What are Microcontrollers, Microprocessor, FPGA Modules ?
Microcontrollers, Microprocessor, FPGA Modules are integrated circuits designed to manage and control electronic devices. They are commonly used in embedded control systems, new product design, and production electronics assembly. Important specifications for selection include Core Processor, which determines processing power; Flash Size, which affects data storage capacity; and Operating Temperature, which ensures reliability under specific environmental conditions. Validating lifecycle status and exploring alternate-source options are crucial for procurement teams to mitigate sourcing risks.
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| Part & Mfr | Co | Connector Type | Core Processor | Flash Size | Module | Operating Temperature | RAM Size | Size | Speed | |||
|---|---|---|---|---|---|---|---|---|---|---|---|---|
System-On-Chip (SOC) Technologies
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- | SO-DIMM-204 | Artix-7 A200T | 32MB | FPGA Core | 0°C ~ 85°C | 256KB | 2.700" L x 2.000" W (68.00mm x 51.00mm) | - | |
System-On-Chip (SOC) Technologies
|
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- | SO-DIMM-204 | Artix-7 A200T | 32MB | FPGA Core | 0°C ~ 85°C | 256KB | 2.700" L x 2.000" W (68.00mm x 51.00mm) | - | |
System-On-Chip (SOC) Technologies
|
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- | SO-DIMM-204 | Artix-7 A200T | 32MB | FPGA Core | 0°C ~ 85°C | 256KB | 2.700" L x 2.000" W (68.00mm x 51.00mm) | - | |
System-On-Chip (SOC) Technologies
|
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- | SO-DIMM-204 | Artix-7 A200T | 32MB | FPGA Core | 0°C ~ 85°C | 256KB | 2.700" L x 2.000" W (68.00mm x 51.00mm) | - | |
System-On-Chip (SOC) Technologies
|
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- | SO-DIMM-204 | Artix-7 A200T | 32MB | FPGA Core | 0°C ~ 85°C | 256KB | 2.700" L x 2.000" W (68.00mm x 51.00mm) | - | |
System-On-Chip (SOC) Technologies
|
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- | SO-DIMM-204 | Artix-7 A200T | 32MB | FPGA Core | 0°C ~ 85°C | 256KB | 2.700" L x 2.000" W (68.00mm x 51.00mm) | - | |
System-On-Chip (SOC) Technologies
|
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- | SO-DIMM-204 | Artix-7 A200T | 32MB | FPGA Core | 0°C ~ 85°C | 256KB | 2.700" L x 2.000" W (68.00mm x 51.00mm) | - | |
System-On-Chip (SOC) Technologies
|
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- | SO-DIMM-204 | Artix-7 A200T | 32MB | FPGA Core | 0°C ~ 85°C | 256KB | 2.700" L x 2.000" W (68.00mm x 51.00mm) | - | |
System-On-Chip (SOC) Technologies
|
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- | SO-DIMM-204 | Artix-7 A200T | 32MB | FPGA Core | 0°C ~ 85°C | 256KB | 2.700" L x 2.000" W (68.00mm x 51.00mm) | - | |
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Trenz Electronic
|
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- | Samtec LSHM | Artix-7 A100T | 32MB | FPGA Core | 0°C ~ 70°C | 1GB | 1.970" L x 1.570" W (50.00mm x 40.00mm) | 200MHz | |
Trenz Electronic
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- | Samtec LSHM | Artix-7 A200T | 32MB | FPGA Core | 0°C ~ 70°C | 1GB | 1.970" L x 1.570" W (50.00mm x 40.00mm) | 200MHz | |
Trenz Electronic
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- | - | - | - | - | - | - | - | - | |
Trenz Electronic
|
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- | B2B | Zynq UltraScale+ XCZU2CG-1SFVC784E | 128MB | MPU Core | 0°C ~ 85°C | 2GB | 1.970" L x 1.570" W (50.00mm x 40.00mm) | - | |
Trenz Electronic
|
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- | B2B | Zynq UltraScale+ XCZU2CG-1SFVC784E | 128MB | MPU Core | 0°C ~ 85°C | 2GB | 1.970" L x 1.570" W (50.00mm x 40.00mm) | - | |
Trenz Electronic
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- | B2B | Zynq UltraScale+ XCZU2CG-1SFVC784E | 128MB | MPU Core | 0°C ~ 85°C | 2GB | 1.970" L x 1.570" W (50.00mm x 40.00mm) | - | |
GHI Electronics, LLC
|
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- | - | ARM® Cortex®-M4 | 1MB (Internal), 4MB (External) | MPU Core | - | 320KB | 2.670" L x 1.250" W (67.70mm x 31.70mm) | 100MHz | |
GHI Electronics, LLC
|
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- | - | ARM® Cortex®-M7 | 2MB (Internal), 4MB (External) | MPU Core | - | 512KB (Internal), 32MB (External) | 2.670" L x 1.250" W (67.70mm x 31.70mm) | 216MHz | |
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Trenz Electronic
|
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- | B2B | Zynq UltraScale+ XCZU4EG-1SFVC784E | 128MB | MPU Core | 0°C ~ 85°C | 2GB | 2.050" L x 2.990" W (52.00mm x 76.00mm) | - | |
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Trenz Electronic
|
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- | B2B | Zynq UltraScale+ XCZU4EV-1SFVC784E | 128MB | MPU Core | 0°C ~ 85°C | 2GB | 2.050" L x 2.990" W (52.00mm x 76.00mm) | - | |
|
Trenz Electronic
|
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- | B2B | Zynq UltraScale+ XCZU2CG-1SFVC784E | 128MB | MPU Core | 0°C ~ 85°C | 2GB | 2.050" L x 2.990" W (52.00mm x 76.00mm) | - | |
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Trenz Electronic
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- | B2B | Zynq UltraScale+ XCZU6EG-1FFVC900E | 128MB | MPU Core | 0°C ~ 85°C | 4GB | 2.050" L x 2.990" W (52.00mm x 76.00mm) | - | |
Trenz Electronic
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- | B2B | Zynq UltraScale+ XCZU3EG-1SFVC784E | 128MB | MPU Core | 0°C ~ 80°C | 2GB | 1.570" L x 1.970" W (40.00mm x 50.00mm) | - | |
Trenz Electronic
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- | B2B | Zynq UltraScale+ XCZU4EV-1SFVC784E | 128MB | MPU Core | 0°C ~ 85°C | 2GB | 1.570" L x 1.970" W (40.00mm x 50.00mm) | - | |
Trenz Electronic
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- | B2B | Zynq UltraScale+ XCZU4EV-1SFVC784E | 128MB | MPU Core | 0°C ~ 85°C | 2GB | 1.570" L x 1.970" W (40.00mm x 50.00mm) | - | |
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Trenz Electronic
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- | CompactPCI Serial Backplane | Zynq UltraScale+ XCZU15EG-1FFVB1156E | 128MB | MCU, FPGA | - | 8GB | - | - | |
Trenz Electronic
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- | B2B | Artix-7 XC7A100T-2FGG484C | 32MB | FPGA Core | 0°C ~ 70°C | 1GB | 1.570" L x 1.970" W (40.00mm x 50.00mm) | 200MHz | |
Trenz Electronic
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- | B2B | Artix-7 XC7A200T-2FBG484C | 32MB | FPGA Core | 0°C ~ 70°C | 1GB | 1.570" L x 1.970" W (40.00mm x 50.00mm) | 200MHz | |
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Trenz Electronic
|
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- | B2B | Zynq UltraScale+ XCZU7EV-1FBVB900E | 128MB | MPU Core | 0°C ~ 85°C | 4GB | 2.050" L x 2.990" W (52.00mm x 76.00mm) | - | |
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Trenz Electronic
|
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- | B2B | Zynq UltraScale+ XCZU2EG-1SFVC784E | 128MB | MPU Core | 0°C ~ 85°C | 2GB | 1.570" L x 1.970" W (40.00mm x 50.00mm) | - | |
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Trenz Electronic
|
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- | B2B | Zynq UltraScale+ XCZU4CG-1SFVC784E | 128MB | MPU Core | 0°C ~ 85°C | 2GB | 1.570" L x 1.970" W (40.00mm x 50.00mm) | - | |
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Trenz Electronic
|
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- | B2B | Zynq UltraScale+ XCZU3CG-1SFVC784E | 128MB | MPU Core | 0°C ~ 85°C | 1GB | 1.570" L x 1.970" W (40.00mm x 50.00mm) | - | |
|
Trenz Electronic
|
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- | B2B | Zynq UltraScale+ XCZU2CG-1SFVC784E | 128MB | MPU Core | 0°C ~ 85°C | 2GB | 1.570" L x 1.970" W (40.00mm x 50.00mm) | - | |
|
Trenz Electronic
|
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- | B2B | Zynq UltraScale+ XCZU3EG-1SFVC784E | 128MB | MPU Core | 0°C ~ 80°C | 2GB | 1.570" L x 1.970" W (40.00mm x 50.00mm) | - | |
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Trenz Electronic
|
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- | B2B | Zynq UltraScale+ XCZU2EG-1SFVC784E | 128MB | MPU Core | 0°C ~ 85°C | 2GB | 2.050" L x 2.990" W (52.00mm x 76.00mm) | - | |
|
Trenz Electronic
|
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- | B2B | Zynq UltraScale+ XCZU2CG-1SFVC784E | 128MB | MPU Core | 0°C ~ 85°C | 2GB | 2.050" L x 2.990" W (52.00mm x 76.00mm) | - | |
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Trenz Electronic
|
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- | B2B | Zynq UltraScale+ XCZU2CG-1SFVC784E | 128MB | MPU Core | 0°C ~ 85°C | 2GB | 2.050" L x 2.990" W (52.00mm x 76.00mm) | - | |
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Trenz Electronic
|
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- | B2B | Zynq UltraScale+ XCZU4EV-1SFVC784E | 128MB | MPU Core | 0°C ~ 85°C | 2GB | 2.050" L x 2.990" W (52.00mm x 76.00mm) | - | |
|
Trenz Electronic
|
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Price on request
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- | B2B | Zynq UltraScale+ XCZU4CG-1SFVC784E | 128MB | MPU Core | 0°C ~ 85°C | 2GB | 2.050" L x 2.990" W (52.00mm x 76.00mm) | - | |
Trenz Electronic
|
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- | B2B | Zynq UltraScale+ XCZU3EG-1SFVC784E | 128MB | MPU Core | 0°C ~ 85°C | 2GB | 2.050" L x 2.990" W (52.00mm x 76.00mm) | - | |
|
Trenz Electronic
|
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- | B2B | Zynq UltraScale+ XCZU2EG-1SFVC784E | 128MB | MPU Core | 0°C ~ 85°C | 2GB | 1.570" L x 1.970" W (40.00mm x 50.00mm) | - | |
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Trenz Electronic
|
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- | Samtec LSHM | Zynq UltraScale+ XCZU2CG-1SFVC784I | 128MB | MPU Core | -40°C ~ 85°C | 2GB | 1.970" L x 1.570" W (50.00mm x 40.00mm) | - | |
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Beacon EmbeddedWorks
|
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- | Board-to-Board (BTB) Socket - 200 | TMS320C6748 | 8MB | DSP Core | 0°C ~ 70°C | 128MB | 1.180" L x 1.570" W (30.00mm x 40.00mm) | 300MHz | |
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Beacon EmbeddedWorks
|
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- | Board-to-Board (BTB) Socket - 240 | ARM® Cortex®-A8, OMAP3503 | 256MB | MPU Core | 0°C ~ 70°C | 128MB | 1.230" L x 3.010" W (31.20mm x 76.50mm) | 600MHz | |
BECOM Systems GmbH
|
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- | Expansion 2 x 100 | ADSP-BF609 (Dual Core) | 8MB | MPU Core | 0°C ~ 70°C | 256KB | 1.730" L x 1.300" W (44.00mm x 33.00mm) | 500MHz x 2 | |
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Beacon EmbeddedWorks
|
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- | Board-to-Board (BTB) Socket - 240 | ARM® Cortex®-A8, OMAP3503 | 256MB (NAND), 8MB (NOR) | MPU Core | 0°C ~ 70°C | 128MB | 1.230" L x 3.010" W (31.20mm x 76.50mm) | 600MHz | |
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Beacon EmbeddedWorks
|
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- | Board-to-Board (BTB) Socket - 200 | ARM® Cortex®-A8, OMAP3503 | 256MB | MPU Core | 0°C ~ 70°C | 128MB | 0.590" L x 1.060" W (15.00mm x 27.00mm) | 600MHz | |
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Beacon EmbeddedWorks
|
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TMS320C64x (DSP) | Board-to-Board (BTB) Socket - 240 | ARM® Cortex®-A8, OMAP3530 | 256MB | MPU, DSP Core | 0°C ~ 70°C | 128MB | 1.230" L x 3.010" W (31.20mm x 76.50mm) | 600MHz | |
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Beacon EmbeddedWorks
|
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TMS320C64x (DSP) | Board-to-Board (BTB) Socket - 240 | ARM® Cortex®-A8, OMAP3530 | 256MB (NAND), 8MB (NOR) | MPU, DSP Core | -20°C ~ 70°C | 128MB | 1.230" L x 3.010" W (31.20mm x 76.50mm) | 600MHz | |
Beacon EmbeddedWorks
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TMS320C64x (DSP) | Board-to-Board (BTB) Socket - 240 | ARM® Cortex®-A8, OMAP3530 | 512MB (NAND), 8MB (NOR) | MPU, DSP Core | -40°C ~ 85°C | 256MB | 1.230" L x 3.010" W (31.20mm x 76.50mm) | 600MHz | |
Beacon EmbeddedWorks
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TMS320C6748 | Board-to-Board (BTB) Socket - 300 | ARM926EJ-S, OMAP-L138 | 8MB | MPU, DSP Core | 0°C ~ 70°C | 64MB | 1.180" L x 1.570" W (30.00mm x 40.00mm) | 375MHz |
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