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| Part & Mfr | Total Stock | Pricing & RFQ | Contact Finish | Contact Finish Thickness | Contact Material | Features | Housing Material | Mounting Type | Number of Positions or Pins (Grid) | Operating Temperature | Pitch | Termination | Type | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics
|
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Tin | 200.0µin (5.08µm) | Phosphor Bronze | Elevated | Polyamide (PA46), Nylon 4/6, Glass Filled | Through Hole | 8 (1 x 8) | -55°C ~ 105°C | 0.100" (2.54mm) | Solder | SIP | |
Aries Electronics
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Tin | 200.0µin (5.08µm) | Phosphor Bronze | Elevated | Polyamide (PA46), Nylon 4/6, Glass Filled | Through Hole | 8 (1 x 8) | -55°C ~ 105°C | 0.100" (2.54mm) | Solder | SIP | |
Aries Electronics
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Gold | 10.0µin (0.25µm) | Phosphor Bronze | Elevated | Polyamide (PA46), Nylon 4/6, Glass Filled | Through Hole | 8 (1 x 8) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | SIP | |
Aries Electronics
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Tin | 200.0µin (5.08µm) | Phosphor Bronze | Elevated | Polyamide (PA46), Nylon 4/6, Glass Filled | Through Hole | 8 (1 x 8) | -55°C ~ 105°C | 0.100" (2.54mm) | Solder | SIP | |
Aries Electronics
|
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Tin | 200.0µin (5.08µm) | Phosphor Bronze | Elevated | Polyamide (PA46), Nylon 4/6, Glass Filled | Through Hole | 8 (1 x 8) | -55°C ~ 105°C | 0.100" (2.54mm) | Solder | SIP | |
Aries Electronics
|
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Tin | 200.0µin (5.08µm) | Phosphor Bronze | Elevated | Polyamide (PA46), Nylon 4/6, Glass Filled | Through Hole | 8 (1 x 8) | -55°C ~ 105°C | 0.100" (2.54mm) | Solder | SIP | |
Aries Electronics
|
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Tin | 200.0µin (5.08µm) | Phosphor Bronze | Elevated | Polyamide (PA46), Nylon 4/6, Glass Filled | Through Hole | 8 (1 x 8) | -55°C ~ 105°C | 0.100" (2.54mm) | Solder | SIP | |
Aries Electronics
|
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Price on request
Price and Stock
on Request Send RFQ |
Tin | 200.0µin (5.08µm) | Phosphor Bronze | Elevated | Polyamide (PA46), Nylon 4/6, Glass Filled | Through Hole | 8 (1 x 8) | -55°C ~ 105°C | 0.100" (2.54mm) | Solder | SIP | |
Aries Electronics
|
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Price on request
Price and Stock
on Request Send RFQ |
Tin | 200.0µin (5.08µm) | Phosphor Bronze | Elevated | Polyamide (PA46), Nylon 4/6, Glass Filled | Through Hole | 8 (1 x 8) | -55°C ~ 105°C | 0.100" (2.54mm) | Solder | SIP | |
Mill-Max Manufacturing
|
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- | - | - | - | - | - | - | - | - | - | - | |
Aries Electronics
|
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Price on request
Price and Stock
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Tin | 200.0µin (5.08µm) | Phosphor Bronze | Elevated | Polyamide (PA46), Nylon 4/6, Glass Filled | Through Hole | 8 (1 x 8) | -55°C ~ 105°C | 0.100" (2.54mm) | Solder | SIP | |
Aries Electronics
|
Send RFQ |
Price on request
Price and Stock
on Request Send RFQ |
Tin | 200.0µin (5.08µm) | Phosphor Bronze | Elevated | Polyamide (PA46), Nylon 4/6, Glass Filled | Through Hole | 8 (1 x 8) | -55°C ~ 105°C | 0.100" (2.54mm) | Solder | SIP | |
Aries Electronics
|
Send RFQ |
Price on request
Price and Stock
on Request Send RFQ |
Tin | 200.0µin (5.08µm) | Phosphor Bronze | Elevated | Polyamide (PA46), Nylon 4/6, Glass Filled | Through Hole | 8 (1 x 8) | -55°C ~ 105°C | 0.100" (2.54mm) | Solder | SIP | |
Aries Electronics
|
Send RFQ |
Price on request
Price and Stock
on Request Send RFQ |
Tin | 200.0µin (5.08µm) | Phosphor Bronze | Elevated | Polyamide (PA46), Nylon 4/6, Glass Filled | Through Hole | 8 (1 x 8) | -55°C ~ 105°C | 0.100" (2.54mm) | Solder | SIP | |
Aries Electronics
|
Send RFQ |
Price on request
Price and Stock
on Request Send RFQ |
Tin | 200.0µin (5.08µm) | Phosphor Bronze | Elevated | Polyamide (PA46), Nylon 4/6, Glass Filled | Through Hole | 8 (1 x 8) | -55°C ~ 105°C | 0.100" (2.54mm) | Solder | SIP | |
Aries Electronics
|
Send RFQ |
Price on request
Price and Stock
on Request Send RFQ |
Tin | 200.0µin (5.08µm) | Phosphor Bronze | Elevated | Polyamide (PA46), Nylon 4/6, Glass Filled | Through Hole | 8 (1 x 8) | -55°C ~ 105°C | 0.100" (2.54mm) | Solder | SIP | |
Aries Electronics
|
Send RFQ |
Price on request
Price and Stock
on Request Send RFQ |
Tin | 200.0µin (5.08µm) | Phosphor Bronze | Elevated | Polyamide (PA46), Nylon 4/6, Glass Filled | Through Hole | 8 (1 x 8) | -55°C ~ 105°C | 0.100" (2.54mm) | Solder | SIP | |
Aries Electronics
|
Send RFQ |
Price on request
Price and Stock
on Request Send RFQ |
Tin | 200.0µin (5.08µm) | Phosphor Bronze | Elevated | Polyamide (PA46), Nylon 4/6, Glass Filled | Through Hole | 8 (1 x 8) | -55°C ~ 105°C | 0.100" (2.54mm) | Solder | SIP | |
Aries Electronics
|
Send RFQ |
Price on request
Price and Stock
on Request Send RFQ |
Tin | 200.0µin (5.08µm) | Phosphor Bronze | Elevated | Polyamide (PA46), Nylon 4/6, Glass Filled | Through Hole | 8 (1 x 8) | -55°C ~ 105°C | 0.100" (2.54mm) | Solder | SIP | |
Aries Electronics
|
Send RFQ |
Price on request
Price and Stock
on Request Send RFQ |
Tin | 200.0µin (5.08µm) | Phosphor Bronze | Elevated | Polyamide (PA46), Nylon 4/6, Glass Filled | Through Hole | 8 (1 x 8) | -55°C ~ 105°C | 0.100" (2.54mm) | Solder | SIP | |
Aries Electronics
|
Send RFQ |
Price on request
Price and Stock
on Request Send RFQ |
Tin | 200.0µin (5.08µm) | Phosphor Bronze | Elevated | Polyamide (PA46), Nylon 4/6, Glass Filled | Through Hole | 8 (1 x 8) | -55°C ~ 105°C | 0.100" (2.54mm) | Solder | SIP | |
Aries Electronics
|
Send RFQ |
Price on request
Price and Stock
on Request Send RFQ |
Tin | 200.0µin (5.08µm) | Phosphor Bronze | Elevated | Polyamide (PA46), Nylon 4/6, Glass Filled | Through Hole | 8 (1 x 8) | -55°C ~ 105°C | 0.100" (2.54mm) | Solder | SIP | |
Aries Electronics
|
Send RFQ |
Price on request
Price and Stock
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Tin | 200.0µin (5.08µm) | Phosphor Bronze | Elevated | Polyamide (PA46), Nylon 4/6, Glass Filled | Through Hole | 8 (1 x 8) | -55°C ~ 105°C | 0.100" (2.54mm) | Solder | SIP | |
Samtec Inc.
|
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Tin | - | Phosphor Bronze | Open Frame | Polybutylene Terephthalate (PBT), Glass Filled | Through Hole | 22 (2 x 11) | - | 0.100" (2.54mm) | Solder | - | |
Mill-Max Manufacturing
|
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Tin-Lead | 30.0µin (0.76µm) | Beryllium Copper | Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Surface Mount | 4 (2 x 2) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | DIP, 0.3" (7.62mm) Row Spacing | |
Mill-Max Manufacturing
|
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Price on request
Price and Stock
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Tin | 30.0µin (0.76µm) | Beryllium Copper | Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Surface Mount | 4 (2 x 2) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | DIP, 0.3" (7.62mm) Row Spacing | |
Samtec Inc.
|
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Tin | 10.0µin (0.25µm) | Beryllium Copper | Open Frame | Polyester, Glass Filled | Through Hole | 32 (2 x 16) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | DIP, 0.6" (15.24mm) Row Spacing | |
Samtec Inc.
|
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Tin | 30.0µin (0.76µm) | Beryllium Copper | Open Frame | Polyester, Glass Filled | Through Hole | 32 (2 x 16) | -55°C ~ 105°C | 0.100" (2.54mm) | Solder | DIP, 0.6" (15.24mm) Row Spacing | |
Preci-Dip
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Tin | Flash | Beryllium Copper | Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Through Hole | 225 (17 x 17) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | PGA | |
Preci-Dip
|
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Tin | Flash | Beryllium Copper | Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Through Hole | 225 (17 x 17) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | PGA | |
Mill-Max Manufacturing
|
Send RFQ |
Price on request
Price and Stock
on Request Send RFQ |
- | - | - | - | - | - | - | - | - | - | - | |
Preci-Dip
|
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Tin | Flash | Beryllium Copper | Closed Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Through Hole | 225 (15 x 15) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | PGA | |
Preci-Dip
|
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Tin | Flash | Beryllium Copper | Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Through Hole | 225 (18 x 18) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | PGA | |
Preci-Dip
|
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Tin | Flash | Beryllium Copper | Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Through Hole | 225 (18 x 18) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | PGA | |
Preci-Dip
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Tin | 29.5µin (0.75µm) | Beryllium Copper | Elevated, Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Through Hole | 32 (2 x 16) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | DIP, 0.6" (15.24mm) Row Spacing | |
Aries Electronics
|
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Tin | 30.0µin (0.76µm) | Beryllium Copper | - | Polyamide (PA), Nylon, Glass Filled | Through Hole | 12 (1 x 12) | - | 0.100" (2.54mm) | Wire Wrap | SIP | |
Aries Electronics
|
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Tin | 30.0µin (0.76µm) | Beryllium Copper | - | Polyamide (PA), Nylon, Glass Filled | Through Hole | 12 (1 x 12) | - | 0.100" (2.54mm) | Wire Wrap | SIP | |
Aries Electronics
|
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Tin | 10.0µin (0.25µm) | Beryllium Copper | Open Frame | Polyamide (PA46), Nylon 4/6, Glass Filled | Surface Mount | 28 (1 x 28) | - | 0.100" (2.54mm) | Solder | SIP | |
Aries Electronics
|
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Tin | 10.0µin (0.25µm) | Beryllium Copper | Open Frame | Polyamide (PA46), Nylon 4/6, Glass Filled | Through Hole | 28 (2 x 14) | - | 0.100" (2.54mm) | Solder | DIP, 0.2" (5.08mm) Row Spacing | |
Aries Electronics
|
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Gold | 10.0µin (0.25µm) | Beryllium Copper | Open Frame | Polyamide (PA46), Nylon 4/6, Glass Filled | Through Hole | 24 (1 x 24) | - | 0.100" (2.54mm) | Solder | SIP | |
Aries Electronics
|
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Price on request
Price and Stock
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Gold | 10.0µin (0.25µm) | Beryllium Copper | Open Frame | Polyamide (PA46), Nylon 4/6, Glass Filled | Through Hole | 24 (2 x 12) | - | 0.100" (2.54mm) | Solder | DIP, 0.2" (5.08mm) Row Spacing | |
Mill-Max Manufacturing
|
Send RFQ |
Price on request
Price and Stock
on Request Send RFQ |
- | - | - | - | - | - | - | - | - | - | - | |
Preci-Dip
|
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Price on request
Price and Stock
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Tin | 29.5µin (0.75µm) | Beryllium Copper | Elevated, Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Through Hole | 50 (2 x 25) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | DIP, 0.6" (15.24mm) Row Spacing | |
Preci-Dip
|
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Price on request
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Tin | Flash | Beryllium Copper | Elevated, Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Through Hole | 50 (2 x 25) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | DIP, 0.6" (15.24mm) Row Spacing | |
Aries Electronics
|
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Gold | 10.0µin (0.25µm) | Phosphor Bronze | - | Polyamide (PA46), Nylon 4/6, Glass Filled | Through Hole | 2 (1 x 2) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | SIP | |
Aries Electronics
|
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Gold | 10.0µin (0.25µm) | Beryllium Copper | Closed Frame | Polyamide (PA46), Nylon 4/6, Glass Filled | Through Hole | 6 (2 x 3) | -55°C ~ 125°C | 0.100" (2.54mm) | Wire Wrap | DIP, 0.2" (5.08mm) Row Spacing | |
Aries Electronics
|
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Gold | 10.0µin (0.25µm) | Beryllium Copper | Closed Frame | Polyamide (PA46), Nylon 4/6, Glass Filled | Through Hole | 6 (2 x 3) | -55°C ~ 125°C | 0.100" (2.54mm) | Wire Wrap | DIP, 0.2" (5.08mm) Row Spacing | |
Aries Electronics
|
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Tin | 10.0µin (0.25µm) | Beryllium Copper | Closed Frame | Polyamide (PA46), Nylon 4/6, Glass Filled | Through Hole | 12 (2 x 6) | -55°C ~ 105°C | 0.100" (2.54mm) | Wire Wrap | DIP, 0.6" (15.24mm) Row Spacing | |
Aries Electronics
|
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Tin | 10.0µin (0.25µm) | Beryllium Copper | Closed Frame | Polyamide (PA46), Nylon 4/6, Glass Filled | Through Hole | 12 (2 x 6) | -55°C ~ 105°C | 0.100" (2.54mm) | Wire Wrap | DIP, 0.6" (15.24mm) Row Spacing | |
Aries Electronics
|
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Tin | 10.0µin (0.25µm) | Beryllium Copper | Open Frame | Polyamide (PA46), Nylon 4/6, Glass Filled | Through Hole | 32 (2 x 16) | - | 0.100" (2.54mm) | Solder | DIP, 0.6" (15.24mm) Row Spacing |