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| Part & Mfr | Total Stock | Pricing & RFQ | Contact Finish | Contact Finish Thickness | Contact Material | Features | Housing Material | Mounting Type | Number of Positions or Pins (Grid) | Operating Temperature | Pitch | Termination | Type | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics
|
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Gold | 10.0µin (0.25µm) | Beryllium Copper | Closed Frame | Polyamide (PA46), Nylon 4/6, Glass Filled | Through Hole | 36 (2 x 18) | -55°C ~ 125°C | 0.100" (2.54mm) | Wire Wrap | DIP, 0.3" (7.62mm) Row Spacing | |
Mill-Max Manufacturing
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Tin-Lead | 30.0µin (0.76µm) | Beryllium Copper | Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole | 64 (2 x 32) | -55°C ~ 125°C | 0.100" (2.54mm) | Wire Wrap | DIP, 0.9" (22.86mm) Row Spacing | |
Mill-Max Manufacturing
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Tin | 30.0µin (0.76µm) | Beryllium Copper | Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole | 64 (2 x 32) | -55°C ~ 125°C | 0.100" (2.54mm) | Wire Wrap | DIP, 0.9" (22.86mm) Row Spacing | |
Mill-Max Manufacturing
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Tin | 30.0µin (0.76µm) | Beryllium Copper | Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Surface Mount | 52 (2 x 26) | -55°C ~ 125°C | 0.070" (1.78mm) | Solder | DIP, 0.6" (15.24mm) Row Spacing | |
Mill-Max Manufacturing
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Tin | 30.0µin (0.76µm) | Beryllium Copper | Elevated, Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole | 52 (2 x 26) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | DIP, 0.9" (22.86mm) Row Spacing | |
Mill-Max Manufacturing
|
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Tin-Lead | 30.0µin (0.76µm) | Beryllium Copper | Elevated, Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole | 52 (2 x 26) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | DIP, 0.9" (22.86mm) Row Spacing | |
Mill-Max Manufacturing
|
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Gold | 30.0µin (0.76µm) | Beryllium Copper | Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole | 64 (10 x 10) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | PGA | |
Mill-Max Manufacturing
|
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Gold | 30.0µin (0.76µm) | Beryllium Copper | Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole | 64 (10 x 10) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | PGA | |
Mill-Max Manufacturing
|
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Gold | 30.0µin (0.76µm) | Beryllium Copper | Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole | 64 (10 x 10) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | PGA | |
Mill-Max Manufacturing
|
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Tin-Lead | 10.0µin (0.25µm) | Beryllium Copper | Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole | 142 (15 x 15) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | PGA | |
Mill-Max Manufacturing
|
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Tin-Lead | 10.0µin (0.25µm) | Beryllium Copper | Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole | 142 (15 x 15) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | PGA | |
Aries Electronics
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Tin | 10.0µin (0.25µm) | Beryllium Copper | - | Polyamide (PA46), Nylon 4/6 | Through Hole | 40 (1 x 40) | -55°C ~ 125°C | 0.100" (2.54mm) | Wire Wrap | SIP | |
Aries Electronics
|
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Tin | 10.0µin (0.25µm) | Beryllium Copper | - | Polyamide (PA46), Nylon 4/6 | Through Hole | 40 (1 x 40) | -55°C ~ 125°C | 0.100" (2.54mm) | Wire Wrap | SIP | |
Mill-Max Manufacturing
|
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Tin-Lead | 30.0µin (0.76µm) | Beryllium Copper | Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole | 109 (12 x 12) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | PGA | |
Mill-Max Manufacturing
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Tin-Lead | 30.0µin (0.76µm) | Beryllium Copper | Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole | 109 (12 x 12) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | PGA | |
Mill-Max Manufacturing
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- | - | Beryllium Copper | Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole | 144 (13 x 13) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | PGA | |
Aries Electronics
|
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Gold | 10.0µin (0.25µm) | Beryllium Copper | Closed Frame | Polyamide (PA46), Nylon 4/6 | Through Hole | 40 (2 x 20) | -55°C ~ 125°C | 0.100" (2.54mm) | Wire Wrap | DIP, 0.2" (5.08mm) Row Spacing | |
Aries Electronics
|
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Gold | 10.0µin (0.25µm) | Beryllium Copper | Closed Frame | Polyamide (PA46), Nylon 4/6 | Through Hole | 40 (2 x 20) | -55°C ~ 125°C | 0.100" (2.54mm) | Wire Wrap | DIP, 0.2" (5.08mm) Row Spacing | |
Aries Electronics
|
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Gold | 10.0µin (0.25µm) | Beryllium Copper | Closed Frame | Polyamide (PA46), Nylon 4/6, Glass Filled | Through Hole | 32 (2 x 16) | -55°C ~ 125°C | 0.100" (2.54mm) | Wire Wrap | DIP, 0.6" (15.24mm) Row Spacing | |
Aries Electronics
|
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Gold | 10.0µin (0.25µm) | Beryllium Copper | Closed Frame | Polyamide (PA46), Nylon 4/6, Glass Filled | Through Hole | 32 (2 x 16) | -55°C ~ 125°C | 0.100" (2.54mm) | Wire Wrap | DIP, 0.6" (15.24mm) Row Spacing | |
Aries Electronics
|
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Price on request
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Gold | 10.0µin (0.25µm) | Beryllium Copper | Closed Frame | Polyamide (PA46), Nylon 4/6, Glass Filled | Through Hole | 32 (2 x 16) | -55°C ~ 125°C | 0.100" (2.54mm) | Wire Wrap | DIP, 0.6" (15.24mm) Row Spacing | |
Aries Electronics
|
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Price on request
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Gold | 10.0µin (0.25µm) | Beryllium Copper | Closed Frame | Polyamide (PA46), Nylon 4/6, Glass Filled | Through Hole | 32 (2 x 16) | -55°C ~ 125°C | 0.100" (2.54mm) | Wire Wrap | DIP, 0.6" (15.24mm) Row Spacing | |
Aries Electronics
|
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Price on request
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Gold | 10.0µin (0.25µm) | Beryllium Copper | Closed Frame | Polyamide (PA46), Nylon 4/6, Glass Filled | Through Hole | 32 (2 x 16) | -55°C ~ 125°C | 0.100" (2.54mm) | Wire Wrap | DIP, 0.6" (15.24mm) Row Spacing | |
Aries Electronics
|
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Price on request
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Gold | 10.0µin (0.25µm) | Beryllium Copper | Closed Frame | Polyamide (PA46), Nylon 4/6, Glass Filled | Through Hole | 32 (2 x 16) | -55°C ~ 125°C | 0.100" (2.54mm) | Wire Wrap | DIP, 0.6" (15.24mm) Row Spacing | |
Mill-Max Manufacturing
|
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Price on request
Price and Stock
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Tin-Lead | 10.0µin (0.25µm) | Beryllium Copper | Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole | 145 (15 x 15) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | PGA | |
TE Connectivity
|
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Tin | - | Copper Alloy | Open Frame | Polyester | Through Hole | 64 (2 x 32) | -55°C ~ 105°C | 0.100" (2.54mm) | Solder | DIP, 0.9" (22.86mm) Row Spacing | |
Aries Electronics
|
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Price on request
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Gold | 30.0µin (0.76µm) | Beryllium Copper | Open Frame | Polyamide (PA46), Nylon 4/6, Glass Filled | Through Hole | 32 (2 x 16) | -55°C ~ 125°C | 0.100" (2.54mm) | Wire Wrap | DIP, 0.6" (15.24mm) Row Spacing | |
Aries Electronics
|
Send RFQ |
Price on request
Price and Stock
on Request Send RFQ |
Gold | 30.0µin (0.76µm) | Beryllium Copper | Open Frame | Polyamide (PA46), Nylon 4/6, Glass Filled | Through Hole | 32 (2 x 16) | -55°C ~ 125°C | 0.100" (2.54mm) | Wire Wrap | DIP, 0.6" (15.24mm) Row Spacing | |
Mill-Max Manufacturing
|
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Price on request
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Gold | 30.0µin (0.76µm) | Beryllium Copper | Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole | 64 (2 x 32) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | DIP, 0.9" (22.86mm) Row Spacing | |
Mill-Max Manufacturing
|
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Tin | 30.0µin (0.76µm) | Beryllium Copper | Open Frame, Decoupling Capacitor | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole | 40 (2 x 20) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | DIP, 0.6" (15.24mm) Row Spacing | |
Mill-Max Manufacturing
|
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Tin-Lead | 30.0µin (0.76µm) | Beryllium Copper | Open Frame, Decoupling Capacitor | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole | 40 (2 x 20) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | DIP, 0.6" (15.24mm) Row Spacing | |
Aries Electronics
|
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Gold | 30.0µin (0.76µm) | Beryllium Copper | Open Frame | Polyphenylene Sulfide (PPS), Glass Filled | Through Hole | 36 (2 x 18) | - | 0.100" (2.54mm) | Wire Wrap | DIP, 0.6" (15.24mm) Row Spacing | |
Aries Electronics
|
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Gold | 30.0µin (0.76µm) | Beryllium Copper | Open Frame | Polyphenylene Sulfide (PPS), Glass Filled | Through Hole | 36 (2 x 18) | - | 0.100" (2.54mm) | Wire Wrap | DIP, 0.6" (15.24mm) Row Spacing | |
Mill-Max Manufacturing
|
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Tin | 30.0µin (0.76µm) | Beryllium Copper | Elevated, Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole | 52 (2 x 26) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | DIP, 0.6" (15.24mm) Row Spacing | |
Mill-Max Manufacturing
|
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Price on request
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Tin-Lead | 30.0µin (0.76µm) | Beryllium Copper | Elevated, Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole | 52 (2 x 26) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | DIP, 0.6" (15.24mm) Row Spacing | |
Mill-Max Manufacturing
|
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Tin-Lead | 10.0µin (0.25µm) | Beryllium Copper | Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole | 149 (15 x 15) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | PGA | |
Mill-Max Manufacturing
|
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Tin-Lead | 10.0µin (0.25µm) | Beryllium Copper | Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole | 149 (15 x 15) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | PGA | |
Mill-Max Manufacturing
|
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Price on request
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on Request Send RFQ |
Tin-Lead | 10.0µin (0.25µm) | Beryllium Copper | Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole | 149 (15 x 15) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | PGA | |
Mill-Max Manufacturing
|
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Price on request
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Tin-Lead | 30.0µin (0.76µm) | Beryllium Copper | Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole | 114 (13 x 13) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | PGA | |
Mill-Max Manufacturing
|
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Price on request
Price and Stock
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Tin-Lead | 30.0µin (0.76µm) | Beryllium Copper | Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole | 114 (13 x 13) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | PGA | |
Mill-Max Manufacturing
|
Send RFQ |
Price on request
Price and Stock
on Request Send RFQ |
Tin-Lead | 30.0µin (0.76µm) | Beryllium Copper | Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole | 114 (13 x 13) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | PGA | |
Mill-Max Manufacturing
|
Send RFQ |
Price on request
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Tin-Lead | 30.0µin (0.76µm) | Beryllium Copper | Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole | 114 (13 x 13) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | PGA | |
Mill-Max Manufacturing
|
Send RFQ |
Price on request
Price and Stock
on Request Send RFQ |
Tin-Lead | 30.0µin (0.76µm) | Beryllium Copper | Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole | 114 (15 x 15) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | PGA | |
Mill-Max Manufacturing
|
Send RFQ |
Price on request
Price and Stock
on Request Send RFQ |
Tin-Lead | 30.0µin (0.76µm) | Beryllium Copper | Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole | 114 (15 x 15) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | PGA | |
Mill-Max Manufacturing
|
Send RFQ |
Price on request
Price and Stock
on Request Send RFQ |
Tin | 30.0µin (0.76µm) | Beryllium Copper | Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole | 114 (13 x 13) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | PGA | |
Mill-Max Manufacturing
|
Send RFQ |
Price on request
Price and Stock
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Tin | 30.0µin (0.76µm) | Beryllium Copper | Elevated, Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole | 52 (2 x 26) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | DIP, 0.9" (22.86mm) Row Spacing | |
Mill-Max Manufacturing
|
Send RFQ |
Price on request
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Tin-Lead | 30.0µin (0.76µm) | Beryllium Copper | Elevated, Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole | 52 (2 x 26) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | DIP, 0.9" (22.86mm) Row Spacing | |
Mill-Max Manufacturing
|
Send RFQ |
Price on request
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- | - | Beryllium Copper | Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole | 64 (2 x 32) | -55°C ~ 125°C | 0.100" (2.54mm) | Wire Wrap | DIP, 0.9" (22.86mm) Row Spacing | |
Mill-Max Manufacturing
|
Send RFQ |
Price on request
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Gold | 30.0µin (0.76µm) | Beryllium Copper | Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole | 69 (11 x 11) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | PGA | |
Mill-Max Manufacturing
|
Send RFQ |
Price on request
Price and Stock
on Request Send RFQ |
Gold | 30.0µin (0.76µm) | Beryllium Copper | Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole | 69 (11 x 11) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | PGA |