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Headers, Receptacles, Female Sockets

Headers, Receptacles, Female Sockets facilitate electrical connections between circuit boards and cables. Key attributes include Connector Type, Contact Finish, and Current Rating (Amps). These components are essential for board-to-board and cable interconnect applications.

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What are Headers, Receptacles, Female Sockets ?

Headers, Receptacles, Female Sockets are types of connectors designed to establish reliable electrical connections between circuit boards and cables. They are commonly used in applications such as production electronics assembly and maintenance. Important specifications for selection include Contact Finish, which affects conductivity and corrosion resistance; Current Rating (Amps), which determines the maximum load the connector can handle; and Connector Type, which ensures compatibility with mating components. Validating lifecycle status and sourcing options is crucial for procurement teams to mitigate risks.

Parts in this category

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Part & Mfr Total Stock Pricing & RFQ Connector Type Contact Finish Contact Finish Thickness Contact Length Contact Type Current Rating (Amps) Fastening Type Features Ingress Protection Insulation Color Insulation Height Mated Stacking Heights Material Flammability Rating Mounting Type Number of Positions Number of Positions Loaded Number of Rows Operating Temperature Pitch Row Spacing Style Termination Voltage Rating
CLP-136-02-L-D-BE-P
CLP-136-02-L-D-BE-P
Download Datasheet for CLP-136-02-L-D-BE-P
Samtec Inc.
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 Receptacle, Bottom Entry Tin 10.0µin (0.25µm) - Female Socket 3.3A per Contact Push-Pull Pick and Place - Black 0.084" (2.14mm) - UL94 V-0 Surface Mount 72 All 2 -55°C ~ 125°C 0.050" (1.27mm) 0.050" (1.27mm) Board to Board Solder 240VAC, 330VDC
CLP-139-02-G-D-K
CLP-139-02-G-D-K
Download Datasheet for CLP-139-02-G-D-K
Samtec Inc.
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 Receptacle Gold 10.0µin (0.25µm) - Female Socket 3.3A per Contact Push-Pull Pick and Place - Black 0.084" (2.14mm) - UL94 V-0 Surface Mount 78 All 2 -55°C ~ 125°C 0.050" (1.27mm) 0.050" (1.27mm) Board to Board Solder 240VAC, 330VDC
CLP-140-02-G-D-P
CLP-140-02-G-D-P
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Samtec Inc.
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 Receptacle Gold 10.0µin (0.25µm) - Female Socket 3.3A per Contact Push-Pull Pick and Place - Black 0.084" (2.14mm) - UL94 V-0 Surface Mount 80 All 2 -55°C ~ 125°C 0.050" (1.27mm) 0.050" (1.27mm) Board to Board Solder 240VAC, 330VDC
CLP-142-02-L-D-BE
CLP-142-02-L-D-BE
Download Datasheet for CLP-142-02-L-D-BE
Samtec Inc.
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 Receptacle, Bottom Entry Tin 10.0µin (0.25µm) - Female Socket 3.3A per Contact Push-Pull - - Black 0.084" (2.14mm) - UL94 V-0 Surface Mount 84 All 2 -55°C ~ 125°C 0.050" (1.27mm) 0.050" (1.27mm) Board to Board Solder 240VAC, 330VDC
CLP-145-02-G-D-BE
CLP-145-02-G-D-BE
Download Datasheet for CLP-145-02-G-D-BE
Samtec Inc.
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 Receptacle, Bottom Entry Gold 10.0µin (0.25µm) - Female Socket 3.3A per Contact Push-Pull - - Black 0.084" (2.14mm) - UL94 V-0 Surface Mount 90 All 2 -55°C ~ 125°C 0.050" (1.27mm) 0.050" (1.27mm) Board to Board Solder 240VAC, 330VDC
CES-101-02-L-S-RA
CES-101-02-L-S-RA
Download Datasheet for CES-101-02-L-S-RA
Samtec Inc.
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 Receptacle Tin 10.0µin (0.25µm) 0.120" (3.05mm) Female Socket - Push-Pull - - Black 0.120" (3.05mm) - UL94 V-0 Through Hole, Right Angle 1 All 1 -55°C ~ 125°C - - Board to Board Solder -
CES-101-02-S-S
CES-101-02-S-S
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Samtec Inc.
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 Receptacle Tin 30.0µin (0.76µm) 0.223" (5.66mm) Female Socket - Push-Pull - - Black 0.200" (5.08mm) - UL94 V-0 Through Hole 1 All 1 -55°C ~ 125°C - - Board to Board Solder -
CES-103-02-S-D
CES-103-02-S-D
Download Datasheet for CES-103-02-S-D
Samtec Inc.
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 Receptacle Tin 30.0µin (0.76µm) 0.223" (5.66mm) Female Socket - Push-Pull - - Black 0.200" (5.08mm) - UL94 V-0 Through Hole 6 All 2 -55°C ~ 125°C 0.100" (2.54mm) 0.100" (2.54mm) Board to Board Solder -
CES-105-01-L-S-RA
CES-105-01-L-S-RA
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Samtec Inc.
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 Receptacle Tin 10.0µin (0.25µm) 0.120" (3.05mm) Female Socket - Push-Pull - - Black 0.120" (3.05mm) - UL94 V-0 Through Hole, Right Angle 5 All 1 -55°C ~ 125°C 0.100" (2.54mm) - Board to Board Solder -
CES-111-01-F-D
CES-111-01-F-D
Download Datasheet for CES-111-01-F-D
Samtec Inc.
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 Receptacle Tin 3.00µin (0.076µm) 0.128" (3.25mm) Female Socket - Push-Pull - - Black 0.200" (5.08mm) - UL94 V-0 Through Hole 22 All 2 -55°C ~ 125°C 0.100" (2.54mm) 0.100" (2.54mm) Board to Board Solder -
CES-111-01-F-S
CES-111-01-F-S
Download Datasheet for CES-111-01-F-S
Samtec Inc.
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 Receptacle Tin 3.00µin (0.076µm) 0.128" (3.25mm) Female Socket - Push-Pull - - Black 0.200" (5.08mm) - UL94 V-0 Through Hole 11 All 1 -55°C ~ 125°C 0.100" (2.54mm) - Board to Board Solder -
CES-111-02-L-D
CES-111-02-L-D
Download Datasheet for CES-111-02-L-D
Samtec Inc.
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 Receptacle Tin 10.0µin (0.25µm) 0.223" (5.66mm) Female Socket - Push-Pull - - Black 0.200" (5.08mm) - UL94 V-0 Through Hole 22 All 2 -55°C ~ 125°C 0.100" (2.54mm) 0.100" (2.54mm) Board to Board Solder -
CES-112-01-F-D
CES-112-01-F-D
Download Datasheet for CES-112-01-F-D
Samtec Inc.
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 Receptacle Tin 3.00µin (0.076µm) 0.128" (3.25mm) Female Socket - Push-Pull - - Black 0.200" (5.08mm) - UL94 V-0 Through Hole 24 All 2 -55°C ~ 125°C 0.100" (2.54mm) 0.100" (2.54mm) Board to Board Solder -
ESQT-117-02-F-D-315
ESQT-117-02-F-D-315
Samtec Inc.
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 Elevated Socket Tin 3.00µin (0.076µm) 0.535" (13.59mm) Forked 4.5A per Contact Push-Pull - - Black 0.315" (8.00mm) - UL94 V-0 Through Hole 34 All 2 -55°C ~ 125°C 0.079" (2.00mm) 0.079" (2.00mm) Board to Board or Cable Solder -
ESQT-117-02-F-D-338
ESQT-117-02-F-D-338
Samtec Inc.
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 Elevated Socket Tin 3.00µin (0.076µm) 0.512" (13.00mm) Forked 4.5A per Contact Push-Pull - - Black 0.338" (8.59mm) - UL94 V-0 Through Hole 34 All 2 -55°C ~ 125°C 0.079" (2.00mm) 0.079" (2.00mm) Board to Board or Cable Solder -
ESQT-117-02-F-D-350
ESQT-117-02-F-D-350
Samtec Inc.
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 Elevated Socket Tin 3.00µin (0.076µm) 0.500" (12.70mm) Forked 4.5A per Contact Push-Pull - - Black 0.350" (8.89mm) - UL94 V-0 Through Hole 34 All 2 -55°C ~ 125°C 0.079" (2.00mm) 0.079" (2.00mm) Board to Board or Cable Solder -
ESQT-117-02-F-D-358
ESQT-117-02-F-D-358
Samtec Inc.
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 Elevated Socket Tin 3.00µin (0.076µm) 0.492" (12.50mm) Forked 4.5A per Contact Push-Pull - - Black 0.358" (9.10mm) - UL94 V-0 Through Hole 34 All 2 -55°C ~ 125°C 0.079" (2.00mm) 0.079" (2.00mm) Board to Board or Cable Solder -
ESQT-117-02-F-D-360
ESQT-117-02-F-D-360
Samtec Inc.
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 Elevated Socket Tin 3.00µin (0.076µm) 0.490" (12.45mm) Forked 4.5A per Contact Push-Pull - - Black 0.360" (9.14mm) - UL94 V-0 Through Hole 34 All 2 -55°C ~ 125°C 0.079" (2.00mm) 0.079" (2.00mm) Board to Board or Cable Solder -
ESQT-117-02-F-D-368
ESQT-117-02-F-D-368
Samtec Inc.
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 Elevated Socket Tin 3.00µin (0.076µm) 0.482" (12.24mm) Forked 4.5A per Contact Push-Pull - - Black 0.368" (9.35mm) - UL94 V-0 Through Hole 34 All 2 -55°C ~ 125°C 0.079" (2.00mm) 0.079" (2.00mm) Board to Board or Cable Solder -
ESQT-117-02-F-D-400
ESQT-117-02-F-D-400
Samtec Inc.
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 Elevated Socket Tin 3.00µin (0.076µm) 0.450" (11.43mm) Forked 4.5A per Contact Push-Pull - - Black 0.400" (10.16mm) - UL94 V-0 Through Hole 34 All 2 -55°C ~ 125°C 0.079" (2.00mm) 0.079" (2.00mm) Board to Board or Cable Solder -
ESQT-117-02-F-D-405
ESQT-117-02-F-D-405
Samtec Inc.
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 Elevated Socket Tin 3.00µin (0.076µm) 0.445" (11.30mm) Forked 4.5A per Contact Push-Pull - - Black 0.405" (10.29mm) - UL94 V-0 Through Hole 34 All 2 -55°C ~ 125°C 0.079" (2.00mm) 0.079" (2.00mm) Board to Board or Cable Solder -
ESQT-117-02-F-D-412
ESQT-117-02-F-D-412
Samtec Inc.
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 Elevated Socket Tin 3.00µin (0.076µm) 0.438" (11.13mm) Forked 4.5A per Contact Push-Pull - - Black 0.412" (10.46mm) - UL94 V-0 Through Hole 34 All 2 -55°C ~ 125°C 0.079" (2.00mm) 0.079" (2.00mm) Board to Board or Cable Solder -
ESQT-117-02-F-D-435
ESQT-117-02-F-D-435
Samtec Inc.
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 Elevated Socket Tin 3.00µin (0.076µm) 0.415" (10.54mm) Forked 4.5A per Contact Push-Pull - - Black 0.435" (11.05mm) - UL94 V-0 Through Hole 34 All 2 -55°C ~ 125°C 0.079" (2.00mm) 0.079" (2.00mm) Board to Board or Cable Solder -
ESQT-117-02-F-D-465
ESQT-117-02-F-D-465
Samtec Inc.
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 Elevated Socket Tin 3.00µin (0.076µm) 0.385" (9.78mm) Forked 4.5A per Contact Push-Pull - - Black 0.465" (11.80mm) - UL94 V-0 Through Hole 34 All 2 -55°C ~ 125°C 0.079" (2.00mm) 0.079" (2.00mm) Board to Board or Cable Solder -
ESQT-117-02-F-D-472
ESQT-117-02-F-D-472
Samtec Inc.
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 Elevated Socket Tin 3.00µin (0.076µm) 0.378" (9.60mm) Forked 4.5A per Contact Push-Pull - - Black 0.472" (12.00mm) - UL94 V-0 Through Hole 34 All 2 -55°C ~ 125°C 0.079" (2.00mm) 0.079" (2.00mm) Board to Board or Cable Solder -
ESQT-117-02-F-D-502
ESQT-117-02-F-D-502
Samtec Inc.
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 Elevated Socket Tin 3.00µin (0.076µm) 0.348" (8.84mm) Forked 4.5A per Contact Push-Pull - - Black 0.502" (12.75mm) - UL94 V-0 Through Hole 34 All 2 -55°C ~ 125°C 0.079" (2.00mm) 0.079" (2.00mm) Board to Board or Cable Solder -
ESQT-117-02-F-D-507
ESQT-117-02-F-D-507
Samtec Inc.
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 Elevated Socket Tin 3.00µin (0.076µm) 0.343" (8.71mm) Forked 4.5A per Contact Push-Pull - - Black 0.507" (12.88mm) - UL94 V-0 Through Hole 34 All 2 -55°C ~ 125°C 0.079" (2.00mm) 0.079" (2.00mm) Board to Board or Cable Solder -
ESQT-117-02-F-D-511
ESQT-117-02-F-D-511
Samtec Inc.
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 Elevated Socket Tin 3.00µin (0.076µm) 0.339" (8.61mm) Forked 4.5A per Contact Push-Pull - - Black 0.511" (12.98mm) - UL94 V-0 Through Hole 34 All 2 -55°C ~ 125°C 0.079" (2.00mm) 0.079" (2.00mm) Board to Board or Cable Solder -
ESQT-117-02-F-D-512
ESQT-117-02-F-D-512
Samtec Inc.
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 Elevated Socket Tin 3.00µin (0.076µm) 0.338" (8.59mm) Forked 4.5A per Contact Push-Pull - - Black 0.512" (13.00mm) - UL94 V-0 Through Hole 34 All 2 -55°C ~ 125°C 0.079" (2.00mm) 0.079" (2.00mm) Board to Board or Cable Solder -
ESQT-117-02-F-D-521
ESQT-117-02-F-D-521
Samtec Inc.
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 Elevated Socket Tin 3.00µin (0.076µm) 0.329" (8.36mm) Forked 4.5A per Contact Push-Pull - - Black 0.521" (13.23mm) - UL94 V-0 Through Hole 34 All 2 -55°C ~ 125°C 0.079" (2.00mm) 0.079" (2.00mm) Board to Board or Cable Solder -
ESQT-117-02-F-D-531
ESQT-117-02-F-D-531
Samtec Inc.
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 Elevated Socket Tin 3.00µin (0.076µm) 0.319" (8.10mm) Forked 4.5A per Contact Push-Pull - - Black 0.531" (13.50mm) - UL94 V-0 Through Hole 34 All 2 -55°C ~ 125°C 0.079" (2.00mm) 0.079" (2.00mm) Board to Board or Cable Solder -
ESQT-117-02-F-D-540
ESQT-117-02-F-D-540
Samtec Inc.
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 Elevated Socket Tin 3.00µin (0.076µm) 0.310" (7.87mm) Forked 4.5A per Contact Push-Pull - - Black 0.540" (13.72mm) - UL94 V-0 Through Hole 34 All 2 -55°C ~ 125°C 0.079" (2.00mm) 0.079" (2.00mm) Board to Board or Cable Solder -
ESQT-117-02-F-D-552
ESQT-117-02-F-D-552
Samtec Inc.
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 Elevated Socket Tin 3.00µin (0.076µm) 0.298" (7.57mm) Forked 4.5A per Contact Push-Pull - - Black 0.552" (14.02mm) - UL94 V-0 Through Hole 34 All 2 -55°C ~ 125°C 0.079" (2.00mm) 0.079" (2.00mm) Board to Board or Cable Solder -
ESQT-117-02-F-D-590
ESQT-117-02-F-D-590
Samtec Inc.
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 Elevated Socket Tin 3.00µin (0.076µm) 0.260" (6.60mm) Forked 4.5A per Contact Push-Pull - - Black 0.590" (14.99mm) - UL94 V-0 Through Hole 34 All 2 -55°C ~ 125°C 0.079" (2.00mm) 0.079" (2.00mm) Board to Board or Cable Solder -
ESQT-117-02-F-D-595
ESQT-117-02-F-D-595
Samtec Inc.
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 Elevated Socket Tin 3.00µin (0.076µm) 0.255" (6.48mm) Forked 4.5A per Contact Push-Pull - - Black 0.595" (15.11mm) - UL94 V-0 Through Hole 34 All 2 -55°C ~ 125°C 0.079" (2.00mm) 0.079" (2.00mm) Board to Board or Cable Solder -
ESQT-117-02-F-D-600
ESQT-117-02-F-D-600
Samtec Inc.
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 Elevated Socket Tin 3.00µin (0.076µm) 0.250" (6.35mm) Forked 4.5A per Contact Push-Pull - - Black 0.600" (15.24mm) - UL94 V-0 Through Hole 34 All 2 -55°C ~ 125°C 0.079" (2.00mm) 0.079" (2.00mm) Board to Board or Cable Solder -
ESQT-117-02-F-D-605
ESQT-117-02-F-D-605
Samtec Inc.
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 Elevated Socket Tin 3.00µin (0.076µm) 0.245" (6.22mm) Forked 4.5A per Contact Push-Pull - - Black 0.605" (15.37mm) - UL94 V-0 Through Hole 34 All 2 -55°C ~ 125°C 0.079" (2.00mm) 0.079" (2.00mm) Board to Board or Cable Solder -
ESQT-117-02-F-D-615
ESQT-117-02-F-D-615
Samtec Inc.
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 Elevated Socket Tin 3.00µin (0.076µm) 0.235" (5.97mm) Forked 4.5A per Contact Push-Pull - - Black 0.615" (15.62mm) - UL94 V-0 Through Hole 34 All 2 -55°C ~ 125°C 0.079" (2.00mm) 0.079" (2.00mm) Board to Board or Cable Solder -
ESQT-117-02-F-D-620
ESQT-117-02-F-D-620
Samtec Inc.
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 Elevated Socket Tin 3.00µin (0.076µm) 0.230" (5.84mm) Forked 4.5A per Contact Push-Pull - - Black 0.620" (15.75mm) - UL94 V-0 Through Hole 34 All 2 -55°C ~ 125°C 0.079" (2.00mm) 0.079" (2.00mm) Board to Board or Cable Solder -
ESQT-117-02-F-D-629
ESQT-117-02-F-D-629
Samtec Inc.
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 Elevated Socket Tin 3.00µin (0.076µm) 0.221" (5.61mm) Forked 4.5A per Contact Push-Pull - - Black 0.629" (15.98mm) - UL94 V-0 Through Hole 34 All 2 -55°C ~ 125°C 0.079" (2.00mm) 0.079" (2.00mm) Board to Board or Cable Solder -
ESQT-117-02-F-D-630
ESQT-117-02-F-D-630
Samtec Inc.
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 Elevated Socket Tin 3.00µin (0.076µm) 0.220" (5.58mm) Forked 4.5A per Contact Push-Pull - - Black 0.630" (16.00mm) - UL94 V-0 Through Hole 34 All 2 -55°C ~ 125°C 0.079" (2.00mm) 0.079" (2.00mm) Board to Board or Cable Solder -
ESQT-117-02-F-D-635
ESQT-117-02-F-D-635
Samtec Inc.
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 Elevated Socket Tin 3.00µin (0.076µm) 0.215" (5.46mm) Forked 4.5A per Contact Push-Pull - - Black 0.635" (16.13mm) - UL94 V-0 Through Hole 34 All 2 -55°C ~ 125°C 0.079" (2.00mm) 0.079" (2.00mm) Board to Board or Cable Solder -
ESQT-117-02-F-D-640
ESQT-117-02-F-D-640
Samtec Inc.
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 Elevated Socket Tin 3.00µin (0.076µm) 0.210" (5.33mm) Forked 4.5A per Contact Push-Pull - - Black 0.640" (16.26mm) - UL94 V-0 Through Hole 34 All 2 -55°C ~ 125°C 0.079" (2.00mm) 0.079" (2.00mm) Board to Board or Cable Solder -
ESQT-117-02-F-D-645
ESQT-117-02-F-D-645
Samtec Inc.
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 Elevated Socket Tin 3.00µin (0.076µm) 0.205" (5.21mm) Forked 4.5A per Contact Push-Pull - - Black 0.645" (16.38mm) - UL94 V-0 Through Hole 34 All 2 -55°C ~ 125°C 0.079" (2.00mm) 0.079" (2.00mm) Board to Board or Cable Solder -
ESQT-117-02-F-D-655
ESQT-117-02-F-D-655
Samtec Inc.
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 Elevated Socket Tin 3.00µin (0.076µm) 0.195" (4.95mm) Forked 4.5A per Contact Push-Pull - - Black 0.655" (16.63mm) - UL94 V-0 Through Hole 34 All 2 -55°C ~ 125°C 0.079" (2.00mm) 0.079" (2.00mm) Board to Board or Cable Solder -
ESQT-117-02-F-D-660
ESQT-117-02-F-D-660
Samtec Inc.
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 Elevated Socket Tin 3.00µin (0.076µm) 0.190" (4.83mm) Forked 4.5A per Contact Push-Pull - - Black 0.660" (16.76mm) - UL94 V-0 Through Hole 34 All 2 -55°C ~ 125°C 0.079" (2.00mm) 0.079" (2.00mm) Board to Board or Cable Solder -
ESQT-117-02-F-D-670
ESQT-117-02-F-D-670
Samtec Inc.
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 Elevated Socket Tin 3.00µin (0.076µm) 0.180" (4.57mm) Forked 4.5A per Contact Push-Pull - - Black 0.670" (17.02mm) - UL94 V-0 Through Hole 34 All 2 -55°C ~ 125°C 0.079" (2.00mm) 0.079" (2.00mm) Board to Board or Cable Solder -
ESQT-117-02-F-D-675
ESQT-117-02-F-D-675
Samtec Inc.
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 Elevated Socket Tin 3.00µin (0.076µm) 0.175" (4.45mm) Forked 4.5A per Contact Push-Pull - - Black 0.675" (17.14mm) - UL94 V-0 Through Hole 34 All 2 -55°C ~ 125°C 0.079" (2.00mm) 0.079" (2.00mm) Board to Board or Cable Solder -
ESQT-117-02-F-D-687
ESQT-117-02-F-D-687
Samtec Inc.
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 Elevated Socket Tin 3.00µin (0.076µm) 0.163" (4.15mm) Forked 4.5A per Contact Push-Pull - - Black 0.687" (17.45mm) - UL94 V-0 Through Hole 34 All 2 -55°C ~ 125°C 0.079" (2.00mm) 0.079" (2.00mm) Board to Board or Cable Solder -
ESQT-117-02-F-D-692
ESQT-117-02-F-D-692
Samtec Inc.
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 Elevated Socket Tin 3.00µin (0.076µm) 0.158" (4.01mm) Forked 4.5A per Contact Push-Pull - - Black 0.692" (17.58mm) - UL94 V-0 Through Hole 34 All 2 -55°C ~ 125°C 0.079" (2.00mm) 0.079" (2.00mm) Board to Board or Cable Solder -
Showing 195301-195350 of 206,944 products

About Headers, Receptacles, Female Sockets

Headers, Receptacles, and Female Sockets are essential components in the realm of electronic interconnects, facilitating reliable connections between circuit boards and cables. This category encompasses a variety of connector types, including board-to-board, board-to-cable/wire, and board-to-FPC configurations, catering to diverse application needs.

When sourcing Headers, Receptacles, and Female Sockets, it is crucial to consider important attributes such as connector type, contact finish, contact finish thickness, contact length, and current rating. These specifications play a significant role in ensuring compatibility with existing designs and meeting performance requirements.

Applications for these components range from new product design and prototyping to production electronics assembly and maintenance. They are integral in engineering evaluations and qualifications, as well as in procurement-driven multi-sourcing strategies.

For optimal sourcing, buyers should prioritize comparing critical specifications and validating lifecycle status. It is advisable to confirm mechanical and electrical compatibility with existing design constraints before submitting a Request for Quotation (RFQ). By focusing on parametric filtering, buyers can effectively reduce sourcing risks and ensure they select the most suitable components for their projects.

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DistyParts is a Marketplace for Distributors of electronic / electrical / electromechanical components and does not sell, stock or support buyers directly. All transactions through our site are managed directly by participating distributors.

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