What are Microcontrollers, Microprocessor, FPGA Modules ?
Microcontrollers, Microprocessor, FPGA Modules are integrated circuits designed to manage and control electronic devices. They are commonly used in embedded control systems, new product design, and production electronics assembly. Important specifications for selection include Core Processor, which determines processing power; Flash Size, which affects data storage capacity; and Operating Temperature, which ensures reliability under specific environmental conditions. Validating lifecycle status and exploring alternate-source options are crucial for procurement teams to mitigate sourcing risks.
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| Part & Mfr | Co | Connector Type | Core Processor | Flash Size | Module | Operating Temperature | RAM Size | Size | Speed | |||
|---|---|---|---|---|---|---|---|---|---|---|---|---|
Digi
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- | RJ45 | ARM926EJ-S, NS9210 | 4MB | MPU Core | -40°C ~ 80°C | 8MB | 1.450" L x 0.750" W (36.70mm x 19.10mm) | 75MHz | |
Digi
|
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- | RJ45 | ARM926EJ-S, NS9210 | 4MB | MPU Core | -40°C ~ 80°C | 8MB | 1.450" L x 0.750" W (36.70mm x 19.10mm) | 75MHz | |
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Digi
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- | RJ45 | ARM926EJ-S, NS9210 | 16MB | MPU Core | -40°C ~ 80°C | 8MB | 1.450" L x 0.750" W (36.70mm x 19.10mm) | 75MHz | |
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Digi
|
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- | RJ45 | ARM926EJ-S, NS9210 | 16MB | MPU Core | -40°C ~ 80°C | 8MB | 1.450" L x 0.750" W (36.70mm x 19.10mm) | 75MHz | |
Digi
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- | RJ45 | ARM926EJ-S, NS9210 | 8MB | MPU Core | -40°C ~ 80°C | 16MB | 1.450" L x 0.750" W (36.70mm x 19.10mm) | 75MHz | |
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Digi
|
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- | RJ45 | ARM926EJ-S, NS9210 | 16MB | MPU Core | -40°C ~ 80°C | 8MB | 1.450" L x 0.750" W (36.70mm x 19.10mm) | 75MHz | |
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Digi
|
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- | RJ45 | ARM926EJ-S, NS9210 | 16MB | MPU Core | -40°C ~ 80°C | 8MB | 1.450" L x 0.750" W (36.70mm x 19.10mm) | 75MHz | |
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Digi
|
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- | Board-to-Board (BTB) Socket - 360 | ARM® Cortex®-A8, i.MX53 | - | MPU Core | - | - | 1.970" L x 3.230" W (50.00mm x 82.00mm) | - | |
Digi
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Digi
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Digi
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Digi
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- | 40 Pin Header | Z180 | - | MPU Core | -40°C ~ 70°C | 32KB | 1.800" L x 2.050" W (46.00mm x 52.00mm) | 9.216MHz | |
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Digi
|
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- | 40 Pin Header | Z180 | 512KB EPROM | MPU Core | -40°C ~ 70°C | 32KB | 1.800" L x 2.050" W (46.00mm x 52.00mm) | 9.216MHz | |
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Digi
|
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- | 40 Pin Header | Z180 | 512KB EPROM | MPU Core | -40°C ~ 70°C | 128KB | 1.800" L x 2.050" W (46.00mm x 52.00mm) | 9.216MHz | |
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Digi
|
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- | 40 Pin Header | Z180 | 128KB | MPU Core | -40°C ~ 70°C | 32KB | 1.800" L x 2.050" W (46.00mm x 52.00mm) | 9.216MHz | |
Digi
|
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- | 40 Pin Header | Z180 | 128KB | MPU Core | -40°C ~ 70°C | 128KB | 1.800" L x 2.050" W (46.00mm x 52.00mm) | 18.432MHz | |
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Digi
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Digi
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Digi
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Trenz Electronic
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Zynq-7000 (Z-7045) | Board-to-Board (BTB) Socket - 480 | ARM Cortex-A9 | 64MB | MCU, FPGA | -40°C ~ 85°C | 1GB | 2.050" L x 2.990" W (52.00mm x 76.00mm) | - | |
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Trenz Electronic
|
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Zynq-7000 (Z-7045) | Board-to-Board (BTB) Socket - 480 | ARM Cortex-A9 | 64MB | MCU, FPGA | -40°C ~ 85°C | 1GB | 2.050" L x 2.990" W (52.00mm x 76.00mm) | - | |
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Trenz Electronic
|
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- | B2B | Zynq UltraScale+ XCZU15EG-1FFVC900E | 128MB | MPU Core | 0°C ~ 85°C | 4GB | 2.050" L x 2.990" W (52.00mm x 76.00mm) | - | |
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Trenz Electronic
|
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- | B2B | Zynq UltraScale+ XCZU15EG-1FFVC900E | 128MB | MPU Core | 0°C ~ 85°C | 4GB | 2.050" L x 2.990" W (52.00mm x 76.00mm) | - | |
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System-On-Chip (SOC) Technologies
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- | - | Dual ARM® Cortex®-A9 MPCore with CoreSight | 128KB | FPGA Core | - | 512MB | - | 1.5GHz | |
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System-On-Chip (SOC) Technologies
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- | - | Dual ARM® Cortex®-A9 MPCore with CoreSight | 128KB | FPGA Core | - | 512MB | - | 1.5GHz | |
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System-On-Chip (SOC) Technologies
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- | - | Dual ARM® Cortex®-A9 MPCore with CoreSight | 128KB | FPGA Core | - | 512MB | - | 1.5GHz | |
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Trenz Electronic
|
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Zynq-7000 (Z-7035) | Board-to-Board (BTB) Socket | ARM Cortex-A9 | 32MB | MCU, FPGA | -40°C ~ 85°C | 1GB | 3.350" L x 3.350" W (85.00mm x 85.00mm) | - | |
Critical Link LLC
|
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NEON SIMD | Board-to-Board (BTB) | ARM® Cortex®-A9, Arria 10 SX | - | MPU, FPGA Core | 0°C ~ 70°C | 6GB | 4.000" L x 4.000" W (101.50mm x 101.50mm) | 1.2GHz | |
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Critical Link LLC
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NEON SIMD | Board-to-Board (BTB) | ARM® Cortex®-A9 | - | MPU, FPGA Core | 0°C ~ 70°C | 4GB | 4.000" L x 4.000" W (101.50mm x 101.50mm) | 1.2GHz | |
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Trenz Electronic
|
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Zynq-7000 (Z-7045) | Board-to-Board (BTB) Socket - 480 | ARM Cortex-A9 | 64MB | MCU, FPGA | -40°C ~ 85°C | 1GB | 2.050" L x 2.990" W (52.00mm x 76.00mm) | - | |
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System-On-Chip (SOC) Technologies
|
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- | - | Dual ARM® Cortex®-A9 MPCore with CoreSight | 128KB | FPGA Core | - | 512MB | - | 1.5GHz | |
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System-On-Chip (SOC) Technologies
|
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- | - | Dual ARM® Cortex®-A9 MPCore with CoreSight | 128KB | FPGA Core | - | 512MB | - | 1.5GHz | |
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System-On-Chip (SOC) Technologies
|
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Price on request
Price and Stock
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- | - | Dual ARM® Cortex®-A9 MPCore with CoreSight | 128KB | FPGA Core | - | 512MB | - | 1.5GHz | |
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Trenz Electronic
|
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Zynq-7000 (Z-7045) | Board-to-Board (BTB) Socket - 480 | ARM Cortex-A9 | 64MB | MCU, FPGA | -40°C ~ 85°C | 1GB | 2.050" L x 2.990" W (52.00mm x 76.00mm) | - | |
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System-On-Chip (SOC) Technologies
|
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- | - | - | - | - | - | - | - | - | |
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Trenz Electronic
|
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Zynq-7000 (Z-7045) | Board-to-Board (BTB) Socket | ARM Cortex-A9 | 32MB | MCU, FPGA | -40°C ~ 85°C | 1GB | 3.350" L x 3.350" W (85.00mm x 85.00mm) | - | |
Critical Link LLC
|
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NEON SIMD | Board-to-Board (BTB) | ARM® Cortex®-A9, Arria 10 SX | - | MPU, FPGA Core | -40°C ~ 85°C | 6GB | 4.000" L x 4.000" W (101.50mm x 101.50mm) | 1.2GHz | |
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Trenz Electronic
|
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Zynq-7000 (Z-7045) | Board-to-Board (BTB) Socket - 480 | ARM Cortex-A9 | 64MB | MCU, FPGA | -40°C ~ 85°C | 1GB | 2.050" L x 2.990" W (52.00mm x 76.00mm) | - | |
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System-On-Chip (SOC) Technologies
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- | - | - | - | - | - | - | - | - | |
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System-On-Chip (SOC) Technologies
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Price on request
Price and Stock
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- | - | - | - | - | - | - | - | - | |
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System-On-Chip (SOC) Technologies
|
Send RFQ |
Price on request
Price and Stock
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- | - | Dual ARM® Cortex®-A9 MPCore with CoreSight | 128KB | FPGA Core | - | 512MB | - | 1.5GHz | |
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System-On-Chip (SOC) Technologies
|
Send RFQ |
Price on request
Price and Stock
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- | - | - | - | - | - | - | - | - | |
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System-On-Chip (SOC) Technologies
|
Send RFQ |
Price on request
Price and Stock
on Request |
- | - | Dual ARM® Cortex®-A9 MPCore with CoreSight | 128KB | FPGA Core | - | 512MB | - | 1.5GHz | |
|
System-On-Chip (SOC) Technologies
|
Send RFQ |
Price on request
Price and Stock
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- | - | - | - | - | - | - | - | - | |
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Trenz Electronic
|
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- | B2B | Zynq UltraScale+ XCZU7CG-1FBVB900I | 128MB | MPU Core | -40°C ~ 85°C | 4GB | 2.050" L x 2.990" W (52.00mm x 76.00mm) | - | |
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Trenz Electronic
|
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- | B2B | Zynq UltraScale+ XCZU7EV-1FBVB900I | 128MB | MPU Core | -40°C ~ 85°C | 4GB | 2.050" L x 2.990" W (52.00mm x 76.00mm) | - | |
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Trenz Electronic
|
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Zynq-7000 (Z-7100) | Board-to-Board (BTB) Socket | ARM Cortex-A9 | 32MB | MCU, FPGA | -40°C ~ 85°C | 1GB | 3.350" L x 3.350" W (85.00mm x 85.00mm) | - | |
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System-On-Chip (SOC) Technologies
|
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Rendeer Systems
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- | - | ARM® Cortex®-M4 | 512KB | MCU Core | -40°C ~ 85°C (TA) | 192KB (Internal), 16MB (External QSPI) | 1.240" L x 1.100" W (31.50mm x 28.00mm) | 120MHz | |
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MYIR Tech Limited
|
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- | Pin Header | ARM® Cortex®-A7, ARM® Cortex®-M4 | 256MB | MPU Core | 0°C ~ 70°C | 256MB | 1.540" L x 1.460" W (39.00mm x 37.00mm) | 650MHz |
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