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| Part & Mfr | Total Stock | Pricing & RFQ | Contact Finish | Contact Finish Thickness | Contact Material | Features | Housing Material | Mounting Type | Number of Positions or Pins (Grid) | Operating Temperature | Pitch | Termination | Type | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics
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Gold | 10.0µin (0.25µm) | Beryllium Copper | Open Frame | Polyamide (PA46), Nylon 4/6, Glass Filled | Through Hole | 30 (2 x 15) | - | 0.100" (2.54mm) | Solder | DIP, 0.2" (5.08mm) Row Spacing | |
Aries Electronics
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Gold | 30.0µin (0.76µm) | Beryllium Copper | Closed Frame, Elevated | Polyamide (PA46), Nylon 4/6, Glass Filled | Through Hole | 10 (2 x 5) | -55°C ~ 105°C | 0.100" (2.54mm) | Solder | DIP, 0.3" (7.62mm) Row Spacing | |
Preci-Dip
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Gold | 10.0µin (0.25µm) | Brass | Closed Frame | FR4 Epoxy Glass | Surface Mount | 520 (31 x 31) | -55°C ~ 125°C | 0.050" (1.27mm) | Solder | BGA | |
Aries Electronics
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Gold | 30.0µin (0.76µm) | Beryllium Copper | Closed Frame, Elevated | Polyamide (PA46), Nylon 4/6, Glass Filled | Through Hole | 10 (2 x 5) | -55°C ~ 105°C | 0.100" (2.54mm) | Solder | DIP, 0.3" (7.62mm) Row Spacing | |
Aries Electronics
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Gold | 30.0µin (0.76µm) | Beryllium Copper | Closed Frame, Elevated | Polyamide (PA46), Nylon 4/6, Glass Filled | Through Hole | 10 (2 x 5) | -55°C ~ 105°C | 0.100" (2.54mm) | Solder | DIP, 0.3" (7.62mm) Row Spacing | |
Aries Electronics
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Gold | 30.0µin (0.76µm) | Beryllium Copper | Closed Frame, Elevated | Polyamide (PA46), Nylon 4/6, Glass Filled | Through Hole | 10 (2 x 5) | -55°C ~ 105°C | 0.100" (2.54mm) | Solder | DIP, 0.3" (7.62mm) Row Spacing | |
Aries Electronics
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Gold | 30.0µin (0.76µm) | Beryllium Copper | Closed Frame, Elevated | Polyamide (PA46), Nylon 4/6, Glass Filled | Through Hole | 10 (2 x 5) | -55°C ~ 105°C | 0.100" (2.54mm) | Solder | DIP, 0.3" (7.62mm) Row Spacing | |
Aries Electronics
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Gold | 30.0µin (0.76µm) | Beryllium Copper | Closed Frame, Elevated | Polyamide (PA46), Nylon 4/6, Glass Filled | Through Hole | 10 (2 x 5) | -55°C ~ 105°C | 0.100" (2.54mm) | Solder | DIP, 0.3" (7.62mm) Row Spacing | |
Aries Electronics
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Gold | 30.0µin (0.76µm) | Beryllium Copper | Closed Frame, Elevated | Polyamide (PA46), Nylon 4/6, Glass Filled | Through Hole | 10 (2 x 5) | -55°C ~ 105°C | 0.100" (2.54mm) | Solder | DIP, 0.3" (7.62mm) Row Spacing | |
Aries Electronics
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Gold | 30.0µin (0.76µm) | Beryllium Copper | Closed Frame, Elevated | Polyamide (PA46), Nylon 4/6, Glass Filled | Through Hole | 10 (2 x 5) | -55°C ~ 105°C | 0.100" (2.54mm) | Solder | DIP, 0.3" (7.62mm) Row Spacing | |
Aries Electronics
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Gold | 30.0µin (0.76µm) | Beryllium Copper | Closed Frame, Elevated | Polyamide (PA46), Nylon 4/6, Glass Filled | Through Hole | 10 (2 x 5) | -55°C ~ 105°C | 0.100" (2.54mm) | Solder | DIP, 0.3" (7.62mm) Row Spacing | |
Aries Electronics
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Tin | 200.0µin (5.08µm) | Phosphor Bronze | Closed Frame | Polyamide (PA46), Nylon 4/6 | Through Hole, Right Angle, Horizontal | 16 (2 x 8) | 105°C | 0.100" (2.54mm) | Solder | DIP, 0.3" (7.62mm) Row Spacing | |
Preci-Dip
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Tin | Flash | Beryllium Copper | Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Through Hole | 238 (19 x 19) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | PGA | |
Preci-Dip
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Tin | 29.5µin (0.75µm) | Beryllium Copper | Elevated, Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Through Hole | 52 (2 x 26) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | DIP, 0.6" (15.24mm) Row Spacing | |
Samtec Inc.
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Tin | 30.0µin (0.76µm) | Beryllium Copper | Open Frame | Polyester, Glass Filled | Through Hole | 28 (2 x 14) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | DIP, 0.6" (15.24mm) Row Spacing | |
Omron
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- | - | - | - | - | - | - | - | - | - | - | |
Preci-Dip
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Tin | 29.5µin (0.75µm) | Beryllium Copper | Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Through Hole | 169 (17 x 17) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | PGA | |
Aries Electronics
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Gold | 10.0µin (0.25µm) | Phosphor Bronze | - | Polyamide (PA46), Nylon 4/6, Glass Filled | Through Hole | 6 (1 x 6) | -55°C ~ 125°C | 0.100" (2.54mm) | Wire Wrap | SIP | |
Aries Electronics
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Gold | 10.0µin (0.25µm) | Phosphor Bronze | - | Polyamide (PA46), Nylon 4/6, Glass Filled | Through Hole | 6 (1 x 6) | -55°C ~ 125°C | 0.100" (2.54mm) | Wire Wrap | SIP | |
Aries Electronics
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Tin | 30.0µin (0.76µm) | Beryllium Copper | - | Polyamide (PA), Nylon, Glass Filled | Through Hole | 15 (1 x 15) | - | 0.100" (2.54mm) | Wire Wrap | SIP | |
Aries Electronics
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Tin | 30.0µin (0.76µm) | Beryllium Copper | - | Polyamide (PA), Nylon, Glass Filled | Through Hole | 15 (1 x 15) | - | 0.100" (2.54mm) | Wire Wrap | SIP | |
Mill-Max Manufacturing
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Tin-Lead | 30.0µin (0.76µm) | Beryllium Copper | Elevated, Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole | 4 (2 x 2) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | DIP, 0.3" (7.62mm) Row Spacing | |
Preci-Dip
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Tin | 29.5µin (0.75µm) | Beryllium Copper | Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Through Hole | 172 (16 x 16) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | PGA | |
Mill-Max Manufacturing
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Tin | 30.0µin (0.76µm) | Beryllium Copper | Elevated, Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole | 4 (2 x 2) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | DIP, 0.3" (7.62mm) Row Spacing | |
Samtec Inc.
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Tin | 10.0µin (0.25µm) | Beryllium Copper | Open Frame | Polyester | Through Hole | 40 (2 x 20) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | DIP, 0.6" (15.24mm) Row Spacing | |
Aries Electronics
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Gold | 10.0µin (0.25µm) | Beryllium Copper | Open Frame | Polyamide (PA46), Nylon 4/6, Glass Filled | Through Hole | 20 (2 x 10) | - | 0.100" (2.54mm) | Solder | DIP, 0.4" (10.16mm) Row Spacing | |
Aries Electronics
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Tin | 30.0µin (0.76µm) | Beryllium Copper | - | Polyamide (PA46), Nylon 4/6, Glass Filled | Through Hole, Right Angle | 20 (1 x 20) | - | - | Solder | SIP | |
Aries Electronics
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Tin | 10.0µin (0.25µm) | Beryllium Copper | Open Frame | Polyamide (PA46), Nylon 4/6, Glass Filled | Through Hole | 18 (2 x 9) | - | 0.100" (2.54mm) | Solder | DIP, 0.3" (7.62mm) Row Spacing | |
Mill-Max Manufacturing
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Tin | Flash | Beryllium Copper | Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole | 4 (2 x 2) | -55°C ~ 125°C | 0.100" (2.54mm) | Wire Wrap | DIP, 0.3" (7.62mm) Row Spacing | |
Preci-Dip
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Tin | 29.5µin (0.75µm) | Beryllium Copper | Elevated, Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Through Hole | 48 (2 x 24) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | DIP, 0.6" (15.24mm) Row Spacing | |
Mill-Max Manufacturing
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Tin | 10.0µin (0.25µm) | Beryllium Copper | Carrier, Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole | 4 (2 x 2) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | DIP, 0.3" (7.62mm) Row Spacing | |
Mill-Max Manufacturing
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Tin | 30.0µin (0.76µm) | Beryllium Copper | Carrier, Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole | 4 (2 x 2) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | DIP, 0.3" (7.62mm) Row Spacing | |
Aries Electronics
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Gold | 30.0µin (0.76µm) | Beryllium Copper | - | Polyamide (PA), Nylon, Glass Filled | Through Hole | 10 (1 x 10) | - | 0.100" (2.54mm) | Wire Wrap | SIP | |
Mill-Max Manufacturing
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Tin-Lead | 10.0µin (0.25µm) | Beryllium Copper | Carrier, Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole | 4 (2 x 2) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | DIP, 0.3" (7.62mm) Row Spacing | |
Aries Electronics
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Tin | 10.0µin (0.25µm) | Beryllium Copper | Open Frame | Polyamide (PA46), Nylon 4/6, Glass Filled | Surface Mount | 35 (1 x 35) | - | 0.100" (2.54mm) | Solder | SIP | |
Preci-Dip
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Tin | Flash | Beryllium Copper | Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Through Hole | 241 (19 x 19) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | PGA | |
Mill-Max Manufacturing
|
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Gold | 30.0µin (0.76µm) | Beryllium Copper | Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole | 4 (2 x 2) | -55°C ~ 125°C | 0.100" (2.54mm) | Wire Wrap | DIP, 0.3" (7.62mm) Row Spacing | |
Mill-Max Manufacturing
|
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Tin | 30.0µin (0.76µm) | Beryllium Copper | Carrier, Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole | 4 (2 x 2) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | DIP, 0.3" (7.62mm) Row Spacing | |
Mill-Max Manufacturing
|
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Tin-Lead | 30.0µin (0.76µm) | Beryllium Copper | Carrier, Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole | 4 (2 x 2) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | DIP, 0.3" (7.62mm) Row Spacing | |
Mill-Max Manufacturing
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Gold | 30.0µin (0.76µm) | Beryllium Copper | Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole | 28 (2 x 14) | -55°C ~ 125°C | 0.100" (2.54mm) | Wire Wrap | DIP, 0.6" (15.24mm) Row Spacing | |
Mill-Max Manufacturing
|
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Gold | 30.0µin (0.76µm) | Beryllium Copper | Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole | 4 (2 x 2) | -55°C ~ 125°C | 0.100" (2.54mm) | Wire Wrap | DIP, 0.3" (7.62mm) Row Spacing | |
Mill-Max Manufacturing
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Tin-Lead | 30.0µin (0.76µm) | Beryllium Copper | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole | 47 (1 x 47) | -55°C ~ 125°C | 0.100" (2.54mm) | Press-Fit | SIP | |
Mill-Max Manufacturing
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Tin | 30.0µin (0.76µm) | Beryllium Copper | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole | 47 (1 x 47) | -55°C ~ 125°C | 0.100" (2.54mm) | Press-Fit | SIP | |
Mill-Max Manufacturing
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Tin | 10.0µin (0.25µm) | Beryllium Copper | Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole | 4 (2 x 2) | -55°C ~ 125°C | 0.100" (2.54mm) | Wire Wrap | DIP, 0.3" (7.62mm) Row Spacing | |
Mill-Max Manufacturing
|
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Tin-Lead | 30.0µin (0.76µm) | Beryllium Copper | Elevated, Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole | 4 (2 x 2) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | DIP, 0.3" (7.62mm) Row Spacing | |
Mill-Max Manufacturing
|
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Tin | 30.0µin (0.76µm) | Beryllium Copper | Elevated, Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole | 4 (2 x 2) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | DIP, 0.3" (7.62mm) Row Spacing | |
Preci-Dip
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Tin | 29.5µin (0.75µm) | Beryllium Copper | Elevated, Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Through Hole | 42 (2 x 21) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | DIP, 0.6" (15.24mm) Row Spacing | |
Samtec Inc.
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Tin | - | Phosphor Bronze | Open Frame | Polybutylene Terephthalate (PBT), Glass Filled | Through Hole | 20 (2 x 10) | - | 0.100" (2.54mm) | Solder | - | |
Preci-Dip
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Tin | Flash | Beryllium Copper | Closed Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Through Hole | 289 (17 x 17) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | PGA | |
Preci-Dip
|
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Tin | Flash | Beryllium Copper | Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Through Hole | 223 (18 x 18) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | PGA |