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| Part & Mfr | Total Stock | Pricing & RFQ | Contact Finish | Contact Finish Thickness | Contact Material | Features | Housing Material | Mounting Type | Number of Positions or Pins (Grid) | Operating Temperature | Pitch | Termination | Type | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics
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Tin | 30.0µin (0.76µm) | Beryllium Copper | Closed Frame | Polyphenylene Sulfide (PPS) | Through Hole | - | -65°C ~ 125°C | 0.100" (2.54mm) | Solder | PGA, ZIF (ZIP) | |
Aries Electronics
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Tin | 200.0µin (5.08µm) | Beryllium Copper | Closed Frame | Polyphenylene Sulfide (PPS), Glass Filled | Through Hole | 44 (2 x 22) | - | 0.100" (2.54mm) | Solder | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | |
Aries Electronics
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Tin | 200.0µin (5.08µm) | Beryllium Copper | Closed Frame | Polyphenylene Sulfide (PPS), Glass Filled | Through Hole | 44 (2 x 22) | - | 0.100" (2.54mm) | Solder | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | |
Aries Electronics
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Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | Closed Frame | Polyetheretherketone (PEEK), Glass Filled | Through Hole | 48 (2 x 24) | -55°C ~ 250°C | 0.100" (2.54mm) | Solder | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | |
Aries Electronics
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Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | Closed Frame | Polyetheretherketone (PEEK), Glass Filled | Through Hole | 48 (2 x 24) | -55°C ~ 250°C | 0.100" (2.54mm) | Solder | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | |
Aries Electronics
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Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | Closed Frame | Polyetheretherketone (PEEK), Glass Filled | Through Hole | 48 (2 x 24) | -55°C ~ 250°C | 0.100" (2.54mm) | Solder | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | |
Aries Electronics
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Tin | 200.0µin (5.08µm) | Beryllium Copper | Closed Frame | Polyphenylene Sulfide (PPS), Glass Filled | Through Hole | 48 (2 x 24) | - | 0.100" (2.54mm) | Solder | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | |
Aries Electronics
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Gold | 10.0µin (0.25µm) | Beryllium Copper | Closed Frame | Polyphenylene Sulfide (PPS), Glass Filled | Through Hole | 48 (2 x 24) | - | 0.100" (2.54mm) | Solder | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | |
Aries Electronics
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Tin | 200.0µin (5.08µm) | Beryllium Copper | Closed Frame | Polyphenylene Sulfide (PPS), Glass Filled | Through Hole | 48 (2 x 24) | - | 0.100" (2.54mm) | Solder | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | |
Aries Electronics
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Gold | 10.0µin (0.25µm) | Beryllium Copper | Closed Frame | Polyphenylene Sulfide (PPS), Glass Filled | Through Hole | 48 (2 x 24) | - | 0.100" (2.54mm) | Solder | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | |
Aries Electronics
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Gold | 12.0µin (0.30µm) | - | Closed Frame | - | - | 84 (4 x 21) | - | 0.100" (2.54mm) | - | PLCC, ZIF (ZIP) | |
Amphenol ICC
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TE Connectivity
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TE Connectivity
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TE Connectivity
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Molex
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TE Connectivity
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Gold | 25.0µin (0.63µm) | Copper Alloy | - | Polyester | Through Hole | 28 (2 x 14) | -55°C ~ 105°C | 0.100" (2.54mm) | Solder | DIP, 0.1" (2.54mm) Row Spacing | |
Amphenol ICC
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Adafruit Industries LLC
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- | - | - | Closed Frame | - | Surface Mount | 8 (2 x 4) | - | 0.050" (1.27mm) | Solder | SOIC | |
Omron
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TE Connectivity
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TE Connectivity
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Adafruit Industries LLC
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Tin | 100.0µin (2.54µm) | Copper Alloy | Closed Frame | Thermoplastic | Surface Mount | 16 (2 x 8) | - | 0.050" (1.27mm) | Solder | SOIC | |
Molex
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TE Connectivity
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TE Connectivity
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TE Connectivity
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TE Connectivity
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TE Connectivity
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TE Connectivity
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TE Connectivity
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Molex
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TE Connectivity
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TE Connectivity
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TE Connectivity
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TE Connectivity
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TE Connectivity
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CNC Tech
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Gold | - | Phosphor Bronze | Closed Frame | Polybutylene Terephthalate (PBT), Glass Filled | Through Hole | 20 (4 x 5) | -55°C ~ 105°C | 0.100" (2.54mm) | Solder | PLCC | |
CNC Tech
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Gold | - | Phosphor Bronze | Closed Frame | Polybutylene Terephthalate (PBT), Glass Filled | Through Hole | 28 (4 x 7) | -55°C ~ 105°C | 0.100" (2.54mm) | Solder | PLCC | |
CNC Tech
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Gold | - | Phosphor Bronze | Closed Frame | Polybutylene Terephthalate (PBT), Glass Filled | Through Hole | 32 (4 x 8) | -55°C ~ 105°C | 0.100" (2.54mm) | Solder | PLCC | |
CNC Tech
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Gold | - | Phosphor Bronze | Closed Frame | Polybutylene Terephthalate (PBT), Glass Filled | Through Hole | 44 (4 x 11) | -55°C ~ 105°C | 0.100" (2.54mm) | Solder | PLCC | |
CNC Tech
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Gold | - | Phosphor Bronze | Closed Frame | Polybutylene Terephthalate (PBT), Glass Filled | Through Hole | 52 (4 x 13) | -55°C ~ 105°C | 0.100" (2.54mm) | Solder | PLCC | |
CNC Tech
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Gold | - | Phosphor Bronze | Closed Frame | Polybutylene Terephthalate (PBT), Glass Filled | Through Hole | 68 (4 x 17) | -55°C ~ 105°C | 0.100" (2.54mm) | Solder | PLCC | |
CNC Tech
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Gold | - | Phosphor Bronze | Closed Frame | Polybutylene Terephthalate (PBT), Glass Filled | Through Hole | 84 (4 x 21) | -55°C ~ 105°C | 0.100" (2.54mm) | Solder | PLCC | |
CNC Tech
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Tin | 100.0µin (2.54µm) | Phosphor Bronze | Closed Frame | Polyphenylene Sulfide (PPS), Glass Filled | Surface Mount | 20 (4 x 5) | -55°C ~ 105°C | 0.050" (1.27mm) | Solder | PLCC | |
CNC Tech
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Tin | 100.0µin (2.54µm) | Phosphor Bronze | Closed Frame | Polyphenylene Sulfide (PPS), Glass Filled | Surface Mount | 28 (4 x 7) | -55°C ~ 105°C | 0.050" (1.27mm) | Solder | PLCC | |
CNC Tech
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Tin | 100.0µin (2.54µm) | Phosphor Bronze | Closed Frame | Polyphenylene Sulfide (PPS), Glass Filled | Surface Mount | 32 (4 x 8) | -55°C ~ 105°C | 0.050" (1.27mm) | Solder | PLCC | |
CNC Tech
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Tin | 100.0µin (2.54µm) | Phosphor Bronze | Closed Frame | Polyphenylene Sulfide (PPS), Glass Filled | Surface Mount | 44 (4 x 11) | -55°C ~ 105°C | 0.050" (1.27mm) | Solder | PLCC | |
CNC Tech
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Tin | 60.0µin (1.52µm) | Phosphor Bronze | Open Frame | Polybutylene Terephthalate (PBT), Glass Filled | Through Hole | 8 (2 x 4) | -40°C ~ 105°C | 0.100" (2.54mm) | Solder | DIP, 0.3" (7.62mm) Row Spacing | |
CNC Tech
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Tin | 60.0µin (1.52µm) | Phosphor Bronze | Open Frame | Polybutylene Terephthalate (PBT), Glass Filled | Through Hole | 14 (2 x 7) | -40°C ~ 105°C | 0.100" (2.54mm) | Solder | DIP, 0.3" (7.62mm) Row Spacing |