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| Part & Mfr | Total Stock | Pricing & RFQ | Contact Finish | Contact Finish Thickness | Contact Material | Features | Housing Material | Mounting Type | Number of Positions or Pins (Grid) | Operating Temperature | Pitch | Termination | Type | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Tin | Flash | Beryllium Copper | Carrier, Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Through Hole | 28 (2 x 14) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | DIP, 0.6" (15.24mm) Row Spacing | |
3M Electronic Solutions
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Tin | 160.0µin (4.06µm) | Copper Alloy | Closed Frame | Polybutylene Terephthalate (PBT), Glass Filled | Surface Mount | 52 (4 x 13) | -40°C ~ 105°C | 0.050" (1.27mm) | Solder | PLCC | |
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Tin | Flash | Beryllium Copper | Closed Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Through Hole, Right Angle, Horizontal | 10 (2 x 5) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | DIP, 0.2" (5.08mm) Row Spacing | |
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Tin | Flash | Beryllium Copper | Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Surface Mount | 28 (2 x 14) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | DIP, 0.3" (7.62mm) Row Spacing | |
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Tin | Flash | Beryllium Copper | Elevated, Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Through Hole | 28 (2 x 14) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | DIP, 0.3" (7.62mm) Row Spacing | |
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Tin | 29.5µin (0.75µm) | Beryllium Copper | Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Surface Mount | 18 (2 x 9) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | DIP, 0.3" (7.62mm) Row Spacing | |
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Tin | Flash | Beryllium Copper | Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Surface Mount | 32 (2 x 16) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | DIP, 0.6" (15.24mm) Row Spacing | |
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Tin | 29.5µin (0.75µm) | Beryllium Copper | Elevated, Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Through Hole | 20 (2 x 10) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | DIP, 0.3" (7.62mm) Row Spacing | |
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Tin | 29.5µin (0.75µm) | Beryllium Copper | Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Through Hole | 12 (2 x 6) | -55°C ~ 125°C | 0.100" (2.54mm) | Wire Wrap | DIP, 0.3" (7.62mm) Row Spacing | |
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Tin | Flash | Beryllium Copper | Elevated, Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Through Hole | 24 (2 x 12) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | DIP, 0.6" (15.24mm) Row Spacing | |
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Tin | 29.5µin (0.75µm) | Beryllium Copper | Elevated, Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Through Hole | 14 (2 x 7) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | DIP, 0.3" (7.62mm) Row Spacing | |
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Tin | Flash | Beryllium Copper | Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Through Hole | 20 (2 x 10) | -55°C ~ 125°C | 0.100" (2.54mm) | Wire Wrap | DIP, 0.4" (10.16mm) Row Spacing | |
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Tin | Flash | Beryllium Copper | Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Through Hole | 20 (2 x 10) | -55°C ~ 125°C | 0.100" (2.54mm) | Wire Wrap | DIP, 0.4" (10.16mm) Row Spacing | |
Aries Electronics
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Gold | 10.0µin (0.25µm) | Beryllium Copper | Open Frame | Polyamide (PA46), Nylon 4/6, Glass Filled | Through Hole | 5 (1 x 5) | - | 0.100" (2.54mm) | Solder | SIP | |
Aries Electronics
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Tin | 10.0µin (0.25µm) | Beryllium Copper | Open Frame | Polyamide (PA46), Nylon 4/6, Glass Filled | Through Hole | 11 (1 x 11) | - | 0.100" (2.54mm) | Solder | SIP | |
Aries Electronics
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Tin | 10.0µin (0.25µm) | Beryllium Copper | Open Frame | Polyamide (PA46), Nylon 4/6, Glass Filled | Through Hole | 13 (1 x 13) | - | 0.100" (2.54mm) | Solder | SIP | |
Samtec Inc.
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Tin | - | Beryllium Copper | Open Frame | Polyester, Glass Filled | Through Hole | 8 (2 x 4) | -55°C ~ 105°C | 0.100" (2.54mm) | Solder | DIP, 0.3" (7.62mm) Row Spacing | |
Aries Electronics
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Tin | 10.0µin (0.25µm) | Beryllium Copper | Open Frame | Polyamide (PA46), Nylon 4/6, Glass Filled | Through Hole | 14 (2 x 7) | - | 0.100" (2.54mm) | Solder | DIP, 0.2" (5.08mm) Row Spacing | |
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Tin | 29.5µin (0.75µm) | Beryllium Copper | Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Surface Mount | 22 (2 x 11) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | DIP, 0.3" (7.62mm) Row Spacing | |
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Tin | Flash | Beryllium Copper | Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Through Hole | 24 (2 x 12) | -55°C ~ 125°C | 0.070" (1.78mm) | Solder | DIP, 0.6" (15.24mm) Row Spacing | |
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Tin | Flash | Beryllium Copper | Closed Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Through Hole, Right Angle, Horizontal | 10 (2 x 5) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | DIP, 0.3" (7.62mm) Row Spacing | |
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Tin | Flash | Beryllium Copper | Elevated, Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Through Hole | 18 (2 x 9) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | DIP, 0.3" (7.62mm) Row Spacing | |
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Tin | 29.5µin (0.75µm) | Beryllium Copper | Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Through Hole | 28 (2 x 14) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | DIP, 0.3" (7.62mm) Row Spacing | |
Kycon Inc.
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Tin | - | Phosphor Bronze | Closed Frame | Polybutylene Terephthalate (PBT), Glass Filled | Through Hole | 52 (4 x 13) | -40°C ~ 75°C | 0.100" (2.54mm) | Solder | PLCC | |
Kycon Inc.
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Tin | 160.0µin (4.06µm) | Phosphor Bronze | Closed Frame | Thermoplastic, Glass Filled | Surface Mount | 68 (4 x 17) | -50°C ~ 105°C | 0.050" (1.27mm) | Solder | PLCC | |
Kycon Inc.
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Tin | 160.0µin (4.06µm) | Phosphor Bronze | Board Guide, Closed Frame | Thermoplastic, Glass Filled | Surface Mount | 68 (4 x 17) | -50°C ~ 105°C | 0.050" (1.27mm) | Solder | PLCC | |
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Tin | 29.5µin (0.75µm) | Beryllium Copper | Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Through Hole | 28 (2 x 14) | -55°C ~ 125°C | 0.070" (1.78mm) | Solder | DIP, 0.4" (10.16mm) Row Spacing | |
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Tin | 29.5µin (0.75µm) | Beryllium Copper | Carrier, Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Through Hole | 22 (2 x 11) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | DIP, 0.3" (7.62mm) Row Spacing | |
Aries Electronics
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Tin | 10.0µin (0.25µm) | Beryllium Copper | Closed Frame | Polyamide (PA46), Nylon 4/6, Glass Filled | Through Hole | 10 (2 x 5) | -55°C ~ 105°C | 0.100" (2.54mm) | Solder | DIP, 0.2" (5.08mm) Row Spacing | |
Aries Electronics
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Tin | 10.0µin (0.25µm) | Beryllium Copper | Closed Frame | Polyamide (PA46), Nylon 4/6, Glass Filled | Through Hole | 10 (2 x 5) | -55°C ~ 105°C | 0.100" (2.54mm) | Solder | DIP, 0.3" (7.62mm) Row Spacing | |
Aries Electronics
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Gold | 10.0µin (0.25µm) | Beryllium Copper | Open Frame | Polyamide (PA46), Nylon 4/6, Glass Filled | Through Hole | 9 (1 x 9) | - | 0.100" (2.54mm) | Solder | SIP | |
Aries Electronics
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Tin | 10.0µin (0.25µm) | Beryllium Copper | Open Frame | Polyamide (PA46), Nylon 4/6, Glass Filled | Through Hole | 12 (1 x 12) | - | 0.100" (2.54mm) | Solder | SIP | |
Aries Electronics
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Tin | 10.0µin (0.25µm) | Beryllium Copper | Open Frame | Polyamide (PA46), Nylon 4/6, Glass Filled | Through Hole | 12 (2 x 6) | - | 0.100" (2.54mm) | Solder | DIP, 0.2" (5.08mm) Row Spacing | |
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Tin | 29.5µin (0.75µm) | Beryllium Copper | Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Through Hole | 16 (2 x 8) | -55°C ~ 125°C | 0.100" (2.54mm) | Press-Fit | DIP, 0.3" (7.62mm) Row Spacing | |
Preci-Dip
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Tin | 29.5µin (0.75µm) | Beryllium Copper | Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Through Hole | 16 (2 x 8) | -55°C ~ 125°C | 0.100" (2.54mm) | Press-Fit | DIP, 0.3" (7.62mm) Row Spacing | |
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Tin | 29.5µin (0.75µm) | Beryllium Copper | Elevated, Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Through Hole | 12 (2 x 6) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | DIP, 0.3" (7.62mm) Row Spacing | |
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Tin | 29.5µin (0.75µm) | Beryllium Copper | Carrier, Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Through Hole | 20 (2 x 10) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | DIP, 0.4" (10.16mm) Row Spacing | |
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Tin | 29.5µin (0.75µm) | Beryllium Copper | Elevated, Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Through Hole | 16 (2 x 8) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | DIP, 0.3" (7.62mm) Row Spacing | |
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Tin | Flash | Beryllium Copper | Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Through Hole | 40 (2 x 20) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | DIP, 0.6" (15.24mm) Row Spacing | |
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Tin | Flash | Beryllium Copper | Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Through Hole | 40 (2 x 20) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | DIP, 0.6" (15.24mm) Row Spacing | |
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Tin | 29.5µin (0.75µm) | Beryllium Copper | Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Through Hole | 28 (2 x 14) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | DIP, 0.4" (10.16mm) Row Spacing | |
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Tin | Flash | Beryllium Copper | Elevated, Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Through Hole | 24 (2 x 12) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | DIP, 0.6" (15.24mm) Row Spacing | |
Aries Electronics
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Gold | 10.0µin (0.25µm) | Beryllium Copper | - | Polyamide (PA46), Nylon 4/6, Glass Filled | Through Hole | 5 (1 x 5) | - | 0.100" (2.54mm) | Solder | SIP | |
Aries Electronics
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Gold | 10.0µin (0.25µm) | Beryllium Copper | - | Polyamide (PA46), Nylon 4/6, Glass Filled | Through Hole | 6 (1 x 6) | - | 0.100" (2.54mm) | Solder | SIP | |
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Tin | Flash | Beryllium Copper | Elevated, Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Through Hole | 24 (2 x 12) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | DIP, 0.4" (10.16mm) Row Spacing | |
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Tin | 29.5µin (0.75µm) | Beryllium Copper | Carrier, Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Through Hole | 20 (2 x 10) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | DIP, 0.3" (7.62mm) Row Spacing | |
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Tin | 29.5µin (0.75µm) | Beryllium Copper | Carrier, Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Through Hole | 20 (2 x 10) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | DIP, 0.4" (10.16mm) Row Spacing | |
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Tin | - | Phosphor Bronze | Closed Frame | Polyphenylene Sulfide (PPS) | Through Hole | 52 (4 x 13) | - | 0.100" (2.54mm) | Solder | PLCC | |
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Tin | Flash | Beryllium Copper | Elevated, Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Through Hole | 20 (2 x 10) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | DIP, 0.3" (7.62mm) Row Spacing | |
Preci-Dip
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Tin | Flash | Beryllium Copper | Elevated, Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Through Hole | 22 (2 x 11) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | DIP, 0.4" (10.16mm) Row Spacing |