RISC CPM | M68000 | - | - | No | Surface Mount | 1 Core, 8/16-Bit | 0°C ~ 70°C (TA) | DRAM | - | 25MHz | 132-PQFP (46x46) | - | 5.0V | |
NXP Semiconductors
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Communications; CPM | CPU32+ | - | 10Mbps (1) | No | Surface Mount | 1 Core, 32-Bit | 0°C ~ 70°C (TA) | DRAM | - | 33MHz | 240-FQFP (32x32) | - | 5.0V | |
NXP Semiconductors
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Communications; CPM | CPU32+ | - | 10Mbps (1) | No | Surface Mount | 1 Core, 32-Bit | -40°C ~ 85°C (TA) | DRAM | - | 25MHz | 240-FQFP (32x32) | - | 5.0V | |
NXP Semiconductors
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Communications; CPM | CPU32+ | - | 10Mbps (1) | No | Surface Mount | 1 Core, 32-Bit | 0°C ~ 70°C (TA) | DRAM | - | 33MHz | 357-PBGA (25x25) | - | 5.0V | |
NXP Semiconductors
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Communications; RISC CPM | M68000 | - | 10Mbps (1) | No | Surface Mount | 1 Core, 8/16-Bit | 0°C ~ 70°C (TA) | DRAM | - | 25MHz | 144-LQFP (20x20) | - | 5.0V | |
NXP Semiconductors
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Communications; CPM | CPU32+ | - | 10Mbps (1) | No | Surface Mount | 1 Core, 32-Bit | 0°C ~ 70°C (TA) | DRAM | - | 33MHz | 240-FQFP (32x32) | - | 5.0V | |
NXP Semiconductors
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Communications; CPM | CPU32+ | - | 10Mbps (1) | No | Surface Mount | 1 Core, 32-Bit | -40°C ~ 85°C (TA) | DRAM | - | 25MHz | 240-FQFP (32x32) | - | 5.0V | |
|
NXP Semiconductors
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Communications; CPM | CPU32+ | - | 10Mbps (1) | No | Through Hole | 1 Core, 32-Bit | 0°C ~ 70°C (TA) | DRAM | - | 33MHz | 241-PGA (47.24x47.24) | - | 5.0V | |
NXP Semiconductors
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Communications; CPM | CPU32+ | - | 10Mbps (1) | No | Surface Mount | 1 Core, 32-Bit | 0°C ~ 70°C (TA) | DRAM | - | 25MHz | 357-PBGA (25x25) | - | 3.3V | |
NXP Semiconductors
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Communications; CPM | CPU32+ | - | 10Mbps (1) | No | Surface Mount | 1 Core, 32-Bit | 0°C ~ 70°C (TA) | DRAM | - | 33MHz | 357-PBGA (25x25) | - | 5.0V | |
NXP Semiconductors
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Communications; CPM | CPU32+ | - | 10Mbps (1) | No | Surface Mount | 1 Core, 32-Bit | 0°C ~ 70°C (TA) | DRAM | - | 33MHz | 357-PBGA (25x25) | - | 5.0V | |
NXP Semiconductors
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Communications; RISC CPM | M68000 | - | - | No | Surface Mount | 1 Core, 8/16-Bit | 0°C ~ 70°C (TA) | DRAM | - | 16MHz | 100-LQFP (14x14) | - | 5.0V | |
NXP Semiconductors
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Communications; RISC CPM | M68000 | - | - | No | Surface Mount | 1 Core, 8/16-Bit | 0°C ~ 70°C (TA) | DRAM | - | 20MHz | 100-LQFP (14x14) | - | 5.0V | |
NXP Semiconductors
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Communications; RISC CPM | M68000 | - | - | No | Surface Mount | 1 Core, 8/16-Bit | 0°C ~ 70°C (TA) | DRAM | - | 25MHz | 100-LQFP (14x14) | - | 5.0V | |
NXP Semiconductors
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Communications; CPM | CPU32+ | - | 10Mbps (1) | No | Surface Mount | 1 Core, 32-Bit | 0°C ~ 70°C (TA) | DRAM | - | 33MHz | 240-FQFP (32x32) | - | 5.0V | |
|
NXP Semiconductors
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Communications; CPM | CPU32+ | - | 10Mbps (1) | No | Through Hole | 1 Core, 32-Bit | 0°C ~ 70°C (TA) | DRAM | - | 33MHz | 241-PGA (47.24x47.24) | - | 5.0V | |
NXP Semiconductors
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Communications; CPM | CPU32+ | - | 10Mbps (1) | No | Surface Mount | 1 Core, 32-Bit | 0°C ~ 70°C (TA) | DRAM | - | 25MHz | 357-PBGA (25x25) | - | 3.3V | |
NXP Semiconductors
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Communications; CPM | CPU32+ | - | 10Mbps (1) | No | Surface Mount | 1 Core, 32-Bit | 0°C ~ 70°C (TA) | DRAM | - | 33MHz | 357-PBGA (25x25) | - | 5.0V | |
NXP Semiconductors
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Communications; CPM | CPU32+ | - | 10Mbps (1) | No | Surface Mount | 1 Core, 32-Bit | 0°C ~ 70°C (TA) | DRAM | - | 25MHz | 357-PBGA (25x25) | - | 3.3V | |
NXP Semiconductors
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Communications; CPM | CPU32+ | - | 10Mbps (1) | No | Surface Mount | 1 Core, 32-Bit | 0°C ~ 70°C (TA) | DRAM | - | 33MHz | 357-PBGA (25x25) | - | 5.0V | |
NXP Semiconductors
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- | PowerPC G4 | - | - | No | Surface Mount | 1 Core, 32-Bit | 0°C ~ 105°C (TA) | - | - | 500MHz | 360-FCCLGA (25x25) | - | 1.8V, 2.5V, 3.3V | |
NXP Semiconductors
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Multimedia; SIMD | PowerPC G4 | - | - | No | Surface Mount | 1 Core, 32-Bit | 0°C ~ 105°C (TA) | - | - | 1.167GHZ | 360-FCCBGA (25x25) | - | 1.8V, 2.5V | |
NXP Semiconductors
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Multimedia; SIMD | PowerPC G4 | - | - | No | Surface Mount | 1 Core, 32-Bit | 0°C ~ 105°C (TA) | - | - | 1.42GHz | 360-FCCBGA (25x25) | - | 1.8V, 2.5V | |
NXP Semiconductors
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Multimedia; SIMD | PowerPC G4 | - | - | No | Surface Mount | 1 Core, 32-Bit | 0°C ~ 105°C (TA) | - | - | 1.42GHz | 360-FCCLGA (25x25) | - | 1.8V, 2.5V | |
NXP Semiconductors
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Multimedia; SIMD | PowerPC G4 | - | - | No | Surface Mount | 1 Core, 32-Bit | 0°C ~ 105°C (TA) | - | - | 1.0GHz | 360-FCCBGA (25x25) | - | 1.8V, 2.5V | |
NXP Semiconductors
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Multimedia; SIMD | PowerPC G4 | - | - | No | Surface Mount | 1 Core, 32-Bit | 0°C ~ 105°C (TA) | - | - | 1.42GHz | 360-FCCBGA (25x25) | - | 1.8V, 2.5V | |
NXP Semiconductors
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Multimedia; SIMD | PowerPC G4 | - | - | No | Surface Mount | 1 Core, 32-Bit | 0°C ~ 105°C (TA) | - | - | 1.4GHz | 360-FCCBGA (25x25) | - | 1.5V, 1.8V, 2.5V | |
NXP Semiconductors
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Multimedia; SIMD | PowerPC G4 | - | - | No | Surface Mount | 1 Core, 32-Bit | 0°C ~ 105°C (TA) | - | - | 1.7GHz | 360-FCCBGA (25x25) | - | 1.5V, 1.8V, 2.5V | |
NXP Semiconductors
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Multimedia; SIMD | PowerPC G4 | - | - | No | Surface Mount | 1 Core, 32-Bit | 0°C ~ 105°C (TA) | - | - | 1.4GHz | 360-FCCLGA (25x25) | - | 1.5V, 1.8V, 2.5V | |
NXP Semiconductors
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Multimedia; SIMD | PowerPC G4 | - | - | No | Surface Mount | 1 Core, 32-Bit | 0°C ~ 105°C (TA) | - | - | 1.7GHz | 360-FCCLGA (25x25) | - | 1.5V, 1.8V, 2.5V | |
NXP Semiconductors
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Multimedia; SIMD | PowerPC G4 | - | - | No | Surface Mount | 1 Core, 32-Bit | 0°C ~ 105°C (TA) | - | - | 1.4GHz | 360-FCCBGA (25x25) | - | 1.5V, 1.8V, 2.5V | |
NXP Semiconductors
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Multimedia; SIMD | PowerPC G4 | - | - | No | Surface Mount | 1 Core, 32-Bit | 0°C ~ 105°C (TA) | - | - | 1.7GHz | 360-FCCBGA (25x25) | - | 1.5V, 1.8V, 2.5V | |
NXP Semiconductors
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Multimedia; SIMD | PowerPC G4 | - | - | No | Surface Mount | 1 Core, 32-Bit | 0°C ~ 105°C (TA) | - | - | 1.0GHz | 483-FCCBGA (29x29) | - | 1.5V, 1.8V, 2.5V | |
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Multimedia; SIMD | PowerPC G4 | - | - | No | Surface Mount | 1 Core, 32-Bit | 0°C ~ 105°C (TA) | - | - | 1.267GHz | 483-FCCBGA (29x29) | - | 1.5V, 1.8V, 2.5V | |
NXP Semiconductors
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Multimedia; SIMD | PowerPC G4 | - | - | No | Surface Mount | 1 Core, 32-Bit | 0°C ~ 105°C (TA) | - | - | 1.0GHz | 483-FCCBGA (29x29) | - | 1.5V, 1.8V, 2.5V | |
NXP Semiconductors
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Multimedia; SIMD | PowerPC G4 | - | - | No | Surface Mount | 1 Core, 32-Bit | 0°C ~ 105°C (TA) | - | - | 1.267GHz | 483-FCCBGA (29x29) | - | 1.5V, 1.8V, 2.5V |
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