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| Part & Mfr | Total Stock | Pricing & RFQ | Contact Finish | Contact Finish Thickness | Contact Material | Features | Housing Material | Mounting Type | Number of Positions or Pins (Grid) | Operating Temperature | Pitch | Termination | Type | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics
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Gold | 10.0µin (0.25µm) | Beryllium Copper | Closed Frame | Polyamide (PA46), Nylon 4/6, Glass Filled | Through Hole | 22 (2 x 11) | -55°C ~ 105°C | 0.100" (2.54mm) | Solder | DIP, 0.3" (7.62mm) Row Spacing | |
Aries Electronics
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Tin | 30.0µin (0.76µm) | Beryllium Copper | - | Polyamide (PA), Nylon, Glass Filled | Through Hole | 17 (1 x 17) | - | 0.100" (2.54mm) | Wire Wrap | SIP | |
Aries Electronics
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Tin | 30.0µin (0.76µm) | Beryllium Copper | - | Polyamide (PA), Nylon, Glass Filled | Through Hole | 17 (1 x 17) | - | 0.100" (2.54mm) | Wire Wrap | SIP | |
Aries Electronics
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Tin | 50.0µin (1.27µm) | Phosphor Bronze | - | Polyamide (PA46), Nylon 4/6, Glass Filled | Through Hole | 38 (1 x 38) | -55°C ~ 105°C | 0.100" (2.54mm) | Solder | SIP | |
Aries Electronics
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Tin | 10.0µin (0.25µm) | Beryllium Copper | Open Frame | Polyamide (PA46), Nylon 4/6, Glass Filled | Through Hole | 24 (2 x 12) | - | 0.100" (2.54mm) | Solder | DIP, 0.3" (7.62mm) Row Spacing | |
Preci-Dip
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Tin | 29.5µin (0.75µm) | Beryllium Copper | Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Through Hole | 192 (16 x 16) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | PGA | |
Preci-Dip
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Tin | 29.5µin (0.75µm) | Beryllium Copper | Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Through Hole | 192 (17 x 17) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | PGA | |
Aries Electronics
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Tin | 10.0µin (0.25µm) | Beryllium Copper | - | Polyamide (PA46), Nylon 4/6 | Through Hole | 21 (1 x 21) | -55°C ~ 105°C | 0.100" (2.54mm) | Wire Wrap | SIP | |
Aries Electronics
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Tin | 10.0µin (0.25µm) | Beryllium Copper | - | Polyamide (PA46), Nylon 4/6 | Through Hole | 21 (1 x 21) | -55°C ~ 105°C | 0.100" (2.54mm) | Wire Wrap | SIP | |
Preci-Dip
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Tin | Flash | Beryllium Copper | Closed Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Through Hole | 324 (18 x 18) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | PGA | |
Aries Electronics
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Tin | 200.0µin (5.08µm) | Phosphor Bronze | - | Polyamide (PA46), Nylon 4/6, Glass Filled | Through Hole | 11 (1 x 11) | -55°C ~ 105°C | 0.100" (2.54mm) | Wire Wrap | SIP | |
Aries Electronics
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Tin | 200.0µin (5.08µm) | Phosphor Bronze | - | Polyamide (PA46), Nylon 4/6, Glass Filled | Through Hole | 11 (1 x 11) | -55°C ~ 105°C | 0.100" (2.54mm) | Wire Wrap | SIP | |
Aries Electronics
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Gold | 10.0µin (0.25µm) | Beryllium Copper | Closed Frame | Polyamide (PA46), Nylon 4/6, Glass Filled | Through Hole | 16 (2 x 8) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | DIP, 0.3" (7.62mm) Row Spacing | |
Mill-Max Manufacturing
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Tin-Lead | 30.0µin (0.76µm) | Beryllium Copper | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole | 53 (1 x 53) | -55°C ~ 125°C | 0.100" (2.54mm) | Press-Fit | SIP | |
Mill-Max Manufacturing
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Tin | 30.0µin (0.76µm) | Beryllium Copper | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole | 53 (1 x 53) | -55°C ~ 125°C | 0.100" (2.54mm) | Press-Fit | SIP | |
Preci-Dip
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Tin | 29.5µin (0.75µm) | Beryllium Copper | Carrier, Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Through Hole | 69 (11 x 11) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | PGA | |
Aries Electronics
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Gold | 10.0µin (0.25µm) | Phosphor Bronze | Closed Frame | Polyamide (PA46), Nylon 4/6, Glass Filled | Through Hole | 16 (2 x 8) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | DIP, 0.6" (15.24mm) Row Spacing | |
Mill-Max Manufacturing
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Gold | 30.0µin (0.76µm) | Beryllium Copper | Carrier | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole | 36 (1 x 36) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | SIP | |
Aries Electronics
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Tin | 200.0µin (5.08µm) | Phosphor Bronze | Closed Frame | Polyamide (PA46), Nylon 4/6, Glass Filled | Through Hole | 28 (2 x 14) | -55°C ~ 125°C | 0.100" (2.54mm) | Wire Wrap | DIP, 0.6" (15.24mm) Row Spacing | |
Aries Electronics
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Tin | 200.0µin (5.08µm) | Phosphor Bronze | Closed Frame | Polyamide (PA46), Nylon 4/6, Glass Filled | Through Hole | 28 (2 x 14) | -55°C ~ 105°C | 0.100" (2.54mm) | Wire Wrap | DIP, 0.6" (15.24mm) Row Spacing | |
Aries Electronics
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Tin | 200.0µin (5.08µm) | Phosphor Bronze | Elevated | Polyamide (PA46), Nylon 4/6, Glass Filled | Through Hole | 6 (1 x 6) | -55°C ~ 105°C | 0.100" (2.54mm) | Solder | SIP | |
Aries Electronics
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Tin | 200.0µin (5.08µm) | Phosphor Bronze | Elevated | Polyamide (PA46), Nylon 4/6, Glass Filled | Through Hole | 6 (1 x 6) | -55°C ~ 105°C | 0.100" (2.54mm) | Solder | SIP | |
Aries Electronics
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Tin | 200.0µin (5.08µm) | Phosphor Bronze | Elevated | Polyamide (PA46), Nylon 4/6, Glass Filled | Through Hole | 6 (1 x 6) | -55°C ~ 105°C | 0.100" (2.54mm) | Solder | SIP | |
Aries Electronics
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Tin | 200.0µin (5.08µm) | Phosphor Bronze | Elevated | Polyamide (PA46), Nylon 4/6, Glass Filled | Through Hole | 6 (1 x 6) | -55°C ~ 105°C | 0.100" (2.54mm) | Solder | SIP | |
Aries Electronics
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Gold | 10.0µin (0.25µm) | Beryllium Copper | Closed Frame | Polyamide (PA46), Nylon 4/6, Glass Filled | Through Hole | 28 (2 x 14) | -55°C ~ 105°C | 0.100" (2.54mm) | Solder | DIP, 0.3" (7.62mm) Row Spacing | |
Aries Electronics
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Tin | 10.0µin (0.25µm) | Beryllium Copper | Closed Frame | Polyamide (PA46), Nylon 4/6, Glass Filled | Through Hole | 64 (2 x 32) | -55°C ~ 105°C | 0.100" (2.54mm) | Solder | DIP, 0.9" (22.86mm) Row Spacing | |
Aries Electronics
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Gold | 10.0µin (0.25µm) | Beryllium Copper | Open Frame | Polyamide (PA46), Nylon 4/6, Glass Filled | Through Hole | 24 (2 x 12) | - | 0.100" (2.54mm) | Solder | DIP, 0.6" (15.24mm) Row Spacing | |
Aries Electronics
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Gold | 10.0µin (0.25µm) | Beryllium Copper | Closed Frame | Polyamide (PA46), Nylon 4/6, Glass Filled | Through Hole | 10 (2 x 5) | -55°C ~ 125°C | 0.100" (2.54mm) | Wire Wrap | DIP, 0.3" (7.62mm) Row Spacing | |
Aries Electronics
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Gold | 10.0µin (0.25µm) | Beryllium Copper | Closed Frame | Polyamide (PA46), Nylon 4/6, Glass Filled | Through Hole | 10 (2 x 5) | -55°C ~ 125°C | 0.100" (2.54mm) | Wire Wrap | DIP, 0.3" (7.62mm) Row Spacing | |
TE Connectivity
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Silver | - | Beryllium Copper | Closed Frame | Polytetrafluoroethylene (PTFE) | Chassis Mount | 3 (Oval) | -55°C ~ 125°C | - | Solder | Transistor, TO-3 | |
Preci-Dip
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Tin | Flash | Beryllium Copper | Carrier, Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Through Hole | 85 (11 x 11) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | PGA | |
Aries Electronics
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Gold | 10.0µin (0.25µm) | Beryllium Copper | - | Polyamide (PA46), Nylon 4/6 | Through Hole | 11 (1 x 11) | -55°C ~ 125°C | 0.100" (2.54mm) | Wire Wrap | SIP | |
Aries Electronics
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Gold | 10.0µin (0.25µm) | Beryllium Copper | - | Polyamide (PA46), Nylon 4/6 | Through Hole | 11 (1 x 11) | -55°C ~ 125°C | 0.100" (2.54mm) | Wire Wrap | SIP | |
Aries Electronics
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Gold | 30.0µin (0.76µm) | Beryllium Copper | Closed Frame, Elevated | Polyamide (PA46), Nylon 4/6, Glass Filled | Through Hole | 12 (2 x 6) | -55°C ~ 105°C | 0.100" (2.54mm) | Solder | DIP, 0.3" (7.62mm) Row Spacing | |
Aries Electronics
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Gold | 30.0µin (0.76µm) | Beryllium Copper | Closed Frame, Elevated | Polyamide (PA46), Nylon 4/6, Glass Filled | Through Hole | 12 (2 x 6) | -55°C ~ 105°C | 0.100" (2.54mm) | Solder | DIP, 0.3" (7.62mm) Row Spacing | |
Aries Electronics
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Gold | 30.0µin (0.76µm) | Beryllium Copper | Closed Frame, Elevated | Polyamide (PA46), Nylon 4/6, Glass Filled | Through Hole | 12 (2 x 6) | -55°C ~ 105°C | 0.100" (2.54mm) | Solder | DIP, 0.3" (7.62mm) Row Spacing | |
Aries Electronics
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Gold | 30.0µin (0.76µm) | Beryllium Copper | Closed Frame, Elevated | Polyamide (PA46), Nylon 4/6, Glass Filled | Through Hole | 12 (2 x 6) | -55°C ~ 105°C | 0.100" (2.54mm) | Solder | DIP, 0.3" (7.62mm) Row Spacing | |
Aries Electronics
|
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Gold | 30.0µin (0.76µm) | Beryllium Copper | Closed Frame, Elevated | Polyamide (PA46), Nylon 4/6, Glass Filled | Through Hole | 12 (2 x 6) | -55°C ~ 105°C | 0.100" (2.54mm) | Solder | DIP, 0.3" (7.62mm) Row Spacing | |
Aries Electronics
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Gold | 30.0µin (0.76µm) | Beryllium Copper | Closed Frame, Elevated | Polyamide (PA46), Nylon 4/6, Glass Filled | Through Hole | 12 (2 x 6) | -55°C ~ 105°C | 0.100" (2.54mm) | Solder | DIP, 0.3" (7.62mm) Row Spacing | |
Aries Electronics
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Gold | 30.0µin (0.76µm) | Beryllium Copper | Closed Frame, Elevated | Polyamide (PA46), Nylon 4/6, Glass Filled | Through Hole | 12 (2 x 6) | -55°C ~ 105°C | 0.100" (2.54mm) | Solder | DIP, 0.3" (7.62mm) Row Spacing | |
Aries Electronics
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Tin | 30.0µin (0.76µm) | Beryllium Copper | - | Polyamide (PA46), Nylon 4/6, Glass Filled | Through Hole, Right Angle | 23 (1 x 23) | - | - | Solder | SIP | |
Preci-Dip
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Tin | Flash | Beryllium Copper | Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Through Hole | 299 (20 x 20) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | PGA | |
Preci-Dip
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Tin | Flash | Beryllium Copper | Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Through Hole | 299 (20 x 20) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | PGA | |
Aries Electronics
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Tin | 50.0µin (1.27µm) | Phosphor Bronze | - | Polyamide (PA46), Nylon 4/6, Glass Filled | Through Hole | 39 (1 x 39) | -55°C ~ 105°C | 0.100" (2.54mm) | Solder | SIP | |
Aries Electronics
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Tin | 200.0µin (5.08µm) | Phosphor Bronze | Closed Frame | Polyamide (PA46), Nylon 4/6 | Through Hole, Right Angle, Horizontal | 16 (2 x 8) | - | 0.100" (2.54mm) | Solder | DIP, 0.3" (7.62mm) Row Spacing | |
Aries Electronics
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Tin | 200.0µin (5.08µm) | Phosphor Bronze | Closed Frame | Polyamide (PA46), Nylon 4/6 | Through Hole, Right Angle, Horizontal | 16 (2 x 8) | - | 0.100" (2.54mm) | Solder | DIP, 0.3" (7.62mm) Row Spacing | |
Aries Electronics
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Tin | 200.0µin (5.08µm) | Phosphor Bronze | Closed Frame | Polyamide (PA46), Nylon 4/6 | Through Hole, Right Angle, Horizontal | 16 (2 x 8) | - | 0.100" (2.54mm) | Solder | DIP, 0.3" (7.62mm) Row Spacing | |
Preci-Dip
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Tin | Flash | Beryllium Copper | Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Through Hole | 300 (21 x 21) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | PGA | |
Aries Electronics
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Tin | 10.0µin (0.25µm) | Beryllium Copper | Closed Frame | Polyamide (PA46), Nylon 4/6, Glass Filled | Through Hole | 18 (2 x 9) | -55°C ~ 105°C | 0.100" (2.54mm) | Wire Wrap | DIP, 0.6" (15.24mm) Row Spacing | |
Aries Electronics
|
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Price on request
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Tin | 10.0µin (0.25µm) | Beryllium Copper | Closed Frame | Polyamide (PA46), Nylon 4/6, Glass Filled | Through Hole | 18 (2 x 9) | -55°C ~ 105°C | 0.100" (2.54mm) | Wire Wrap | DIP, 0.6" (15.24mm) Row Spacing |