What are Digital to Analog Converters (DAC) ?
Digital to Analog Converters (DAC) are electronic components that convert digital data into analog signals, enabling the use of digital information in analog systems. They are commonly used in applications such as audio equipment, signal processing, and data acquisition systems. Important specifications for selection include Architecture, which affects the conversion method; Number of Bits, which determines resolution and accuracy; and Operating Temperature, which ensures reliability in various environments. Procurement teams should validate lifecycle status and consider alternate-source options to mitigate sourcing risks.
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| Part & Mfr | Total Stock | Pricing & RFQ | Architecture | Data Interface | Differential Output | INL | Mounting Type | Number of Bits | Number of D | Operating Temperature | Output Type | Reference Type | Settling Time | Supplier Device Package | Voltage | |
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Analog Devices / Maxim Integrated
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Pipelined | - | No | ±2, ±1 | Through Hole | 10 | 3 | 0°C ~ 70°C | Current - Buffered | External | - | 40-PDIP | 4.75V ~ 5.25V | |
Analog Devices / Maxim Integrated
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Multiplying DAC, R-2R | Parallel | No | ±0.25LSB (Max), ±0.5 (Max) | Through Hole | 8 | 4 | -40°C ~ 85°C | Current - Unbuffered | External | 250ns | 28-CDIP | 4.5V ~ 5.5V | |
Analog Devices / Maxim Integrated
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Current Source | SPI | No | ±1 (Max), ±1 (Max) | Through Hole | 8 | 2 | -40°C ~ 105°C | Voltage - Buffered | External, Internal | 2µs | 8-PDIP | 2.7V ~ 5.5V | |
Analog Devices / Maxim Integrated
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- | PWM | No | ±1, ±1 (Max) | Surface Mount | 12 | 4 | -40°C ~ 125°C | Voltage - Buffered | External, Internal | 7.8µs (Typ) | 16-MSOP | 2.7V ~ 5.5V | |
Harris Semiconductor
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- | - | Yes | ±2, ±0.5 (Max) | Surface Mount | 10 | 3 | -20°C ~ 75°C | Current - Buffered | External | 40ns (Typ) | 64-MQFP (14x20) | 4.75V ~ 5.25V | |
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Analog Devices / Maxim Integrated
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- | PWM | No | ±1, ±1 (Max) | Surface Mount | 12 | 4 | 0°C ~ 70°C | Voltage - Buffered | External, Internal | 7.8µs (Typ) | 16-MSOP | 2.7V ~ 5.5V | |
Microchip Technology
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R-2R | I²C | No | ±0.25, ±0.25 | Surface Mount | 10 | 8 | -40°C ~ 125°C | Voltage - Buffered | External, Internal, Supply | 16µs (Typ) | 20-TSSOP | 1.8V ~ 5.5V | |
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Harris Semiconductor
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R-2R, Segmented DAC | - | No | ±0.5 (Max), ±0.5 (Max) | Surface Mount | 8 | 1 | -20°C ~ 75°C | - | External | 4.3ns (Typ) | 28-SOIC | -4.75V ~ -5.45V | |
Analog Devices / Maxim Integrated
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Multiplying DAC, R-2R | Parallel | No | ±1 (Max), ±1 (Max) | Surface Mount | 12 | 2 | -40°C ~ 85°C | Current - Unbuffered | External | 1.5µs | 24-SOIC | 10.8V ~ 16.5V | |
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Microchip Technology
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R-2R | I²C | No | ±0.25, ±0.25 | Surface Mount | 10 | 8 | -40°C ~ 125°C | Voltage - Buffered | External, Internal, Supply | 16µs (Typ) | 20-TSSOP | 1.8V ~ 5.5V | |
Analog Devices / Maxim Integrated
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String DAC | SPI, DSP | No | ±0.5, ±1 (Max) | Surface Mount | 14 | 4 | -40°C ~ 105°C | Voltage - Buffered | External, Internal | 8µs | 16-LFCSP (3x3) | 1.8V ~ 5.5V | |
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Analog Devices / Maxim Integrated
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String DAC | I²C | No | ±0.5, ±1 (Max) | Surface Mount | 14 | 4 | -40°C ~ 105°C | Voltage - Buffered | External, Internal | 8µs | 16-LFCSP (3x3) | 1.8V ~ 5.5V | |
Analog Devices / Maxim Integrated
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- | - | - | - | Through Hole | - | - | - | - | - | - | 20-PDIP | - | |
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Analog Devices / Maxim Integrated
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Multiplying DAC, R-2R | Parallel | No | ±0.5 (Max), ±1 (Max) | Surface Mount | 12 | 1 | 0°C ~ 70°C | Voltage - Buffered | External | 5µs | 24-SOIC | ±14.25V ~ 15.75V | |
Analog Devices / Maxim Integrated
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Multiplying DAC, R-2R | Parallel | No | ±0.5 (Max), ±1 (Max) | Through Hole | 12 | 1 | 0°C ~ 70°C | Voltage - Buffered | External | 5µs | 24-PDIP | ±14.25V ~ 15.75V | |
On Semiconductor
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- | - | No | - | Surface Mount | 10 | 3 | 0°C ~ 70°C | Current - Unbuffered | External | 15ns (Typ) | 44-PLCC (16.59x16.59) | 4.75V ~ 5.25V | |
Analog Devices / Maxim Integrated
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- | SPI | No | ±1, ±1 (Max) | Surface Mount | 12 | 4 | -40°C ~ 85°C | Voltage - Buffered | External, Internal | 4.2µs (Typ) | 16-QFN (3x3) | 2.7V ~ 5.5V | |
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Analog Devices / Maxim Integrated
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- | I²C | No | ±0.2, ±0.5 (Max) | Surface Mount | 10 | 8 | 0°C ~ 70°C | Voltage - Buffered | External, Internal | 4.3µs (Typ) | 16-MSOP | 5V | |
Texas Instruments
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- | - | - | - | - | - | - | - | - | - | - | - | - | |
Analog Devices / Maxim Integrated
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String DAC | SPI, DSP | No | ±1, ±1 (Max) | Surface Mount | 16 | 2 | -40°C ~ 105°C | Voltage - Buffered | External, Internal | 8µs | 16-TSSOP | 1.8V ~ 5.5V | |
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Analog Devices / Maxim Integrated
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- | - | - | - | Surface Mount | 12 | - | - | - | - | - | 16-TSSOP | - | |
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Analog Devices / Maxim Integrated
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String DAC | SPI, DSP | No | ±2, ±0.2 | Surface Mount | 12 | 2 | -40°C ~ 105°C | Voltage - Buffered | External | 10µs | 16-TSSOP | 2.5V ~ 5.5V | |
Analog Devices / Maxim Integrated
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Current Steering | Parallel | Yes | ±0.3, ±0.2 | Surface Mount | 12 | 1 | -40°C ~ 85°C | Current - Unbuffered | External, Internal | 11ns (Typ) | 48-QFN (7x7) | 3.135V ~ 3.465V | |
Analog Devices / Maxim Integrated
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- | Parallel | Yes | ±0.25, ±0.2 | Surface Mount | 10 | 2 | -40°C ~ 85°C | Current - Unbuffered | External, Internal | 12ns (Typ) | 40-TQFN-EP (6x6) | 2.7V ~ 3.6V | |
Analog Devices / Maxim Integrated
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R-2R | SPI, DSP | No | -, ±1.3 (Max) | Surface Mount | 12 | 1 | -40°C ~ 105°C | Voltage or Current - Buffered | External, Internal | 25µs (V), 40µs (A) (Typ) | 24-TSSOP-EP | 2.7V ~ 5.5V | |
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Microchip Technology
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R-2R | I²C | No | -, ±1 (Max) | Surface Mount | 12 | 8 | -40°C ~ 125°C | Voltage - Buffered | External, Internal, Supply | 16µs (Typ) | 20-TSSOP | 1.8V ~ 5.5V | |
Microchip Technology
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R-2R | I²C | No | -, ±1 (Max) | Surface Mount | 12 | 8 | -40°C ~ 125°C | Voltage - Buffered | External, Internal, Supply | 16µs (Typ) | 20-QFN (4x4) | 1.8V ~ 5.5V | |
Analog Devices / Maxim Integrated
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- | SPI | No | ±4 (Max), ±0.5 (Max) | Surface Mount | 12 | 1 | 0°C ~ 70°C | Voltage - Buffered | Internal | 14µs (Typ) | 8-SO | 5V | |
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Analog Devices / Maxim Integrated
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Multiplying DAC | SPI | No | ±0.5, ±1 (Max) | Through Hole | 8 | 8 | -40°C ~ 85°C | Voltage - Buffered | External | 6µs | 24-CDIP | 5V | |
Analog Devices / Maxim Integrated
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Segmented DAC | Parallel | Yes | ±0.03, ±0.02 | Surface Mount | 8 | 2 | -40°C ~ 85°C | Current - Unbuffered | External, Internal | 11.5ns (Typ) | 40-LFCSP-VQ (6x6) | 1.7V ~ 3.5V | |
Analog Devices / Maxim Integrated
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String DAC | I²C | No | ±0.5, ±0.5 (Max) | Surface Mount | 10 | 1 | -40°C ~ 85°C | Voltage - Buffered | Supply | 12µs | SOT-23-6 | 2.7V ~ 5.5V | |
Analog Devices / Maxim Integrated
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Multiplying DAC, R-2R | Parallel | Yes | ±0.5, ±1 | Through Hole | 8 | 2 | -55°C ~ 125°C | Current - Unbuffered | External | 200ns | 20-CERDIP | 5V ~ 15V | |
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Analog Devices / Maxim Integrated
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Multiplying DAC, R-2R | Parallel | Yes | ±0.5, ±1 | Through Hole | 8 | 2 | -55°C ~ 125°C | Current - Unbuffered | External | 200ns | 20-CERDIP | 5V ~ 15V | |
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Analog Devices / Maxim Integrated
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- | SPI | No | ±0.2, ±0.5 (Max) | Surface Mount | 10 | 8 | -40°C ~ 85°C | Voltage - Buffered | External, Internal | 4.3µs (Typ) | 16-MSOP | 5V | |
Analog Devices / Maxim Integrated
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- | SPI | No | ±4 (Max), ±0.5 (Max) | Through Hole | 12 | 1 | -40°C ~ 85°C | Voltage - Buffered | Internal | 14µs (Typ) | 8-PDIP | 5V | |
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Analog Devices / Maxim Integrated
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R-2R | SPI | No | ±4 (Max), ±0.5 (Max) | Through Hole | 12 | 1 | -40°C ~ 85°C | Voltage - Buffered | Internal | 14µs (Typ) | 8-PDIP | 5V | |
Analog Devices / Maxim Integrated
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- | - | - | - | Surface Mount | 8 | - | - | - | - | - | 16-SOIC | - | |
Analog Devices / Maxim Integrated
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R-2R | Parallel | No | ±0.5 (Max), ±0.5 (Max) | Surface Mount | 12 | 1 | 0°C ~ 70°C | Current - Unbuffered | External | 1µs | 20-PLCC (8.97x8.97) | 4.75V, 11.4V ~ 5.25V, 15.75V | |
Analog Devices / Maxim Integrated
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Oversampling Interpolating DAC | Parallel | Yes | ±0.5, ±0.25 | Surface Mount | 10 | 2 | -40°C ~ 85°C | Current - Unbuffered | External, Internal | 11ns (Typ) | 48-TQFP-EP (7x7) | 2.7V ~ 3.3V | |
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Microchip Technology
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R-2R | SPI | No | -, ±1 (Max) | Surface Mount | 12 | 8 | -40°C ~ 125°C | Voltage - Buffered | External, Internal, Supply | 16µs (Typ) | 20-TSSOP | 1.8V ~ 5.5V | |
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Microchip Technology
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R-2R | SPI | No | -, ±1 (Max) | Surface Mount | 12 | 8 | -40°C ~ 125°C | Voltage - Buffered | External, Internal, Supply | 16µs (Typ) | 20-QFN (4x4) | 1.8V ~ 5.5V | |
Analog Devices / Maxim Integrated
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- | - | No | ±1, ±1 | Surface Mount | 24 | 3 | -40°C ~ 85°C | Voltage - Buffered | External, Internal | - | 44-PLCC (16.59x16.59) | 4.75V ~ 5.25V | |
Analog Devices / Maxim Integrated
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Multiplying DAC, R-2R | Parallel | Yes | ±0.125LSB (Max), ±1 (Max) | Through Hole | 8 | 1 | -25°C ~ 85°C | Current - Unbuffered | External | 350ns | 16-CERDIP | 4.5V ~ 5.5V, 10.8V ~ 13.2V, 13.5V ~ 16.5V | |
Analog Devices / Maxim Integrated
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- | 3-Wire Serial, DSP, Microwire, QSPI, SPI | No | ±1, ±1 (Max) | Surface Mount | 12 | 8 | -40°C ~ 85°C | Voltage - Buffered | External | 5µs (Typ) | 16-TSSOP | 2.7V ~ 5.5V | |
Analog Devices / Maxim Integrated
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R-2R | Parallel | No | ±1 (Max), ±1 (Max) | Through Hole | 8 | 1 | -25°C ~ 85°C | Voltage - Buffered | External | 5µs | 18-CDIP | -4.5V ~ -5.5V, 11.4V ~ 16.5V | |
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Analog Devices / Maxim Integrated
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R-2R | SPI, DSP | No | ±0.5, ±0.5 | Surface Mount | 16 | 1 | -40°C ~ 85°C | Voltage - Unbuffered | External | 1µs (Typ) | 16-LFCSP (3x3) | 2.7V ~ 5.5V | |
Analog Devices / Maxim Integrated
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- | I²C | No | ±1, ±1 (Max) | Surface Mount | 12 | 4 | -40°C ~ 125°C | Voltage - Buffered | External, Internal | 4.4µs (Typ) | 10-MSOP-EP | 2.7V ~ 5.5V | |
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Analog Devices / Maxim Integrated
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- | SPI | No | ±1, ±1 (Max) | Surface Mount | 12 | 4 | -40°C ~ 125°C | Voltage - Buffered | External, Internal | 4.2µs (Typ) | 10-MSOP-EP | 2.7V ~ 5.5V | |
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Analog Devices / Maxim Integrated
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- | I²C | No | ±1, ±1 (Max) | Surface Mount | 12 | 4 | -40°C ~ 125°C | Voltage - Buffered | External, Internal | 4.4µs (Typ) | 10-MSOP-EP | 2.7V ~ 5.5V | |
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Analog Devices / Maxim Integrated
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- | I²C | No | ±1, ±1 (Max) | Surface Mount | 12 | 4 | -40°C ~ 125°C | Voltage - Buffered | External, Internal | 4.4µs (Typ) | 16-QFN (3x3) | 2.7V ~ 5.5V |
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