What are IC Sockets ?
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| Part & Mfr | Total Stock | Pricing & RFQ | Contact Finish | Contact Finish Thickness | Contact Material | Features | Housing Material | Mounting Type | Number of Positions or Pins (Grid) | Operating Temperature | Pitch | Termination | Type | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
TE Connectivity
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Gold | 15.0µin (0.38µm) | Copper Alloy | Closed Frame | Thermoplastic | Surface Mount | 1150 | - | 0.036" (0.91mm) | Solder | LGA | |
TE Connectivity
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Gold | 3.90µin (0.099µm) | Copper Alloy | Closed Frame | Thermoplastic | Surface Mount | 1150 | - | 0.036" (0.91mm) | Solder | LGA | |
TE Connectivity
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Gold | 30.0µin (0.76µm) | Beryllium Copper | Open Frame | Thermoplastic, Polyester, Glass Filled | Through Hole | 132 (14 x 14) | - | 0.100" (2.54mm) | Press-Fit | PGA | |
TE Connectivity
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Tin-Lead | 30.0µin (0.76µm) | Beryllium Copper | Open Frame | Thermoplastic, Polyester, Glass Filled | Through Hole | 128 (13 x 13) | - | 0.100" (2.54mm) | Press-Fit | PGA | |
TE Connectivity
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- | - | - | Open Frame | - | - | 370 (19 x 19) | - | - | - | PGA | |
TE Connectivity
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Tin-Lead | 30.0µin (0.76µm) | Beryllium Copper | Open Frame | Thermoplastic, Polyester, Glass Filled | Through Hole | 114 (13 x 13) | - | 0.100" (2.54mm) | Press-Fit | PGA | |
TE Connectivity
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Tin-Lead | 30.0µin (0.76µm) | Beryllium Copper | Open Frame | Thermoplastic, Polyester, Glass Filled | Through Hole | 223 (18 x 18) | - | 0.100" (2.54mm) | Press-Fit | PGA | |
TE Connectivity
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- | - | Beryllium Copper | Open Frame | - | - | - | - | - | - | - | |
TE Connectivity
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Tin-Lead | 30.0µin (0.76µm) | Beryllium Copper | Open Frame | Thermoplastic, Polyester | Through Hole | 168 (17 x 17) | - | 0.100" (2.54mm) | Press-Fit | PGA | |
TE Connectivity
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Tin | 30.0µin (0.76µm) | - | - | - | - | 370 (19 x 19) | - | - | - | PGA | |
3M Electronic Solutions
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Gold | 30.0µin (0.76µm) | Beryllium Copper | - | Polyethersulfone (PES) | Through Hole | 625 (25 x 25) | -55°C ~ 150°C | 0.100" (2.54mm) | Solder | PGA, ZIF (ZIP) | |
Amphenol ICC
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Tin | 200.0µin (5.08µm) | Beryllium Copper | Closed Frame | Polyamide (PA), Nylon | Surface Mount | 2 (1 x 2) | - | 0.100" (2.54mm) | Solder | SIP | |
TE Connectivity
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- | - | - | - | - | - | - | - | - | - | - | |
TE Connectivity
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Gold | - | Beryllium Copper | Closed Frame | Polytetrafluoroethylene (PTFE) | Through Hole | 8 (Round) | -55°C ~ 125°C | - | Solder | Transistor, TO-5 | |
TE Connectivity
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Tin-Lead | 10.0µin (0.25µm) | Copper Alloy | Open Frame | Thermoplastic, Polyester | Through Hole | 321 (19 x 19) | -55°C ~ 105°C | 0.100" (2.54mm) | Solder | PGA | |
TE Connectivity
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- | - | - | - | - | - | - | - | - | - | - | |
TE Connectivity
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- | - | Beryllium Copper | Closed Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled | Through Hole | 28 (2 x 14) | - | 0.100" (2.54mm) | Solder | DIP, 0.6" (15.24mm) Row Spacing | |
TE Connectivity
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- | - | - | - | - | - | - | - | - | - | - | |
TE Connectivity
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Tin-Lead | - | Copper Alloy | Closed Frame | Polyester | Through Hole | 8 (2 x 4) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | DIP, 0.3" (7.62mm) Row Spacing | |
TE Connectivity
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- | - | - | - | - | - | - | - | - | - | - | |
TE Connectivity
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Gold | - | Copper Alloy | Closed Frame | Polyester | Through Hole | 28 (2 x 14) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | DIP, 0.6" (15.24mm) Row Spacing | |
TE Connectivity
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Tin-Lead | - | Beryllium Copper | Closed Frame | Polyester | Through Hole | 14 (2 x 7) | -55°C ~ 105°C | 0.100" (2.54mm) | Solder | DIP, 0.3" (7.62mm) Row Spacing | |
TE Connectivity
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Tin-Lead | 5.00µin (0.127µm) | Beryllium Copper | Closed Frame | Polyester | Through Hole | 16 (2 x 8) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | DIP, 0.3" (7.62mm) Row Spacing | |
TE Connectivity
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Tin-Lead | - | Beryllium Copper | Closed Frame | Polyester | Through Hole | 16 (2 x 8) | -55°C ~ 105°C | 0.100" (2.54mm) | Solder | DIP, 0.3" (7.62mm) Row Spacing | |
TE Connectivity
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Tin-Lead | - | Beryllium Copper | Closed Frame | Polyester | Through Hole | 16 (2 x 8) | -55°C ~ 105°C | 0.100" (2.54mm) | Solder | DIP, 0.3" (7.62mm) Row Spacing | |
TE Connectivity
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Tin-Lead | 25.0µin (0.63µm) | Beryllium Copper | Closed Frame | Polyester | Through Hole | 18 (2 x 9) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | DIP, 0.3" (7.62mm) Row Spacing | |
TE Connectivity
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Tin-Lead | - | Copper Alloy | Closed Frame | Polyester | Through Hole | 20 (2 x 10) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | DIP, 0.3" (7.62mm) Row Spacing | |
TE Connectivity
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Tin-Lead | 25.0µin (0.63µm) | Beryllium Copper | Closed Frame | Polyester | Through Hole | 22 (2 x 11) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | DIP, 0.4" (10.16mm) Row Spacing | |
TE Connectivity
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Tin | - | Copper Alloy | Closed Frame | Polyamide (PA), Nylon | Through Hole | 8 (Round) | -55°C ~ 125°C | - | Solder | Transistor, TO-5 | |
TE Connectivity
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Gold | - | Beryllium Copper | Closed Frame | Polyamide (PA), Nylon | Through Hole | 3 (Round) | -55°C ~ 125°C | - | Solder | Transistor, TO-5 | |
TE Connectivity
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- | - | - | - | - | - | - | - | - | - | - | |
TE Connectivity
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Gold | 30.0µin (0.76µm) | Beryllium Copper | Closed Frame | Diallyl Phthalate (DAP) | Through Hole | 3 (Oval) | -55°C ~ 125°C | - | Solder | Transistor, TO-3 | |
TE Connectivity
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Silver | 50.0µin (1.27µm) | Beryllium Copper | Closed Frame | Diallyl Phthalate (DAP) | Through Hole | 3 (Oval) | -55°C ~ 125°C | - | Solder | Transistor, TO-3 | |
TE Connectivity
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Silver | 500.0µin (12.70µm) | Beryllium Copper | Closed Frame | Diallyl Phthalate (DAP) | Through Hole | 3 (Oval) | -55°C ~ 125°C | - | Solder | Transistor, TO-3 | |
TE Connectivity
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Tin-Lead | 200.0µin (5.08µm) | Beryllium Copper | Closed Frame | Phenolic | Through Hole | 3 (Oval) | -55°C ~ 125°C | - | Solder | Transistor, TO-3 | |
TE Connectivity
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Tin-Lead | 200.0µin (5.08µm) | Beryllium Copper | Closed Frame | Diallyl Phthalate (DAP) | Chassis Mount | 3 (Oval) | -55°C ~ 125°C | - | Solder | Transistor, TO-3 | |
TE Connectivity
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Silver | 500.0µin (12.70µm) | Beryllium Copper | Closed Frame | Phenolic | Chassis Mount | 3 (Oval) | -55°C ~ 125°C | - | Solder | Transistor, TO-3 | |
TE Connectivity
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Silver | 500.0µin (12.70µm) | Beryllium Copper | Closed Frame | Diallyl Phthalate (DAP) | Chassis Mount | 3 (Oval) | -55°C ~ 125°C | - | Solder | Transistor, TO-3 | |
TE Connectivity
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Gold | 50.0µin (1.27µm) | Beryllium Copper | Closed Frame | Diallyl Phthalate (DAP) | Through Hole | 3 (Oval) | -55°C ~ 125°C | - | Solder | Transistor, TO-3 | |
TE Connectivity
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Tin-Lead | 25.0µin (0.63µm) | Beryllium Copper | Closed Frame | - | Through Hole, Right Angle, Horizontal | 14 (2 x 7) | - | 0.100" (2.54mm) | Solder | DIP, 0.3" (7.62mm) Row Spacing | |
TE Connectivity
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- | - | - | - | - | - | 5 (1 x 5) | - | - | - | SIP | |
TE Connectivity
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Tin-Lead | - | Beryllium Copper | Closed Frame | Thermoplastic | Through Hole | 20 (1 x 20) | - | 0.100" (2.54mm) | Solder | SIP | |
TE Connectivity
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Tin-Lead | 10.0µin (0.25µm) | Beryllium Copper | Closed Frame | Thermoplastic | Through Hole | 10 (1 x 10) | - | 0.100" (2.54mm) | Solder | SIP | |
TE Connectivity
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Tin-Lead | 30.0µin (0.76µm) | Beryllium Copper | Closed Frame | Thermoplastic, Polyester | Through Hole | 20 (1 x 20) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | SIP | |
TE Connectivity
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- | - | - | - | - | - | 20 (1 x 20) | - | - | - | SIP | |
TE Connectivity
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- | - | - | - | - | - | - | - | - | - | - | |
TE Connectivity
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Tin-Lead | 25.0µin (0.63µm) | Copper Alloy | Open Frame | Polyester | Through Hole | 6 (2 x 3) | -55°C ~ 105°C | 0.100" (2.54mm) | Solder | DIP, 0.6" (15.24mm) Row Spacing | |
TE Connectivity
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Tin | - | Beryllium Copper | Open Frame | - | Through Hole | 24 (2 x 12) | - | 0.100" (2.54mm) | Solder | DIP, 0.6" (15.24mm) Row Spacing | |
TE Connectivity
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- | - | - | - | - | - | - | - | - | - | - | |
TE Connectivity
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Gold | 30.0µin (0.76µm) | Copper Alloy | Open Frame | Thermoplastic | Surface Mount | 2011 (47 x 58) | - | - | Solder | LGA |