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| Part & Mfr | Total Stock | Pricing & RFQ | Contact Finish | Contact Finish Thickness | Contact Material | Features | Housing Material | Mounting Type | Number of Positions or Pins (Grid) | Operating Temperature | Pitch | Termination | Type | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Mill-Max Manufacturing
|
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Tin-Lead | 10.0µin (0.25µm) | Beryllium Copper | Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole | 124 (14 x 14) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | PGA | |
Mill-Max Manufacturing
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Tin-Lead | 10.0µin (0.25µm) | Beryllium Copper | Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole | 125 (14 x 14) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | PGA | |
Mill-Max Manufacturing
|
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Gold | 30.0µin (0.76µm) | Beryllium Copper | Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole | 50 (2 x 25) | -55°C ~ 125°C | 0.100" (2.54mm) | Wire Wrap | DIP, 0.9" (22.86mm) Row Spacing | |
Mill-Max Manufacturing
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- | - | Beryllium Copper | Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole | 128 (13 x 13) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | PGA | |
Mill-Max Manufacturing
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Tin-Lead | 30.0µin (0.76µm) | Beryllium Copper | Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole | 85 (10 x 10) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | PGA | |
Mill-Max Manufacturing
|
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Tin-Lead | 30.0µin (0.76µm) | Beryllium Copper | Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole | 85 (10 x 10) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | PGA | |
Mill-Max Manufacturing
|
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Tin-Lead | 30.0µin (0.76µm) | Beryllium Copper | Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole | 85 (13 x 13) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | PGA | |
Mill-Max Manufacturing
|
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Price on request
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Tin-Lead | 30.0µin (0.76µm) | Beryllium Copper | Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole | 85 (13 x 13) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | PGA | |
Mill-Max Manufacturing
|
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Price on request
Price and Stock
on Request Send RFQ |
Tin-Lead | 30.0µin (0.76µm) | Beryllium Copper | Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole | 85 (13 x 13) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | PGA | |
Mill-Max Manufacturing
|
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Price on request
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on Request Send RFQ |
Tin-Lead | 30.0µin (0.76µm) | Beryllium Copper | Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole | 85 (13 x 13) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | PGA | |
Mill-Max Manufacturing
|
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Tin | 30.0µin (0.76µm) | Beryllium Copper | Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Surface Mount | 48 (2 x 24) | -55°C ~ 125°C | 0.070" (1.78mm) | Solder | DIP, 0.6" (15.24mm) Row Spacing | |
Mill-Max Manufacturing
|
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Tin | 30.0µin (0.76µm) | Beryllium Copper | Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole | 64 (2 x 32) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | DIP, 0.9" (22.86mm) Row Spacing | |
Mill-Max Manufacturing
|
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Tin-Lead | 30.0µin (0.76µm) | Beryllium Copper | Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole | 64 (2 x 32) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | DIP, 0.9" (22.86mm) Row Spacing | |
Mill-Max Manufacturing
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Gold | 30.0µin (0.76µm) | Beryllium Copper | Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole | 59 (11 x 11) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | PGA | |
Mill-Max Manufacturing
|
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Gold | 30.0µin (0.76µm) | Beryllium Copper | Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole | 59 (11 x 11) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | PGA | |
Mill-Max Manufacturing
|
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Price on request
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Gold | 30.0µin (0.76µm) | Beryllium Copper | Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole | 59 (11 x 11) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | PGA | |
Mill-Max Manufacturing
|
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Tin-Lead | 10.0µin (0.25µm) | Beryllium Copper | Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole | 128 (13 x 13) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | PGA | |
Mill-Max Manufacturing
|
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Price on request
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Tin-Lead | 10.0µin (0.25µm) | Beryllium Copper | Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole | 128 (13 x 13) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | PGA | |
Mill-Max Manufacturing
|
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- | - | Beryllium Copper | Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole | 69 (11 x 11) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | PGA | |
Mill-Max Manufacturing
|
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Tin | 30.0µin (0.76µm) | Beryllium Copper | Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole | 100 (13 x 13) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | PGA | |
Mill-Max Manufacturing
|
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Tin | 30.0µin (0.76µm) | Beryllium Copper | Closed Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole | 100 (10 x 10) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | PGA | |
Aries Electronics
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Gold | 10.0µin (0.25µm) | Beryllium Copper | Closed Frame | Polyamide (PA46), Nylon 4/6, Glass Filled | Through Hole | 36 (2 x 18) | -55°C ~ 125°C | 0.100" (2.54mm) | Wire Wrap | DIP, 0.6" (15.24mm) Row Spacing | |
Aries Electronics
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Gold | 10.0µin (0.25µm) | Beryllium Copper | Closed Frame | Polyamide (PA46), Nylon 4/6, Glass Filled | Through Hole | 36 (2 x 18) | -55°C ~ 125°C | 0.100" (2.54mm) | Wire Wrap | DIP, 0.6" (15.24mm) Row Spacing | |
Mill-Max Manufacturing
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Tin | 30.0µin (0.76µm) | Beryllium Copper | Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole | 101 (13 x 13) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | PGA | |
Mill-Max Manufacturing
|
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Tin-Lead | 30.0µin (0.76µm) | Beryllium Copper | Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole | 88 (12 x 12) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | PGA | |
Mill-Max Manufacturing
|
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Price on request
Price and Stock
on Request Send RFQ |
Tin-Lead | 30.0µin (0.76µm) | Beryllium Copper | Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole | 88 (12 x 12) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | PGA | |
Mill-Max Manufacturing
|
Send RFQ |
Price on request
Price and Stock
on Request Send RFQ |
Tin-Lead | 30.0µin (0.76µm) | Beryllium Copper | Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole | 88 (13 x 13) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | PGA | |
Mill-Max Manufacturing
|
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Price on request
Price and Stock
on Request Send RFQ |
Tin-Lead | 30.0µin (0.76µm) | Beryllium Copper | Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole | 88 (13 x 13) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | PGA | |
Mill-Max Manufacturing
|
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Price on request
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Tin-Lead | 30.0µin (0.76µm) | Beryllium Copper | Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole | 88 (13 x 13) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | PGA | |
Mill-Max Manufacturing
|
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Price on request
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Tin-Lead | 30.0µin (0.76µm) | Beryllium Copper | Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole | 88 (13 x 13) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | PGA | |
Mill-Max Manufacturing
|
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Price on request
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Tin-Lead | 30.0µin (0.76µm) | Beryllium Copper | Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole | 101 (13 x 13) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | PGA | |
Aries Electronics
|
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Tin | 10.0µin (0.25µm) | Beryllium Copper | Closed Frame | Polyamide (PA46), Nylon 4/6, Glass Filled | Through Hole | 40 (2 x 20) | -55°C ~ 105°C | 0.100" (2.54mm) | Wire Wrap | DIP, 0.6" (15.24mm) Row Spacing | |
Aries Electronics
|
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Tin | 10.0µin (0.25µm) | Beryllium Copper | Closed Frame | Polyamide (PA46), Nylon 4/6, Glass Filled | Through Hole | 40 (2 x 20) | -55°C ~ 105°C | 0.100" (2.54mm) | Wire Wrap | DIP, 0.6" (15.24mm) Row Spacing | |
Aries Electronics
|
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Tin | 10.0µin (0.25µm) | Beryllium Copper | Closed Frame | Polyamide (PA46), Nylon 4/6, Glass Filled | Through Hole | 40 (2 x 20) | -55°C ~ 105°C | 0.100" (2.54mm) | Wire Wrap | DIP, 0.6" (15.24mm) Row Spacing | |
Aries Electronics
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Gold | 10.0µin (0.25µm) | Phosphor Bronze | - | Polyamide (PA46), Nylon 4/6, Glass Filled | Through Hole | 38 (1 x 38) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | SIP | |
Mill-Max Manufacturing
|
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Tin | 30.0µin (0.76µm) | Beryllium Copper | Elevated, Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole | 48 (2 x 24) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | DIP, 0.6" (15.24mm) Row Spacing | |
Mill-Max Manufacturing
|
Send RFQ |
Price on request
Price and Stock
on Request Send RFQ |
Tin-Lead | 30.0µin (0.76µm) | Beryllium Copper | Elevated, Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole | 48 (2 x 24) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | DIP, 0.6" (15.24mm) Row Spacing | |
Mill-Max Manufacturing
|
Send RFQ |
Price on request
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on Request Send RFQ |
Tin | 30.0µin (0.76µm) | Beryllium Copper | Elevated, Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole | 50 (2 x 25) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | DIP, 0.9" (22.86mm) Row Spacing | |
Mill-Max Manufacturing
|
Send RFQ |
Price on request
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on Request Send RFQ |
Tin-Lead | 30.0µin (0.76µm) | Beryllium Copper | Elevated, Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole | 50 (2 x 25) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | DIP, 0.9" (22.86mm) Row Spacing | |
Mill-Max Manufacturing
|
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Price on request
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Tin-Lead | 10.0µin (0.25µm) | Beryllium Copper | Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole | 132 (14 x 14) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | PGA | |
Aries Electronics
|
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Price on request
Price and Stock
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Tin | 30.0µin (0.76µm) | Beryllium Copper | Open Frame | Polyamide (PA46), Nylon 4/6, Glass Filled | Through Hole | 50 (2 x 25) | -55°C ~ 105°C | 0.100" (2.54mm) | Wire Wrap | DIP, 0.9" (22.86mm) Row Spacing | |
Aries Electronics
|
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Price on request
Price and Stock
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Tin | 30.0µin (0.76µm) | Beryllium Copper | Open Frame | Polyamide (PA46), Nylon 4/6, Glass Filled | Through Hole | 50 (2 x 25) | -55°C ~ 105°C | 0.100" (2.54mm) | Wire Wrap | DIP, 0.9" (22.86mm) Row Spacing | |
Mill-Max Manufacturing
|
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Tin | 30.0µin (0.76µm) | Beryllium Copper | Elevated, Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole | 42 (2 x 21) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | DIP, 0.6" (15.24mm) Row Spacing | |
Mill-Max Manufacturing
|
Send RFQ |
Price on request
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Tin-Lead | 30.0µin (0.76µm) | Beryllium Copper | Elevated, Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole | 42 (2 x 21) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | DIP, 0.6" (15.24mm) Row Spacing | |
Mill-Max Manufacturing
|
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Price on request
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Tin-Lead | 10.0µin (0.25µm) | Beryllium Copper | Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole | 136 (14 x 14) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | PGA | |
Mill-Max Manufacturing
|
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Tin-Lead | 10.0µin (0.25µm) | Beryllium Copper | Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole | 136 (14 x 14) | -55°C ~ 125°C | 0.100" (2.54mm) | Solder | PGA | |
Preci-Dip
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Tin | Flash | Beryllium Copper | Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Through Hole | 325 (18 x 18) | -55°C ~ 125°C | 0.100" (2.54mm) | Press-Fit | PGA | |
Mill-Max Manufacturing
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Tin | 30.0µin (0.76µm) | Beryllium Copper | Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole | 68 (2 x 34) | -55°C ~ 125°C | 0.070" (1.78mm) | Solder | DIP, 0.6" (15.24mm) Row Spacing | |
Mill-Max Manufacturing
|
Send RFQ |
Price on request
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Tin-Lead | 30.0µin (0.76µm) | Beryllium Copper | Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Through Hole | 68 (2 x 34) | -55°C ~ 125°C | 0.070" (1.78mm) | Solder | DIP, 0.6" (15.24mm) Row Spacing | |
TE Connectivity
|
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Tin | Flash | Beryllium Copper | Closed Frame | Polyester | Through Hole | 10 (1 x 10) | - | 0.100" (2.54mm) | Solder | SIP |