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| Part & Mfr | Total Stock | Pricing & RFQ | Contact Finish | Contact Finish Thickness | Contact Material | Features | Housing Material | Mounting Type | Number of Positions or Pins (Grid) | Operating Temperature | Pitch | Termination | Type | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics
|
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Gold | 30.0µin (0.76µm) | Beryllium Copper | Closed Frame, Elevated | Polyamide (PA46), Nylon 4/6, Glass Filled | Through Hole | 16 (2 x 8) | -55°C ~ 105°C | 0.100" (2.54mm) | Solder | DIP, 0.3" (7.62mm) Row Spacing | |
Aries Electronics
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Gold | 30.0µin (0.76µm) | Beryllium Copper | Closed Frame, Elevated | Polyamide (PA46), Nylon 4/6, Glass Filled | Through Hole | 16 (2 x 8) | -55°C ~ 105°C | 0.100" (2.54mm) | Solder | DIP, 0.3" (7.62mm) Row Spacing | |
Aries Electronics
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Gold | 30.0µin (0.76µm) | Beryllium Copper | Closed Frame, Elevated | Polyamide (PA46), Nylon 4/6, Glass Filled | Through Hole | 16 (2 x 8) | -55°C ~ 105°C | 0.100" (2.54mm) | Solder | DIP, 0.3" (7.62mm) Row Spacing | |
Aries Electronics
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Gold | 30.0µin (0.76µm) | Beryllium Copper | Closed Frame, Elevated | Polyamide (PA46), Nylon 4/6, Glass Filled | Through Hole | 16 (2 x 8) | -55°C ~ 105°C | 0.100" (2.54mm) | Solder | DIP, 0.3" (7.62mm) Row Spacing | |
Aries Electronics
|
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Gold | 30.0µin (0.76µm) | Beryllium Copper | Closed Frame, Elevated | Polyamide (PA46), Nylon 4/6, Glass Filled | Through Hole | 16 (2 x 8) | -55°C ~ 105°C | 0.100" (2.54mm) | Solder | DIP, 0.3" (7.62mm) Row Spacing | |
Aries Electronics
|
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Gold | 30.0µin (0.76µm) | Beryllium Copper | Closed Frame, Elevated | Polyamide (PA46), Nylon 4/6, Glass Filled | Through Hole | 16 (2 x 8) | -55°C ~ 105°C | 0.100" (2.54mm) | Solder | DIP, 0.3" (7.62mm) Row Spacing | |
Aries Electronics
|
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Gold | 30.0µin (0.76µm) | Beryllium Copper | Closed Frame, Elevated | Polyamide (PA46), Nylon 4/6, Glass Filled | Through Hole | 16 (2 x 8) | -55°C ~ 105°C | 0.100" (2.54mm) | Solder | DIP, 0.3" (7.62mm) Row Spacing | |
Aries Electronics
|
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Gold | 30.0µin (0.76µm) | Beryllium Copper | Closed Frame, Elevated | Polyamide (PA46), Nylon 4/6, Glass Filled | Through Hole | 16 (2 x 8) | -55°C ~ 105°C | 0.100" (2.54mm) | Solder | DIP, 0.3" (7.62mm) Row Spacing | |
Aries Electronics
|
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Gold | 30.0µin (0.76µm) | Beryllium Copper | Closed Frame, Elevated | Polyamide (PA46), Nylon 4/6, Glass Filled | Through Hole | 16 (2 x 8) | -55°C ~ 105°C | 0.100" (2.54mm) | Solder | DIP, 0.3" (7.62mm) Row Spacing | |
Aries Electronics
|
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Price on request
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Gold | 30.0µin (0.76µm) | Beryllium Copper | Closed Frame, Elevated | Polyamide (PA46), Nylon 4/6, Glass Filled | Through Hole | 16 (2 x 8) | -55°C ~ 105°C | 0.100" (2.54mm) | Solder | DIP, 0.3" (7.62mm) Row Spacing | |
Aries Electronics
|
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Price on request
Price and Stock
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Gold | 30.0µin (0.76µm) | Beryllium Copper | Closed Frame, Elevated | Polyamide (PA46), Nylon 4/6, Glass Filled | Through Hole | 16 (2 x 8) | -55°C ~ 105°C | 0.100" (2.54mm) | Solder | DIP, 0.3" (7.62mm) Row Spacing | |
Aries Electronics
|
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Price on request
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Gold | 30.0µin (0.76µm) | Beryllium Copper | Closed Frame, Elevated | Polyamide (PA46), Nylon 4/6, Glass Filled | Through Hole | 16 (2 x 8) | -55°C ~ 105°C | 0.100" (2.54mm) | Solder | DIP, 0.3" (7.62mm) Row Spacing | |
Aries Electronics
|
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Price on request
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Gold | 30.0µin (0.76µm) | Beryllium Copper | Closed Frame, Elevated | Polyamide (PA46), Nylon 4/6, Glass Filled | Through Hole | 16 (2 x 8) | -55°C ~ 105°C | 0.100" (2.54mm) | Solder | DIP, 0.3" (7.62mm) Row Spacing | |
Aries Electronics
|
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Price on request
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Gold | 30.0µin (0.76µm) | Beryllium Copper | Closed Frame, Elevated | Polyamide (PA46), Nylon 4/6, Glass Filled | Through Hole | 16 (2 x 8) | -55°C ~ 105°C | 0.100" (2.54mm) | Solder | DIP, 0.3" (7.62mm) Row Spacing | |
Aries Electronics
|
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Price on request
Price and Stock
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Gold | 30.0µin (0.76µm) | Beryllium Copper | Closed Frame, Elevated | Polyamide (PA46), Nylon 4/6, Glass Filled | Through Hole | 16 (2 x 8) | -55°C ~ 105°C | 0.100" (2.54mm) | Solder | DIP, 0.3" (7.62mm) Row Spacing | |
Aries Electronics
|
Send RFQ |
Price on request
Price and Stock
on Request Send RFQ |
Gold | 30.0µin (0.76µm) | Beryllium Copper | Closed Frame, Elevated | Polyamide (PA46), Nylon 4/6, Glass Filled | Through Hole | 16 (2 x 8) | -55°C ~ 105°C | 0.100" (2.54mm) | Solder | DIP, 0.3" (7.62mm) Row Spacing | |
Aries Electronics
|
Send RFQ |
Price on request
Price and Stock
on Request Send RFQ |
Gold | 30.0µin (0.76µm) | Beryllium Copper | Closed Frame, Elevated | Polyamide (PA46), Nylon 4/6, Glass Filled | Through Hole | 16 (2 x 8) | -55°C ~ 105°C | 0.100" (2.54mm) | Solder | DIP, 0.3" (7.62mm) Row Spacing | |
Aries Electronics
|
Send RFQ |
Price on request
Price and Stock
on Request Send RFQ |
Gold | 30.0µin (0.76µm) | Beryllium Copper | Closed Frame, Elevated | Polyamide (PA46), Nylon 4/6, Glass Filled | Through Hole | 16 (2 x 8) | -55°C ~ 105°C | 0.100" (2.54mm) | Solder | DIP, 0.3" (7.62mm) Row Spacing | |
Aries Electronics
|
Send RFQ |
Price on request
Price and Stock
on Request Send RFQ |
Gold | 30.0µin (0.76µm) | Beryllium Copper | Closed Frame, Elevated | Polyamide (PA46), Nylon 4/6, Glass Filled | Through Hole | 16 (2 x 8) | -55°C ~ 105°C | 0.100" (2.54mm) | Solder | DIP, 0.3" (7.62mm) Row Spacing | |
Aries Electronics
|
Send RFQ |
Price on request
Price and Stock
on Request Send RFQ |
Gold | 30.0µin (0.76µm) | Beryllium Copper | Closed Frame, Elevated | Polyamide (PA46), Nylon 4/6, Glass Filled | Through Hole | 16 (2 x 8) | -55°C ~ 105°C | 0.100" (2.54mm) | Solder | DIP, 0.3" (7.62mm) Row Spacing | |
Aries Electronics
|
Send RFQ |
Price on request
Price and Stock
on Request Send RFQ |
Gold | 30.0µin (0.76µm) | Beryllium Copper | Closed Frame, Elevated | Polyamide (PA46), Nylon 4/6, Glass Filled | Through Hole | 16 (2 x 8) | -55°C ~ 105°C | 0.100" (2.54mm) | Solder | DIP, 0.3" (7.62mm) Row Spacing | |
Aries Electronics
|
Send RFQ |
Price on request
Price and Stock
on Request Send RFQ |
Gold | 30.0µin (0.76µm) | Beryllium Copper | Closed Frame, Elevated | Polyamide (PA46), Nylon 4/6, Glass Filled | Through Hole | 16 (2 x 8) | -55°C ~ 105°C | 0.100" (2.54mm) | Solder | DIP, 0.3" (7.62mm) Row Spacing | |
Aries Electronics
|
Send RFQ |
Price on request
Price and Stock
on Request Send RFQ |
Gold | 30.0µin (0.76µm) | Beryllium Copper | Closed Frame, Elevated | Polyamide (PA46), Nylon 4/6, Glass Filled | Through Hole | 16 (2 x 8) | -55°C ~ 105°C | 0.100" (2.54mm) | Solder | DIP, 0.3" (7.62mm) Row Spacing | |
Aries Electronics
|
Send RFQ |
Price on request
Price and Stock
on Request Send RFQ |
Gold | 30.0µin (0.76µm) | Beryllium Copper | Closed Frame, Elevated | Polyamide (PA46), Nylon 4/6, Glass Filled | Through Hole | 16 (2 x 8) | -55°C ~ 105°C | 0.100" (2.54mm) | Solder | DIP, 0.3" (7.62mm) Row Spacing | |
Preci-Dip
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Tin | 29.5µin (0.75µm) | Beryllium Copper | Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Through Hole | 224 (18 x 18) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | PGA | |
TE Connectivity
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Silver | - | Beryllium Copper | Closed Frame | Diallyl Phthalate (DAP) | Chassis Mount | 3 (Oval) | -55°C ~ 125°C | - | Solder | Transistor, TO-3 | |
3M Electronic Solutions
|
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Custom | Custom | - | Custom | - | Through Hole | Custom | - | 0.026" ~ 0.050" (0.65mm ~ 1.27mm) | - | BGA | |
Mill-Max Manufacturing
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Tin | Flash | Beryllium Copper | Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole | 10 (2 x 5) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | DIP, 0.3" (7.62mm) Row Spacing | |
Samtec Inc.
|
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Tin | - | Phosphor Bronze | Open Frame | Polybutylene Terephthalate (PBT), Glass Filled | Through Hole | 48 (2 x 24) | - | 0.100" (2.54mm) | Solder | - | |
Samtec Inc.
|
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Gold | 20.0µin (0.51µm) | Phosphor Bronze | Open Frame | Polybutylene Terephthalate (PBT), Glass Filled | Through Hole | 16 (2 x 8) | - | 0.100" (2.54mm) | Solder | - | |
Preci-Dip
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Tin | Flash | Beryllium Copper | Elevated, Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Through Hole | 50 (2 x 25) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | DIP, 0.6" (15.24mm) Row Spacing | |
Mill-Max Manufacturing
|
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Tin | Flash | Beryllium Copper | Closed Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole | 10 (2 x 5) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | DIP, 0.3" (7.62mm) Row Spacing | |
Preci-Dip
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Tin | 29.5µin (0.75µm) | Beryllium Copper | Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Through Hole | 225 (18 x 18) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | PGA | |
Preci-Dip
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Tin | 29.5µin (0.75µm) | Beryllium Copper | Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Through Hole | 225 (18 x 18) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | PGA | |
Mill-Max Manufacturing
|
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Tin | 30.0µin (0.76µm) | Beryllium Copper | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole | 4 (2 x 2) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | DIP, 0.3" (7.62mm) Row Spacing | |
Mill-Max Manufacturing
|
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Tin-Lead | 30.0µin (0.76µm) | Beryllium Copper | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole | 4 (2 x 2) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | DIP, 0.3" (7.62mm) Row Spacing | |
Preci-Dip
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Tin | 29.5µin (0.75µm) | Beryllium Copper | Carrier, Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Through Hole | 85 (11 x 11) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | PGA | |
Mill-Max Manufacturing
|
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Gold | 30.0µin (0.76µm) | Beryllium Copper | Carrier, Closed Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole | 38 (2 x 19) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | DIP, 0.1" (2.54mm) Row Spacing | |
Preci-Dip
|
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Tin | 29.5µin (0.75µm) | Beryllium Copper | Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Through Hole | 225 (17 x 17) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | PGA | |
Preci-Dip
|
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Tin | 29.5µin (0.75µm) | Beryllium Copper | Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Through Hole | 225 (17 x 17) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | PGA | |
Preci-Dip
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Tin | 29.5µin (0.75µm) | Beryllium Copper | Closed Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Through Hole | 225 (15 x 15) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | PGA | |
Preci-Dip
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Tin | - | Beryllium Copper | Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Through Hole | 100 (15 x 15) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | PGA | |
Mill-Max Manufacturing
|
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Tin-Lead | 30.0µin (0.76µm) | Beryllium Copper | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole | 62 (1 x 62) | -55°C ~ 125°C | 0.100" (2.54mm) | Press-Fit | SIP | |
Mill-Max Manufacturing
|
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Tin | 30.0µin (0.76µm) | Beryllium Copper | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole | 62 (1 x 62) | -55°C ~ 125°C | 0.100" (2.54mm) | Press-Fit | SIP | |
Mill-Max Manufacturing
|
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Gold | 30.0µin (0.76µm) | Beryllium Copper | Carrier | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole | 42 (1 x 42) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | SIP | |
Samtec Inc.
|
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Tin | - | Phosphor Bronze | Open Frame | Polybutylene Terephthalate (PBT), Glass Filled | Through Hole | 32 (2 x 16) | - | 0.100" (2.54mm) | Solder | - | |
Mill-Max Manufacturing
|
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Tin-Lead | 10.0µin (0.25µm) | Beryllium Copper | Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole | 10 (2 x 5) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | DIP, 0.3" (7.62mm) Row Spacing | |
Mill-Max Manufacturing
|
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Tin | 10.0µin (0.25µm) | Beryllium Copper | Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole | 10 (2 x 5) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | DIP, 0.3" (7.62mm) Row Spacing | |
Mill-Max Manufacturing
|
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Gold | 30.0µin (0.76µm) | Beryllium Copper | Carrier | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole | 44 (1 x 44) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | SIP | |
Mill-Max Manufacturing
|
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Price on request
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Tin-Lead | 30.0µin (0.76µm) | Beryllium Copper | Elevated, Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole | 10 (2 x 5) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | DIP, 0.3" (7.62mm) Row Spacing |