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Microprocessors

Microprocessors facilitate the processing of data in embedded systems, serving as the core component for various electronic applications. Key attributes include Core Processor, Number of Cores, and Operating Temperature, which are critical for performance and compatibility. These components are essential for new product design and prototyping, ensuring efficient operation in diverse environments.

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What are Microprocessors ?

Microprocessors are integrated circuits that serve as the central processing unit (CPU) in embedded systems, executing instructions and managing data flow. They are widely used in applications such as production electronics assembly and maintenance. Important specifications for selection include the Core Processor, which determines processing power; the Number of Cores, which affects multitasking capabilities; and Operating Temperature, which ensures reliability in various environments. Procurement teams should validate lifecycle status and consider alternate-source options to mitigate sourcing risks.

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Part & Mfr Total Stock Pricing & RFQ Access Time Architecture Clock Frequency Co Communications Connectivity Core Processor Core Size Dimensions Display & Interface Controllers Display Type Ethernet Failure Rate Features Frequency Function GPIO Graphics Acceleration Halogen Free Height Industrial Grade Interface Lead Spacing Lead Style Length Memory Interface Memory Size Memory Type Mounting Style Mounting Type Number of Bits Number of Cores Number of Pins Number of Positions Operating System Operating Temperature Operating Temperature Range Operating Voltage Oscillator Type PLL Package / Case Package Quantity Peripherals Pitch Power Consumption Power Dissipation Processor Type Program Memory Size Program Memory Type RAM Controllers RAM Size SATA SVHC Present Security Features Serial Interfaces Speed Storage Temperature Supplier Device Package Supplier Package Supply Voltage Tape & Reel Technology Termination Style USB Voltage Voltage Supply Watchdog Timer Weight Width
Z8L18020VSG00TR
Z8L18020VSG00TR
Zilog
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 - - - - - - Z8L180 - - - - - - - - - - No - - - - - - - - - - - Surface Mount - 1 Core, 8-Bit - - - 0°C ~ 70°C (TA) - - - - - - - - - - - - - DRAM - - - - - 20MHz - 68-PLCC (24.23x24.23) - - - - - - 3.3V - - - -
Z8S18020VSG00TR
Z8S18020VSG00TR
Zilog
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 - - - - - - Z8S180 - - - - - - - - - - No - - - - - - - - - - - Surface Mount - 1 Core, 8-Bit - - - 0°C ~ 70°C (TA) - - - - - - - - - - - - - DRAM - - - - - 20MHz - 68-PLCC (24.23x24.23) - - - - - - 5V - - - -
Z8018006VEG00TR
Z8018006VEG00TR
Zilog
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 - - - - - - Z80180 - - - - - - - - - - No - - - - - - - - - - - Surface Mount - 1 Core, 8-Bit - - - -40°C ~ 85°C (TA) - - - - - - - - - - - - - DRAM - - - - - 6MHz - 68-PLCC (24.23x24.23) - - - - - - 5V - - - -
Z8S18020VEG00TR
Z8S18020VEG00TR
Zilog
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 - - - - - - Z8S180 - - - - - - - - - - No - - - - - - - - - - - Surface Mount - 1 Core, 8-Bit - - - -40°C ~ 85°C (TA) - - - - - - - - - - - - - DRAM - - - - - 20MHz - 68-PLCC (24.23x24.23) - - - - - - 5V - - - -
Z8S18020VSG1960TR
Z8S18020VSG1960TR
Zilog
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 - - - - - - Z8S180 - - - - - - - - - - No - - - - - - - - - - - Surface Mount - 1 Core, 8-Bit - - - 0°C ~ 70°C (TA) - - - - - - - - - - - - - DRAM - - - - - 20MHz - 68-PLCC (24.23x24.23) - - - - - - 5V - - - -
Z8018010FEG00TR
Z8018010FEG00TR
Zilog
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 - - - - - - Z80180 - - - - - - - - - - No - - - - - - - - - - - Surface Mount - 1 Core, 8-Bit - - - -40°C ~ 85°C (TA) - - - - - - - - - - - - - DRAM - - - - - 10MHz - 80-QFP (20x14) - - - - - - 5V - - - -
AM5718AZBOXEM
AM5718AZBOXEM
Texas Instruments
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 - - - DSP, BB2D, IPU, IVA, GPU, VPE - - ARM® Cortex®-A15 - - - - - - - - - - Yes - - - - - - - - - - - Surface Mount - 1 Core, 32-Bit - - - -55°C ~ 125°C - - - - - - - - - - - - - DDR3, DDR3L - SATA 3Gbps (1) - - - 1.5GHz - 780-FCBGA (23x23) - - - - - USB 2.0 (2), USB 3.0 (2) + PHY (2) 1.8V, 3.3V - - - -
R7S721020VLFP#AA0
R7S721020VLFP#AA0
Renesas
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 - - - Multimedia; NEON™ MPE - - ARM® Cortex®-A9 - - VDC - 10/100Mbps - - - - - Yes - - - - - - - - - - - Surface Mount - 1 Core, 32-Bit - - - -40°C ~ 85°C (TA) - - - - - - - - - - - - - SDRAM, SRAM - - - - - 400MHz - 176-LFQFP (24x24) - - - - - USB 2.0 (2) 1.2V, 3.3V - - - -
R7S721020VLFP#AA1
R7S721020VLFP#AA1
Renesas
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 - - - Multimedia; NEON™ MPE - - ARM® Cortex®-A9 - - VDC - 10/100Mbps - - - - - Yes - - - - - - - - - - - Surface Mount - 1 Core, 32-Bit - - - -40°C ~ 85°C (TA) - - - - - - - - - - - - - SDRAM, SRAM - - - - - 400MHz - 176-LFQFP (24x24) - - - - - USB 2.0 (2) 1.2V, 3.3V - - - -
BCM58713DB0KFEB20G
BCM58713DB0KFEB20G
Broadcom Limited
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 - - - ARM® Cortex™-R7 - - ARM® Cortex®-A57 - - - - 10GbE (2), 2.5GbE (2), RGMII - - - - - Yes - - - - - - - - - - - - - 4 Core, 64-Bit - - - - - - - - - - - - - - - - - DDR3, DDR3L, DDR4 - SATA 6Gbps (2) - ARM TZ, Secure Boot, Secure Key Storage, Tamper Protection - 2GHz - - - - - - - USB 2.0 (1), USB 3.0 (2) - - - - -
AT91SAM9261B-CU-240
AT91SAM9261B-CU-240
Microchip Technology
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 - - - System Control; CP15 - - ARM926EJ-S - - LCD - - - - - - - Yes - - - - - - - - - - - Surface Mount - 1 Core, 32-Bit - - - -40°C ~ 85°C (TA) - - - - - - - - - - - - - SDRAM - - - - - 190MHz - 217-LFBGA (15x15) - - - - - USB 2.0 (2) - - - - -
BCM58303B3IFEB10G
BCM58303B3IFEB10G
Broadcom Limited
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 - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -
NS486SXL-25
NS486SXL-25
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Texas Instruments
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 - - - - - - Intel486 SX - - - - - - - - - - No - - - - - - - - - - - Surface Mount - 1 Core, 32-Bit - - - 0°C ~ 70°C (TA) - - - - - - - - - - - - - DRAM - - - - - 25MHz - 132-PQFP (24.13x24.13) - - - - - - 5.0V - - - -
MPC603RRX300LC
MPC603RRX300LC
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NXP Semiconductors
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 - - - - - - PowerPC 603e - - - - - - - - - - No - - - - - - - - - - - Surface Mount - 1 Core, 32-Bit - - - 0°C ~ 105°C (TA) - - - - - - - - - - - - - - - - - - - 300MHz - 255-FCCBGA (21x21) - - - - - - 3.3V - - - -
MC68HC000FN16R2
MC68HC000FN16R2
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NXP Semiconductors
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 - - - - - - EC000 - - - - - - - - - - No - - - - - - - - - - - Surface Mount - 1 Core, 32-Bit - - - 0°C ~ 70°C (TA) - - - - - - - - - - - - - - - - - - - 16MHz - 68-PLCC (24.21x24.21) - - - - - - 5.0V - - - -
MC68EN360EM25VL
MC68EN360EM25VL
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 - - - Communications; CPM - - CPU32+ - - - - 10Mbps (1) - - - - - No - - - - - - - - - - - Surface Mount - 1 Core, 32-Bit - - - 0°C ~ 70°C (TA) - - - - - - - - - - - - - DRAM - - - - - 25MHz - 240-FQFP (32x32) - - - - - - 3.3V - - - -
MC68EN360ZP25VL
MC68EN360ZP25VL
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 - - - Communications; CPM - - CPU32+ - - - - 10Mbps (1) - - - - - No - - - - - - - - - - - Surface Mount - 1 Core, 32-Bit - - - 0°C ~ 70°C (TA) - - - - - - - - - - - - - DRAM - - - - - 25MHz - 357-PBGA (25x25) - - - - - - 3.3V - - - -
MC68LC060RC66
MC68LC060RC66
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NXP Semiconductors
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 - - - - - - 68060 - - - - - - - - - - No - - - - - - - - - - - Through Hole - 1 Core, 32-Bit - - - 0°C ~ 70°C (TA) - - - - - - - - - - - - - - - - - - - 66MHz - 206-PGA (47.25x47.25) - - - - - - 3.3V - - - -
MC68SEC000FU16
MC68SEC000FU16
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NXP Semiconductors
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 - - - - - - EC000 - - - - - - - - - - No - - - - - - - - - - - Surface Mount - 1 Core, 32-Bit - - - 0°C ~ 70°C (TA) - - - - - - - - - - - - - - - - - - - 16MHz - 64-QFP (14x14) - - - - - - 3.3V, 5.0V - - - -
MC68LC302PU25CT
MC68LC302PU25CT
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NXP Semiconductors
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 - - - Communications; RISC CPM - - M68000 - - - - - - - - - - No - - - - - - - - - - - Surface Mount - 1 Core, 8/16-Bit - - - 0°C ~ 70°C (TA) - - - - - - - - - - - - - DRAM - - - - - 25MHz - 100-LQFP (14x14) - - - - - - 5.0V - - - -
MC68306FC16B
MC68306FC16B
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NXP Semiconductors
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 - - - - - - EC000 - - - - - - - - - - No - - - - - - - - - - - Surface Mount - 1 Core, 32-Bit - - - 0°C ~ 70°C (TA) - - - - - - - - - - - - - DRAM - - - - - 16MHz - 132-PQFP (24.13x24.13) - - - - - - 5.0V - - - -
MC68EC040RC25A
MC68EC040RC25A
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NXP Semiconductors
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 - - - - - - 68040 - - - - - - - - - - No - - - - - - - - - - - Through Hole - 1 Core, 32-Bit - - - 0°C ~ 70°C (TA) - - - - - - - - - - - - - - - - - - - 25MHz - 179-PGA (47.24x47.24) - - - - - - 5.0V - - - -
MC68302PV25C
MC68302PV25C
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NXP Semiconductors
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 - - - Communications; RISC CPM - - M68000 - - - - - - - - - - No - - - - - - - - - - - Surface Mount - 1 Core, 8/16-Bit - - - 0°C ~ 70°C (TA) - - - - - - - - - - - - - DRAM - - - - - 25MHz - 144-LQFP (20x20) - - - - - - 5.0V - - - -
MC68EC060RC66
MC68EC060RC66
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NXP Semiconductors
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 - - - - - - 68060 - - - - - - - - - - No - - - - - - - - - - - Through Hole - 1 Core, 32-Bit - - - 0°C ~ 70°C (TA) - - - - - - - - - - - - - - - - - - - 66MHz - 206-PGA (47.25x47.25) - - - - - - 3.3V - - - -
MC68EC040FE33A
MC68EC040FE33A
Download Datasheet for MC68EC040FE33A
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 - - - - - - 68040 - - - - - - - - - - No - - - - - - - - - - - Surface Mount - 1 Core, 32-Bit - - - 0°C ~ 70°C (TA) - - - - - - - - - - - - - - - - - - - 33MHz - 184-CQFP (31.3x31.3) - - - - - - 5.0V - - - -
MC68360EM25VL
MC68360EM25VL
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NXP Semiconductors
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 - - - Communications; CPM - - CPU32+ - - - - 10Mbps (1) - - - - - No - - - - - - - - - - - Surface Mount - 1 Core, 32-Bit - - - 0°C ~ 70°C (TA) - - - - - - - - - - - - - DRAM - - - - - 25MHz - 240-FQFP (32x32) - - - - - - 3.3V - - - -
MC68EC040RC33A
MC68EC040RC33A
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 - - - - - - 68040 - - - - - - - - - - No - - - - - - - - - - - Through Hole - 1 Core, 32-Bit - - - 0°C ~ 70°C (TA) - - - - - - - - - - - - - - - - - - - 33MHz - 179-PGA (47.24x47.24) - - - - - - 5.0V - - - -
MC68340FT25E
MC68340FT25E
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NXP Semiconductors
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 - - - - - - CPU32 - - - - - - - - - - No - - - - - - - - - - - Surface Mount - 1 Core, 32-Bit - - - 0°C ~ 70°C (TA) - - - - - - - - - - - - - DRAM - - - - - 25MHz - 144-QFP (28x28) - - - - - - 5.0V - - - -
MC68340FT16E
MC68340FT16E
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NXP Semiconductors
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 - - - - - - CPU32 - - - - - - - - - - No - - - - - - - - - - - Surface Mount - 1 Core, 32-Bit - - - 0°C ~ 70°C (TA) - - - - - - - - - - - - - DRAM - - - - - 16MHz - 144-QFP (28x28) - - - - - - 5.0V - - - -
MC68EC060RC50
MC68EC060RC50
Download Datasheet for MC68EC060RC50
NXP Semiconductors
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 - - - - - - 68060 - - - - - - - - - - No - - - - - - - - - - - Through Hole - 1 Core, 32-Bit - - - 0°C ~ 70°C (TA) - - - - - - - - - - - - - - - - - - - 50MHz - 206-PGA (47.25x47.25) - - - - - - 3.3V - - - -
MC68020RC25E
MC68020RC25E
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NXP Semiconductors
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 - - - - - - 68020 - - - - - - - - - - No - - - - - - - - - - - Through Hole - 1 Core, 32-Bit - - - 0°C ~ 70°C (TA) - - - - - - - - - - - - - - - - - - - 25MHz - 114-PGA (34.55x34.55) - - - - - - 5.0V - - - -
MCF5206FT16A
MCF5206FT16A
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NXP Semiconductors
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 - - - - - - Coldfire V2 - - - - - - - - - - - - - - - - - - - - - - Surface Mount - 1 Core, 32-Bit - - - 0°C ~ 70°C (TA) - - - - - - - - - - - - - DRAM - - - - - 16MHz - 160-QFP (28x28) - - - - - - 5V - - - -
MCF5206FT25A
MCF5206FT25A
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 - - - - - - Coldfire V2 - - - - - - - - - - - - - - - - - - - - - - Surface Mount - 1 Core, 32-Bit - - - 0°C ~ 70°C (TA) - - - - - - - - - - - - - DRAM - - - - - 25MHz - 160-QFP (28x28) - - - - - - 5V - - - -
MCF5206FT33A
MCF5206FT33A
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 - - - - - - Coldfire V2 - - - - - - - - - - - - - - - - - - - - - - Surface Mount - 1 Core, 32-Bit - - - 0°C ~ 70°C (TA) - - - - - - - - - - - - - DRAM - - - - - 33MHz - 160-QFP (28x28) - - - - - - 5V - - - -
M68LC302CPU16VCT
M68LC302CPU16VCT
Download Datasheet for M68LC302CPU16VCT
NXP Semiconductors
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 - - - Communications; RISC CPM - - M68000 - - - - - - - - - - No - - - - - - - - - - - Surface Mount - 1 Core, 8/16-Bit - - - -40°C ~ 85°C (TA) - - - - - - - - - - - - - DRAM - - - - - 166MHz - 100-LQFP (14x14) - - - - - - 3.3V - - - -
M68LC302CPU20VCT
M68LC302CPU20VCT
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NXP Semiconductors
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 - - - Communications; RISC CPM - - M68000 - - - - - - - - - - No - - - - - - - - - - - Surface Mount - 1 Core, 8/16-Bit - - - -40°C ~ 85°C (TA) - - - - - - - - - - - - - DRAM - - - - - 20MHz - 100-LQFP (14x14) - - - - - - 3.3V - - - -
MC68302PV33C
MC68302PV33C
Download Datasheet for MC68302PV33C
NXP Semiconductors
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 - - - Communications; RISC CPM - - M68000 - - - - - - - - - - No - - - - - - - - - - - Surface Mount - 1 Core, 8/16-Bit - - - 0°C ~ 70°C (TA) - - - - - - - - - - - - - DRAM - - - - - 33MHz - 144-LQFP (20x20) - - - - - - 5.0V - - - -
MC68MH360EM25L
MC68MH360EM25L
NXP Semiconductors
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 - - - Communications; CPM - - CPU32+ - - - - 10Mbps (1) - - - - - No - - - - - - - - - - - Surface Mount - 1 Core, 32-Bit - - - 0°C ~ 70°C (TA) - - - - - - - - - - - - - DRAM - - - - - 25MHz - 240-FQFP (32x32) - - - - - - 5.0V - - - -
MC68EN360CEM25L
MC68EN360CEM25L
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NXP Semiconductors
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 - - - Communications; CPM - - CPU32+ - - - - 10Mbps (1) - - - - - No - - - - - - - - - - - Surface Mount - 1 Core, 32-Bit - - - -40°C ~ 85°C (TA) - - - - - - - - - - - - - DRAM - - - - - 25MHz - 240-FQFP (32x32) - - - - - - 5.0V - - - -
MC68EN360ZP25L
MC68EN360ZP25L
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NXP Semiconductors
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 - - - Communications; CPM - - CPU32+ - - - - 10Mbps (1) - - - - - No - - - - - - - - - - - Surface Mount - 1 Core, 32-Bit - - - 0°C ~ 70°C (TA) - - - - - - - - - - - - - DRAM - - - - - 25MHz - 357-PBGA (25x25) - - - - - - 5.0V - - - -
MC68LC302CPU16CT
MC68LC302CPU16CT
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NXP Semiconductors
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 - - - Communications; RISC CPM - - M68000 - - - - - - - - - - No - - - - - - - - - - - Surface Mount - 1 Core, 8/16-Bit - - - -40°C ~ 85°C (TA) - - - - - - - - - - - - - DRAM - - - - - 16MHz - 100-LQFP (14x14) - - - - - - 5.0V - - - -
MC68LC302CPU20CT
MC68LC302CPU20CT
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NXP Semiconductors
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 - - - Communications; RISC CPM - - M68000 - - - - - - - - - - No - - - - - - - - - - - Surface Mount - 1 Core, 8/16-Bit - - - -40°C ~ 85°C (TA) - - - - - - - - - - - - - DRAM - - - - - 20MHz - 100-LQFP (14x14) - - - - - - 5.0V - - - -
MC68LC302PU20VCT
MC68LC302PU20VCT
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 - - - Communications; RISC CPM - - M68000 - - - - - - - - - - No - - - - - - - - - - - Surface Mount - 1 Core, 8/16-Bit - - - 0°C ~ 70°C (TA) - - - - - - - - - - - - - DRAM - - - - - 20MHz - 100-LQFP (14x14) - - - - - - 3.3V - - - -
MPC8264AZUPIBB
MPC8264AZUPIBB
Download Datasheet for MPC8264AZUPIBB
NXP Semiconductors
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 - - - Communications; RISC CPM - - PowerPC G2 - - - - 10/100Mbps (3) - - - - - No - - - - - - - - - - - Surface Mount - 1 Core, 32-Bit - - - 0°C ~ 105°C (TA) - - - - - - - - - - - - - DRAM, SDRAM - - - - - 300MHz - 480-TBGA (37.5x37.5) - - - - - - 3.3V - - - -
MPC852TVR100
MPC852TVR100
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NXP Semiconductors
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 - - - Communications; CPM - - MPC8xx - - - - 10Mbps (1) - - - - - No - - - - - - - - - - - Surface Mount - 1 Core, 32-Bit - - - 0°C ~ 95°C (TA) - - - - - - - - - - - - - DRAM - - - - - 100MHz - 256-PBGA (23x23) - - - - - - 3.3V - - - -
MPC852TVR66
MPC852TVR66
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NXP Semiconductors
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 - - - Communications; CPM - - MPC8xx - - - - 10Mbps (1) - - - - - No - - - - - - - - - - - Surface Mount - 1 Core, 32-Bit - - - 0°C ~ 95°C (TA) - - - - - - - - - - - - - DRAM - - - - - 66MHz - 256-PBGA (23x23) - - - - - - 3.3V - - - -
OMAP5910JGZG2
OMAP5910JGZG2
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Texas Instruments
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 - - - Signal Processing; C55x, System Control; CP15 - - ARM9TDMI - - Keypad, LCD - - - - - - - No - - - - - - - - - - - Surface Mount - 1 Core, 32-Bit - - - -40°C ~ 85°C (TC) - - - - - - - - - - - - - SDRAM - - - - - 150MHz - 289-BGA MICROSTAR (12x12) - - - - - USB 2.0 (2) 1.8V, 2.75V, 3.3V - - - -
MCF5206EFT54
MCF5206EFT54
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NXP Semiconductors
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 - - - - - - Coldfire V2 - - - - - - - - - - - - - - - - - - - - - - Surface Mount - 1 Core, 32-Bit - - - 0°C ~ 70°C (TA) - - - - - - - - - - - - - DRAM - - - - - 54MHz - 160-QFP (28x28) - - - - - - 3.3V - - - -
MCF5206ECFT40
MCF5206ECFT40
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 - - - - - - Coldfire V2 - - - - - - - - - - - - - - - - - - - - - - Surface Mount - 1 Core, 32-Bit - - - -40°C ~ 85°C (TA) - - - - - - - - - - - - - DRAM - - - - - 40MHz - 160-QFP (28x28) - - - - - - 3.3V - - - -
MC68340PV16VE
MC68340PV16VE
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 - - - - - - CPU32 - - - - - - - - - - No - - - - - - - - - - - Surface Mount - 1 Core, 32-Bit - - - 0°C ~ 70°C (TA) - - - - - - - - - - - - - DRAM - - - - - 16MHz - 144-LQFP (20x20) - - - - - - 3.3V - - - -
Showing 6351-6400 of 6,454 products

About Microprocessors

Microprocessors serve as the core processing units in embedded systems, playing a crucial role in various applications such as new product design, prototyping, and production electronics assembly. These components are designed to execute instructions and manage data flow, making them integral to the functionality of electronic devices.

When sourcing microprocessors, it is important to consider key attributes such as core processor type, number of cores, operating temperature, and mounting type. These specifications directly impact the performance and compatibility of the microprocessor with existing designs. Additionally, understanding the lifecycle status of the components and exploring alternate-source options can mitigate sourcing risks.

Applications for microprocessors include engineering evaluation and qualification, maintenance and field replacement, and procurement-driven multi-sourcing. Buyers should prioritize parametric filtering based on critical specifications before brand preference to ensure optimal selection for their projects.

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