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Headers, Receptacles, Female Sockets

Headers, Receptacles, Female Sockets facilitate electrical connections between circuit boards and cables. Key attributes include Connector Type, Contact Finish, and Current Rating (Amps). These components are essential for board-to-board and cable interconnect applications.

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What are Headers, Receptacles, Female Sockets ?

Headers, Receptacles, Female Sockets are types of connectors designed to establish reliable electrical connections between circuit boards and cables. They are commonly used in applications such as production electronics assembly and maintenance. Important specifications for selection include Contact Finish, which affects conductivity and corrosion resistance; Current Rating (Amps), which determines the maximum load the connector can handle; and Connector Type, which ensures compatibility with mating components. Validating lifecycle status and sourcing options is crucial for procurement teams to mitigate risks.

Parts in this category

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Part & Mfr Total Stock Pricing & RFQ Connector Type Contact Finish Contact Finish Thickness Contact Length Contact Type Current Rating (Amps) Fastening Type Features Ingress Protection Insulation Color Insulation Height Mated Stacking Heights Material Flammability Rating Mounting Type Number of Positions Number of Positions Loaded Number of Rows Operating Temperature Pitch Row Spacing Style Termination Voltage Rating
ESQT-115-02-L-D-645
ESQT-115-02-L-D-645
Samtec Inc.
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 Elevated Socket Tin 10.0碌in (0.25碌m) 0.205" (5.21mm) Forked 4.5A per Contact Push-Pull - - Black 0.645" (16.38mm) - UL94 V-0 Through Hole 30 All 2 -55°C ~ 125°C 0.079" (2.00mm) 0.079" (2.00mm) Board to Board or Cable Solder -
ESQT-115-02-L-D-314
ESQT-115-02-L-D-314
Samtec Inc.
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 Elevated Socket Tin 10.0碌in (0.25碌m) 0.536" (13.61mm) Forked 4.5A per Contact Push-Pull - - Black 0.314" (7.98mm) - UL94 V-0 Through Hole 30 All 2 -55°C ~ 125°C 0.079" (2.00mm) 0.079" (2.00mm) Board to Board or Cable Solder -
ESQT-115-02-L-D-315
ESQT-115-02-L-D-315
Samtec Inc.
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 Elevated Socket Tin 10.0碌in (0.25碌m) 0.535" (13.59mm) Forked 4.5A per Contact Push-Pull - - Black 0.315" (8.00mm) - UL94 V-0 Through Hole 30 All 2 -55°C ~ 125°C 0.079" (2.00mm) 0.079" (2.00mm) Board to Board or Cable Solder -
ESQT-115-02-L-D-327
ESQT-115-02-L-D-327
Samtec Inc.
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 Elevated Socket Tin 10.0碌in (0.25碌m) 0.523" (13.28mm) Forked 4.5A per Contact Push-Pull - - Black 0.327" (8.30mm) - UL94 V-0 Through Hole 30 All 2 -55°C ~ 125°C 0.079" (2.00mm) 0.079" (2.00mm) Board to Board or Cable Solder -
ESQT-115-02-L-D-371
ESQT-115-02-L-D-371
Samtec Inc.
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 Elevated Socket Tin 10.0碌in (0.25碌m) 0.479" (12.17mm) Forked 4.5A per Contact Push-Pull - - Black 0.371" (9.42mm) - UL94 V-0 Through Hole 30 All 2 -55°C ~ 125°C 0.079" (2.00mm) 0.079" (2.00mm) Board to Board or Cable Solder -
ESQT-115-02-L-D-374
ESQT-115-02-L-D-374
Samtec Inc.
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 Elevated Socket Tin 10.0碌in (0.25碌m) 0.476" (12.09mm) Forked 4.5A per Contact Push-Pull - - Black 0.374" (9.50mm) - UL94 V-0 Through Hole 30 All 2 -55°C ~ 125°C 0.079" (2.00mm) 0.079" (2.00mm) Board to Board or Cable Solder -
ESQT-115-02-L-D-375
ESQT-115-02-L-D-375
Samtec Inc.
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 Elevated Socket Tin 10.0碌in (0.25碌m) 0.475" (12.07mm) Forked 4.5A per Contact Push-Pull - - Black 0.375" (9.53mm) - UL94 V-0 Through Hole 30 All 2 -55°C ~ 125°C 0.079" (2.00mm) 0.079" (2.00mm) Board to Board or Cable Solder -
ESQT-115-02-L-D-394
ESQT-115-02-L-D-394
Samtec Inc.
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 Elevated Socket Tin 10.0碌in (0.25碌m) 0.456" (11.58mm) Forked 4.5A per Contact Push-Pull - - Black 0.394" (10.00mm) - UL94 V-0 Through Hole 30 All 2 -55°C ~ 125°C 0.079" (2.00mm) 0.079" (2.00mm) Board to Board or Cable Solder -
ESQT-115-02-L-D-400
ESQT-115-02-L-D-400
Samtec Inc.
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 Elevated Socket Tin 10.0碌in (0.25碌m) 0.450" (11.43mm) Forked 4.5A per Contact Push-Pull - - Black 0.400" (10.16mm) - UL94 V-0 Through Hole 30 All 2 -55°C ~ 125°C 0.079" (2.00mm) 0.079" (2.00mm) Board to Board or Cable Solder -
ESQT-115-02-L-D-405
ESQT-115-02-L-D-405
Samtec Inc.
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 Elevated Socket Tin 10.0碌in (0.25碌m) 0.445" (11.30mm) Forked 4.5A per Contact Push-Pull - - Black 0.405" (10.29mm) - UL94 V-0 Through Hole 30 All 2 -55°C ~ 125°C 0.079" (2.00mm) 0.079" (2.00mm) Board to Board or Cable Solder -
ESQT-115-02-L-D-410
ESQT-115-02-L-D-410
Samtec Inc.
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 Elevated Socket Tin 10.0碌in (0.25碌m) 0.440" (11.18mm) Forked 4.5A per Contact Push-Pull - - Black 0.410" (10.41mm) - UL94 V-0 Through Hole 30 All 2 -55°C ~ 125°C 0.079" (2.00mm) 0.079" (2.00mm) Board to Board or Cable Solder -
ESQT-115-02-L-D-422
ESQT-115-02-L-D-422
Samtec Inc.
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 Elevated Socket Tin 10.0碌in (0.25碌m) 0.428" (10.87mm) Forked 4.5A per Contact Push-Pull - - Black 0.422" (10.72mm) - UL94 V-0 Through Hole 30 All 2 -55°C ~ 125°C 0.079" (2.00mm) 0.079" (2.00mm) Board to Board or Cable Solder -
ESQT-115-02-L-D-430
ESQT-115-02-L-D-430
Samtec Inc.
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 Elevated Socket Tin 10.0碌in (0.25碌m) 0.420" (10.67mm) Forked 4.5A per Contact Push-Pull - - Black 0.430" (10.92mm) - UL94 V-0 Through Hole 30 All 2 -55°C ~ 125°C 0.079" (2.00mm) 0.079" (2.00mm) Board to Board or Cable Solder -
ESQT-115-02-L-D-440
ESQT-115-02-L-D-440
Samtec Inc.
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 Elevated Socket Tin 10.0碌in (0.25碌m) 0.410" (10.41mm) Forked 4.5A per Contact Push-Pull - - Black 0.440" (11.18mm) - UL94 V-0 Through Hole 30 All 2 -55°C ~ 125°C 0.079" (2.00mm) 0.079" (2.00mm) Board to Board or Cable Solder -
ESQT-115-02-L-D-450
ESQT-115-02-L-D-450
Samtec Inc.
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 Elevated Socket Tin 10.0碌in (0.25碌m) 0.400" (10.16mm) Forked 4.5A per Contact Push-Pull - - Black 0.450" (11.43mm) - UL94 V-0 Through Hole 30 All 2 -55°C ~ 125°C 0.079" (2.00mm) 0.079" (2.00mm) Board to Board or Cable Solder -
ESQT-115-02-L-D-480
ESQT-115-02-L-D-480
Samtec Inc.
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 Elevated Socket Tin 10.0碌in (0.25碌m) 0.370" (9.40mm) Forked 4.5A per Contact Push-Pull - - Black 0.480" (12.20mm) - UL94 V-0 Through Hole 30 All 2 -55°C ~ 125°C 0.079" (2.00mm) 0.079" (2.00mm) Board to Board or Cable Solder -
ESQT-115-02-L-D-484
ESQT-115-02-L-D-484
Samtec Inc.
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 Elevated Socket Tin 10.0碌in (0.25碌m) 0.366" (9.30mm) Forked 4.5A per Contact Push-Pull - - Black 0.484" (12.30mm) - UL94 V-0 Through Hole 30 All 2 -55°C ~ 125°C 0.079" (2.00mm) 0.079" (2.00mm) Board to Board or Cable Solder -
ESQT-115-02-L-D-496
ESQT-115-02-L-D-496
Samtec Inc.
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 Elevated Socket Tin 10.0碌in (0.25碌m) 0.354" (8.99mm) Forked 4.5A per Contact Push-Pull - - Black 0.496" (12.60mm) - UL94 V-0 Through Hole 30 All 2 -55°C ~ 125°C 0.079" (2.00mm) 0.079" (2.00mm) Board to Board or Cable Solder -
ESQT-115-02-L-D-500
ESQT-115-02-L-D-500
Samtec Inc.
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 Elevated Socket Tin 10.0碌in (0.25碌m) 0.350" (8.89mm) Forked 4.5A per Contact Push-Pull - - Black 0.500" (12.70mm) - UL94 V-0 Through Hole 30 All 2 -55°C ~ 125°C 0.079" (2.00mm) 0.079" (2.00mm) Board to Board or Cable Solder -
ESQT-115-02-L-D-502
ESQT-115-02-L-D-502
Samtec Inc.
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 Elevated Socket Tin 10.0碌in (0.25碌m) 0.348" (8.84mm) Forked 4.5A per Contact Push-Pull - - Black 0.502" (12.75mm) - UL94 V-0 Through Hole 30 All 2 -55°C ~ 125°C 0.079" (2.00mm) 0.079" (2.00mm) Board to Board or Cable Solder -
ESQT-115-02-L-D-512
ESQT-115-02-L-D-512
Samtec Inc.
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 Elevated Socket Tin 10.0碌in (0.25碌m) 0.338" (8.59mm) Forked 4.5A per Contact Push-Pull - - Black 0.512" (13.00mm) - UL94 V-0 Through Hole 30 All 2 -55°C ~ 125°C 0.079" (2.00mm) 0.079" (2.00mm) Board to Board or Cable Solder -
ESQT-115-02-L-D-520
ESQT-115-02-L-D-520
Samtec Inc.
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 Elevated Socket Tin 10.0碌in (0.25碌m) 0.330" (8.38mm) Forked 4.5A per Contact Push-Pull - - Black 0.520" (13.20mm) - UL94 V-0 Through Hole 30 All 2 -55°C ~ 125°C 0.079" (2.00mm) 0.079" (2.00mm) Board to Board or Cable Solder -
ESQT-115-02-L-D-530
ESQT-115-02-L-D-530
Samtec Inc.
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 Elevated Socket Tin 10.0碌in (0.25碌m) 0.320" (8.13mm) Forked 4.5A per Contact Push-Pull - - Black 0.530" (13.46mm) - UL94 V-0 Through Hole 30 All 2 -55°C ~ 125°C 0.079" (2.00mm) 0.079" (2.00mm) Board to Board or Cable Solder -
ESQT-115-02-L-D-550
ESQT-115-02-L-D-550
Samtec Inc.
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 Elevated Socket Tin 10.0碌in (0.25碌m) 0.300" (7.62mm) Forked 4.5A per Contact Push-Pull - - Black 0.550" (13.97mm) - UL94 V-0 Through Hole 30 All 2 -55°C ~ 125°C 0.079" (2.00mm) 0.079" (2.00mm) Board to Board or Cable Solder -
ESQT-115-02-L-D-551
ESQT-115-02-L-D-551
Samtec Inc.
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 Elevated Socket Tin 10.0碌in (0.25碌m) 0.299" (7.60mm) Forked 4.5A per Contact Push-Pull - - Black 0.551" (14.00mm) - UL94 V-0 Through Hole 30 All 2 -55°C ~ 125°C 0.079" (2.00mm) 0.079" (2.00mm) Board to Board or Cable Solder -
ESQT-115-02-L-D-553
ESQT-115-02-L-D-553
Samtec Inc.
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 Elevated Socket Tin 10.0碌in (0.25碌m) 0.297" (7.55mm) Forked 4.5A per Contact Push-Pull - - Black 0.553" (14.05mm) - UL94 V-0 Through Hole 30 All 2 -55°C ~ 125°C 0.079" (2.00mm) 0.079" (2.00mm) Board to Board or Cable Solder -
ESQT-115-02-L-D-555
ESQT-115-02-L-D-555
Samtec Inc.
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 Elevated Socket Tin 10.0碌in (0.25碌m) 0.295" (7.49mm) Forked 4.5A per Contact Push-Pull - - Black 0.555" (14.10mm) - UL94 V-0 Through Hole 30 All 2 -55°C ~ 125°C 0.079" (2.00mm) 0.079" (2.00mm) Board to Board or Cable Solder -
ESQT-115-02-L-D-582
ESQT-115-02-L-D-582
Samtec Inc.
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 Elevated Socket Tin 10.0碌in (0.25碌m) 0.268" (6.81mm) Forked 4.5A per Contact Push-Pull - - Black 0.582" (14.78mm) - UL94 V-0 Through Hole 30 All 2 -55°C ~ 125°C 0.079" (2.00mm) 0.079" (2.00mm) Board to Board or Cable Solder -
ESQT-115-02-L-D-585
ESQT-115-02-L-D-585
Samtec Inc.
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 Elevated Socket Tin 10.0碌in (0.25碌m) 0.265" (6.73mm) Forked 4.5A per Contact Push-Pull - - Black 0.585" (14.86mm) - UL94 V-0 Through Hole 30 All 2 -55°C ~ 125°C 0.079" (2.00mm) 0.079" (2.00mm) Board to Board or Cable Solder -
ESQT-115-02-L-D-590
ESQT-115-02-L-D-590
Samtec Inc.
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 Elevated Socket Tin 10.0碌in (0.25碌m) 0.260" (6.60mm) Forked 4.5A per Contact Push-Pull - - Black 0.590" (14.99mm) - UL94 V-0 Through Hole 30 All 2 -55°C ~ 125°C 0.079" (2.00mm) 0.079" (2.00mm) Board to Board or Cable Solder -
ESQT-115-02-L-D-595
ESQT-115-02-L-D-595
Samtec Inc.
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 Elevated Socket Tin 10.0碌in (0.25碌m) 0.255" (6.48mm) Forked 4.5A per Contact Push-Pull - - Black 0.595" (15.11mm) - UL94 V-0 Through Hole 30 All 2 -55°C ~ 125°C 0.079" (2.00mm) 0.079" (2.00mm) Board to Board or Cable Solder -
ESQT-115-02-L-D-600
ESQT-115-02-L-D-600
Samtec Inc.
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 Elevated Socket Tin 10.0碌in (0.25碌m) 0.250" (6.35mm) Forked 4.5A per Contact Push-Pull - - Black 0.600" (15.24mm) - UL94 V-0 Through Hole 30 All 2 -55°C ~ 125°C 0.079" (2.00mm) 0.079" (2.00mm) Board to Board or Cable Solder -
ESQT-115-02-L-D-610
ESQT-115-02-L-D-610
Samtec Inc.
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 Elevated Socket Tin 10.0碌in (0.25碌m) 0.240" (6.10mm) Forked 4.5A per Contact Push-Pull - - Black 0.610" (15.49mm) - UL94 V-0 Through Hole 30 All 2 -55°C ~ 125°C 0.079" (2.00mm) 0.079" (2.00mm) Board to Board or Cable Solder -
ESQT-115-02-L-D-615
ESQT-115-02-L-D-615
Samtec Inc.
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 Elevated Socket Tin 10.0碌in (0.25碌m) 0.235" (5.97mm) Forked 4.5A per Contact Push-Pull - - Black 0.615" (15.62mm) - UL94 V-0 Through Hole 30 All 2 -55°C ~ 125°C 0.079" (2.00mm) 0.079" (2.00mm) Board to Board or Cable Solder -
CES-127-01-S-D
CES-127-01-S-D
Download Datasheet for CES-127-01-S-D
Samtec Inc.
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 Receptacle Tin 30.0碌in (0.76碌m) 0.128" (3.25mm) Female Socket - Push-Pull - - Black 0.200" (5.08mm) - UL94 V-0 Through Hole 54 All 2 -55°C ~ 125°C 0.100" (2.54mm) 0.100" (2.54mm) Board to Board Solder -
SSM-148-L-SV
SSM-148-L-SV
Download Datasheet for SSM-148-L-SV
Samtec Inc.
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 Receptacle, Pass Through Tin 10.0碌in (0.25碌m) - Female Socket 5.2A per Contact Push-Pull - - Black 0.290" (7.37mm) - - Surface Mount 48 All 1 -55°C ~ 125°C 0.100" (2.54mm) - Board to Board or Cable Solder 405VAC, 572VDC
0791098466
0791098466
Molex
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 Receptacle Tin 30.0碌in (0.76碌m) - Female Socket 1A Push-Pull Pick and Place - Black 0.175" (4.45mm) - UL94 V-0 Surface Mount 34 All 2 -55°C ~ 125°C 0.079" (2.00mm) 0.079" (2.00mm) Board to Board or Cable Solder 125V
0791098666
0791098666
Molex
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 Receptacle Tin 30.0碌in (0.76碌m) - Female Socket 1A Push-Pull Board Guide, Pick and Place - Black 0.175" (4.45mm) - - Surface Mount 34 All 2 -55°C ~ 125°C 0.079" (2.00mm) 0.079" (2.00mm) Board to Board or Cable Solder 125V
MMS-122-01-T-SV
MMS-122-01-T-SV
Download Datasheet for MMS-122-01-T-SV
Samtec Inc.
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 Receptacle Tin - 0.115" (2.92mm) Female Socket 3.9A per Contact Push-Pull - - Black 0.175" (4.45mm) - - Through Hole 22 All 1 -55°C ~ 105°C 0.079" (2.00mm) - Board to Board or Cable Solder -
MLE-113-01-G-DV-A-P
MLE-113-01-G-DV-A-P
Download Datasheet for MLE-113-01-G-DV-A-P
Samtec Inc.
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 Receptacle Gold 10.0碌in (0.25碌m) - Female Socket 2.9A per Contact Push-Pull Board Guide, Pick and Place - Black 0.130" (3.30mm) - - Surface Mount 26 All 2 -55°C ~ 125°C 0.039" (1.00mm) 0.039" (1.00mm) Board to Board Solder 310VAC
399-93-128-10-003000
399-93-128-10-003000
Mill-Max Manufacturing
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 Receptacle Tin-Lead 30.0碌in (0.76碌m) 0.126" (3.20mm) Female Socket 3A Push-Pull - - Black 0.100" (2.54mm) - UL94 V-0 Through Hole, Right Angle 28 All 1 -55°C ~ 125°C 0.100" (2.54mm) - Board to Board Solder -
CLT-107-02-H-D-BE
CLT-107-02-H-D-BE
Download Datasheet for CLT-107-02-H-D-BE
Samtec Inc.
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 Receptacle, Bottom Entry Gold 30.0碌in (0.76碌m) - Female Socket 4.1A per Contact Push-Pull - - Black 0.083" (2.10mm) - UL94 V-0 Surface Mount 14 All 2 -55°C ~ 125°C 0.079" (2.00mm) 0.079" (2.00mm) Board to Board Solder -
851-87-041-40-001101
851-87-041-40-001101
Preci-Dip
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 Socket Tin Flash - Female Socket 1A Push-Pull - - Black 0.087" (2.20mm) - UL94 V-0 Surface Mount, Right Angle 41 All 1 -55°C ~ 125°C 0.050" (1.27mm) - Board to Board Solder -
861-87-033-40-001101
861-87-033-40-001101
Preci-Dip
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 Socket Tin Flash - Female Socket 1A Push-Pull - - Black 0.087" (2.20mm) - UL94 V-0 Surface Mount, Right Angle 33 All 1 -55°C ~ 125°C 0.039" (1.00mm) - Board to Board Solder -
BCS-110-S-D-DE
BCS-110-S-D-DE
Download Datasheet for BCS-110-S-D-DE
Samtec Inc.
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 Receptacle, Bottom or Top Entry Tin 30.0碌in (0.76碌m) 0.120" (3.05mm) Female Socket 4.6A per Contact Push-Pull - - Black 0.290" (7.37mm) - UL94 V-0 Through Hole 20 All 2 -55°C ~ 125°C 0.100" (2.54mm) 0.100" (2.54mm) Board to Board Solder 475VAC
BCS-110-S-D-PE
BCS-110-S-D-PE
Download Datasheet for BCS-110-S-D-PE
Samtec Inc.
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 Receptacle, Pass Through Tin 30.0碌in (0.76碌m) 0.128" (3.25mm) Female Socket 4.6A per Contact Push-Pull - - Black 0.290" (7.37mm) - UL94 V-0 Through Hole 20 All 2 -55°C ~ 125°C 0.100" (2.54mm) 0.100" (2.54mm) Board to Board Solder 475VAC
BCS-110-SM-D-TE
BCS-110-SM-D-TE
Download Datasheet for BCS-110-SM-D-TE
Samtec Inc.
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 Receptacle Tin 30.0碌in (0.76碌m) 0.122" (3.10mm) Female Socket 4.6A per Contact Push-Pull - - Black 0.290" (7.37mm) - UL94 V-0 Through Hole 20 All 2 -55°C ~ 125°C 0.100" (2.54mm) 0.100" (2.54mm) Board to Board Solder 475VAC
BCS-117-S-S-TE
BCS-117-S-S-TE
Download Datasheet for BCS-117-S-S-TE
Samtec Inc.
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Price and Stock
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 Receptacle Tin 30.0碌in (0.76碌m) 0.122" (3.10mm) Female Socket 4.6A per Contact Push-Pull - - Black 0.290" (7.37mm) - UL94 V-0 Through Hole 17 All 1 -55°C ~ 125°C 0.100" (2.54mm) - Board to Board Solder 475VAC
CES-117-01-L-D
CES-117-01-L-D
Download Datasheet for CES-117-01-L-D
Samtec Inc.
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 Receptacle Tin 10.0碌in (0.25碌m) 0.128" (3.25mm) Female Socket - Push-Pull - - Black 0.200" (5.08mm) - UL94 V-0 Through Hole 34 All 2 -55°C ~ 125°C 0.100" (2.54mm) 0.100" (2.54mm) Board to Board Solder -
CES-117-02-L-D
CES-117-02-L-D
Download Datasheet for CES-117-02-L-D
Samtec Inc.
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 Receptacle Tin 10.0碌in (0.25碌m) 0.223" (5.66mm) Female Socket - Push-Pull - - Black 0.200" (5.08mm) - UL94 V-0 Through Hole 34 All 2 -55°C ~ 125°C 0.100" (2.54mm) 0.100" (2.54mm) Board to Board Solder -
Showing 42651-42700 of 206,944 products

About Headers, Receptacles, Female Sockets

Headers, Receptacles, and Female Sockets are essential components in the realm of electronic interconnects, facilitating reliable connections between circuit boards and cables. This category encompasses a variety of connector types, including board-to-board, board-to-cable/wire, and board-to-FPC configurations, catering to diverse application needs.

When sourcing Headers, Receptacles, and Female Sockets, it is crucial to consider important attributes such as connector type, contact finish, contact finish thickness, contact length, and current rating. These specifications play a significant role in ensuring compatibility with existing designs and meeting performance requirements.

Applications for these components range from new product design and prototyping to production electronics assembly and maintenance. They are integral in engineering evaluations and qualifications, as well as in procurement-driven multi-sourcing strategies.

For optimal sourcing, buyers should prioritize comparing critical specifications and validating lifecycle status. It is advisable to confirm mechanical and electrical compatibility with existing design constraints before submitting a Request for Quotation (RFQ). By focusing on parametric filtering, buyers can effectively reduce sourcing risks and ensure they select the most suitable components for their projects.

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