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Headers, Receptacles, Female Sockets

Headers, Receptacles, Female Sockets facilitate electrical connections between circuit boards and cables. Key attributes include Connector Type, Contact Finish, and Current Rating (Amps). These components are essential for board-to-board and cable interconnect applications.

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What are Headers, Receptacles, Female Sockets ?

Headers, Receptacles, Female Sockets are types of connectors designed to establish reliable electrical connections between circuit boards and cables. They are commonly used in applications such as production electronics assembly and maintenance. Important specifications for selection include Contact Finish, which affects conductivity and corrosion resistance; Current Rating (Amps), which determines the maximum load the connector can handle; and Connector Type, which ensures compatibility with mating components. Validating lifecycle status and sourcing options is crucial for procurement teams to mitigate risks.

Parts in this category

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Part & Mfr Total Stock Pricing & RFQ Connector Type Contact Finish Contact Finish Thickness Contact Length Contact Material Contact Resistance Contact Type Current Rating Current Rating (Amps) Dielectric Withstanding Voltage Failure Rate Fastening Type Features Halogen Free Housing Material Industrial Grade Ingress Protection Insulation Color Insulation Height Insulation Resistance Lead Spacing Lead Style Mated Stacking Heights Material Flammability Rating Military Grade Mounting Type Number of Positions Number of Positions Loaded Number of Rows Operating Temperature Operating Temperature Range Overall Length Packaging Type Pitch Plating Row Spacing SVHC Present Storage Temperature Style Tape & Reel Termination Termination Style Voltage Rating
ESQT-117-03-H-5-375
ESQT-117-03-H-5-375
Samtec Inc.
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 Elevated Socket Gold 30.0µin (0.76µm) 0.083" (2.11mm) - - Forked - 4.5A per Contact - - Push-Pull - - - - - Black 0.375" (9.53mm) - - - - UL94 V-0 - Through Hole 85 All 5 -55°C ~ 125°C - - - 0.079" (2.00mm) - 0.079" (2.00mm) - - Board to Board or Cable - Solder - -
ESQT-117-03-H-6-375
ESQT-117-03-H-6-375
Samtec Inc.
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 Elevated Socket Gold 30.0µin (0.76µm) 0.083" (2.11mm) - - Forked - 4.5A per Contact - - Push-Pull - - - - - Black 0.375" (9.53mm) - - - - UL94 V-0 - Through Hole 102 All 6 -55°C ~ 125°C - - - 0.079" (2.00mm) - 0.079" (2.00mm) - - Board to Board or Cable - Solder - -
ESQT-117-03-H-D-309
ESQT-117-03-H-D-309
Samtec Inc.
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 Elevated Socket Gold 30.0µin (0.76µm) 0.149" (3.78mm) - - Forked - 4.5A per Contact - - Push-Pull - - - - - Black 0.309" (7.85mm) - - - - UL94 V-0 - Through Hole 34 All 2 -55°C ~ 125°C - - - 0.079" (2.00mm) - 0.079" (2.00mm) - - Board to Board or Cable - Solder - -
SS-119-T-5
SS-119-T-5
Samtec Inc.
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 Receptacle Tin 30.0碌in (0.76碌m) 0.173" (4.40mm) - - Female Socket - - - - Push-Pull - - - - - Black 0.100" (2.54mm) - - - - - - Through Hole 19 All 1 -55°C ~ 125°C - - - 0.100" (2.54mm) - - - - Board to Board - Solder - -
ESQT-117-03-H-Q-309
ESQT-117-03-H-Q-309
Samtec Inc.
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 Elevated Socket Gold 30.0µin (0.76µm) 0.149" (3.78mm) - - Forked - 4.5A per Contact - - Push-Pull - - - - - Black 0.309" (7.85mm) - - - - UL94 V-0 - Through Hole 68 All 4 -55°C ~ 125°C - - - 0.079" (2.00mm) - 0.079" (2.00mm) - - Board to Board or Cable - Solder - -
ESQT-117-03-H-S-309
ESQT-117-03-H-S-309
Samtec Inc.
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 Elevated Socket Gold 30.0µin (0.76µm) 0.149" (3.78mm) - - Forked - 4.5A per Contact - - Push-Pull - - - - - Black 0.309" (7.85mm) - - - - UL94 V-0 - Through Hole 17 All 1 -55°C ~ 125°C - - - 0.079" (2.00mm) - - - - Board to Board or Cable - Solder - -
ESQT-117-03-H-T-375
ESQT-117-03-H-T-375
Samtec Inc.
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 Elevated Socket Gold 30.0µin (0.76µm) 0.083" (2.11mm) - - Forked - 4.5A per Contact - - Push-Pull - - - - - Black 0.375" (9.53mm) - - - - UL94 V-0 - Through Hole 51 All 3 -55°C ~ 125°C - - - 0.079" (2.00mm) - 0.079" (2.00mm) - - Board to Board or Cable - Solder - -
ESQT-117-03-L-5-375
ESQT-117-03-L-5-375
Samtec Inc.
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 Elevated Socket Tin 10.0µin (0.25µm) 0.083" (2.11mm) - - Forked - 4.5A per Contact - - Push-Pull - - - - - Black 0.375" (9.53mm) - - - - UL94 V-0 - Through Hole 85 All 5 -55°C ~ 125°C - - - 0.079" (2.00mm) - 0.079" (2.00mm) - - Board to Board or Cable - Solder - -
ESQT-117-03-L-6-375
ESQT-117-03-L-6-375
Samtec Inc.
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 Elevated Socket Tin 10.0µin (0.25µm) 0.083" (2.11mm) - - Forked - 4.5A per Contact - - Push-Pull - - - - - Black 0.375" (9.53mm) - - - - UL94 V-0 - Through Hole 102 All 6 -55°C ~ 125°C - - - 0.079" (2.00mm) - 0.079" (2.00mm) - - Board to Board or Cable - Solder - -
ESQT-117-03-L-D-313
ESQT-117-03-L-D-313
Samtec Inc.
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 Elevated Socket Tin 10.0µin (0.25µm) 0.145" (3.68mm) - - Forked - 4.5A per Contact - - Push-Pull - - - - - Black 0.313" (7.95mm) - - - - UL94 V-0 - Through Hole 34 All 2 -55°C ~ 125°C - - - 0.079" (2.00mm) - 0.079" (2.00mm) - - Board to Board or Cable - Solder - -
ESQT-117-03-L-D-319
ESQT-117-03-L-D-319
Samtec Inc.
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 Elevated Socket Tin 10.0µin (0.25µm) 0.139" (3.53mm) - - Forked - 4.5A per Contact - - Push-Pull - - - - - Black 0.319" (8.10mm) - - - - UL94 V-0 - Through Hole 34 All 2 -55°C ~ 125°C - - - 0.079" (2.00mm) - 0.079" (2.00mm) - - Board to Board or Cable - Solder - -
SS-105-T-21A-N
SS-105-T-21A-N
Samtec Inc.
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 Receptacle Tin 30.0碌in (0.76碌m) 0.360" (9.14mm) - - Female Socket - - - - Push-Pull - - - - - Black 0.100" (2.54mm) - - - - - - Through Hole 5 All 1 -55°C ~ 125°C - - - 0.100" (2.54mm) - - - - Board to Board - Solder - -
ESQT-117-03-L-D-330
ESQT-117-03-L-D-330
Samtec Inc.
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 Elevated Socket Tin 10.0µin (0.25µm) 0.128" (3.25mm) - - Forked - 4.5A per Contact - - Push-Pull - - - - - Black 0.330" (8.38mm) - - - - UL94 V-0 - Through Hole 34 All 2 -55°C ~ 125°C - - - 0.079" (2.00mm) - 0.079" (2.00mm) - - Board to Board or Cable - Solder - -
ESQT-117-03-L-D-355
ESQT-117-03-L-D-355
Samtec Inc.
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 Elevated Socket Tin 10.0µin (0.25µm) 0.103" (2.62mm) - - Forked - 4.5A per Contact - - Push-Pull - - - - - Black 0.355" (9.02mm) - - - - UL94 V-0 - Through Hole 34 All 2 -55°C ~ 125°C - - - 0.079" (2.00mm) - 0.079" (2.00mm) - - Board to Board or Cable - Solder - -
ESQT-117-03-L-D-356
ESQT-117-03-L-D-356
Samtec Inc.
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 Elevated Socket Tin 10.0µin (0.25µm) 0.102" (2.60mm) - - Forked - 4.5A per Contact - - Push-Pull - - - - - Black 0.356" (9.05mm) - - - - UL94 V-0 - Through Hole 34 All 2 -55°C ~ 125°C - - - 0.079" (2.00mm) - 0.079" (2.00mm) - - Board to Board or Cable - Solder - -
ESQT-117-03-L-D-375
ESQT-117-03-L-D-375
Samtec Inc.
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 Elevated Socket Tin 10.0µin (0.25µm) 0.083" (2.11mm) - - Forked - 4.5A per Contact - - Push-Pull - - - - - Black 0.375" (9.53mm) - - - - UL94 V-0 - Through Hole 34 All 2 -55°C ~ 125°C - - - 0.079" (2.00mm) - 0.079" (2.00mm) - - Board to Board or Cable - Solder - -
ESQT-117-03-L-D-391
ESQT-117-03-L-D-391
Samtec Inc.
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 Elevated Socket Tin 10.0µin (0.25µm) 0.067" (1.70mm) - - Forked - 4.5A per Contact - - Push-Pull - - - - - Black 0.391" (9.93mm) - - - - UL94 V-0 - Through Hole 34 All 2 -55°C ~ 125°C - - - 0.079" (2.00mm) - 0.079" (2.00mm) - - Board to Board or Cable - Solder - -
ESQT-117-03-L-D-400
ESQT-117-03-L-D-400
Samtec Inc.
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 Elevated Socket Tin 10.0µin (0.25µm) 0.058" (1.47mm) - - Forked - 4.5A per Contact - - Push-Pull - - - - - Black 0.400" (10.16mm) - - - - UL94 V-0 - Through Hole 34 All 2 -55°C ~ 125°C - - - 0.079" (2.00mm) - 0.079" (2.00mm) - - Board to Board or Cable - Solder - -
ESQT-117-03-L-Q-309
ESQT-117-03-L-Q-309
Samtec Inc.
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 Elevated Socket Tin 10.0µin (0.25µm) 0.149" (3.78mm) - - Forked - 4.5A per Contact - - Push-Pull - - - - - Black 0.309" (7.85mm) - - - - UL94 V-0 - Through Hole 68 All 4 -55°C ~ 125°C - - - 0.079" (2.00mm) - 0.079" (2.00mm) - - Board to Board or Cable - Solder - -
5025840577
5025840577
Molex
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5025840769
5025840769
Molex
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ESQT-117-03-L-Q-355
ESQT-117-03-L-Q-355
Samtec Inc.
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 Elevated Socket Tin 10.0µin (0.25µm) 0.103" (2.62mm) - - Forked - 4.5A per Contact - - Push-Pull - - - - - Black 0.355" (9.02mm) - - - - UL94 V-0 - Through Hole 68 All 4 -55°C ~ 125°C - - - 0.079" (2.00mm) - 0.079" (2.00mm) - - Board to Board or Cable - Solder - -
ESQT-117-03-L-S-309
ESQT-117-03-L-S-309
Samtec Inc.
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 Elevated Socket Tin 10.0µin (0.25µm) 0.149" (3.78mm) - - Forked - 4.5A per Contact - - Push-Pull - - - - - Black 0.309" (7.85mm) - - - - UL94 V-0 - Through Hole 17 All 1 -55°C ~ 125°C - - - 0.079" (2.00mm) - - - - Board to Board or Cable - Solder - -
ESQT-117-03-L-S-408
ESQT-117-03-L-S-408
Samtec Inc.
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 Elevated Socket Tin 10.0µin (0.25µm) 0.050" (1.27mm) - - Forked - 4.5A per Contact - - Push-Pull - - - - - Black 0.408" (10.36mm) - - - - UL94 V-0 - Through Hole 17 All 1 -55°C ~ 125°C - - - 0.079" (2.00mm) - - - - Board to Board or Cable - Solder - -
ESQT-117-03-L-T-400
ESQT-117-03-L-T-400
Samtec Inc.
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 Elevated Socket Tin 10.0µin (0.25µm) 0.058" (1.47mm) - - Forked - 4.5A per Contact - - Push-Pull - - - - - Black 0.400" (10.16mm) - - - - UL94 V-0 - Through Hole 51 All 3 -55°C ~ 125°C - - - 0.079" (2.00mm) - 0.079" (2.00mm) - - Board to Board or Cable - Solder - -
ESQT-117-03-LM-D-309
ESQT-117-03-LM-D-309
Samtec Inc.
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 Elevated Socket Tin 10.0µin (0.25µm) 0.149" (3.78mm) - - Forked - 4.5A per Contact - - Push-Pull - - - - - Black 0.309" (7.85mm) - - - - UL94 V-0 - Through Hole 34 All 2 -55°C ~ 125°C - - - 0.079" (2.00mm) - 0.079" (2.00mm) - - Board to Board or Cable - Solder - -
ESQT-117-03-LM-D-375
ESQT-117-03-LM-D-375
Samtec Inc.
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 Elevated Socket Tin 10.0µin (0.25µm) 0.083" (2.11mm) - - Forked - 4.5A per Contact - - Push-Pull - - - - - Black 0.375" (9.53mm) - - - - UL94 V-0 - Through Hole 34 All 2 -55°C ~ 125°C - - - 0.079" (2.00mm) - 0.079" (2.00mm) - - Board to Board or Cable - Solder - -
ESQT-117-03-LM-Q-309
ESQT-117-03-LM-Q-309
Samtec Inc.
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 Elevated Socket Tin 10.0µin (0.25µm) 0.149" (3.78mm) - - Forked - 4.5A per Contact - - Push-Pull - - - - - Black 0.309" (7.85mm) - - - - UL94 V-0 - Through Hole 68 All 4 -55°C ~ 125°C - - - 0.079" (2.00mm) - 0.079" (2.00mm) - - Board to Board or Cable - Solder - -
SS-120-G-21A-N
SS-120-G-21A-N
Samtec Inc.
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 Receptacle Gold 30.0碌in (0.76碌m) 0.360" (9.14mm) - - Female Socket - - - - Push-Pull - - - - - Black 0.100" (2.54mm) - - - - - - Through Hole 20 All 1 -55°C ~ 125°C - - - 0.100" (2.54mm) - - - - Board to Board - Solder - -
ESW-108-49-S-S
ESW-108-49-S-S
Download Datasheet for ESW-108-49-S-S
Samtec Inc.
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 Elevated Socket Tin 30.0µin (0.76µm) 0.380" (9.65mm) - - Forked - 5.2A per Contact - - Push-Pull - - - - - Black 0.535" (13.60mm) - - - - UL94 V-0 - Through Hole 8 All 1 -55°C ~ 125°C - - - 0.100" (2.54mm) - - - - Board to Board - Solder - 550VAC
ESW-108-49-S-S-LL
ESW-108-49-S-S-LL
Download Datasheet for ESW-108-49-S-S-LL
Samtec Inc.
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 Elevated Socket Tin 30.0µin (0.76µm) 0.380" (9.65mm) - - Forked - 5.2A per Contact - - Push-Pull - - - - - Black 0.535" (13.60mm) - - - - UL94 V-0 - Through Hole 8 All 1 -55°C ~ 125°C - - - 0.100" (2.54mm) - - - - Board to Board - Kinked Pin, Solder - 550VAC
ESW-108-58-G-D-LL
ESW-108-58-G-D-LL
Download Datasheet for ESW-108-58-G-D-LL
Samtec Inc.
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 Elevated Socket Gold 20.0µin (0.51µm) 0.090" (2.29mm) - - Forked - 5.2A per Contact - - Push-Pull - - - - - Black 0.635" (16.13mm) - - - - UL94 V-0 - Through Hole 16 All 2 -55°C ~ 125°C - - - 0.100" (2.54mm) - 0.100" (2.54mm) - - Board to Board - Kinked Pin, Solder - 550VAC
ESW-108-58-G-S-LL
ESW-108-58-G-S-LL
Download Datasheet for ESW-108-58-G-S-LL
Samtec Inc.
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 Elevated Socket Gold 20.0µin (0.51µm) 0.090" (2.29mm) - - Forked - 5.2A per Contact - - Push-Pull - - - - - Black 0.635" (16.13mm) - - - - UL94 V-0 - Through Hole 8 All 1 -55°C ~ 125°C - - - 0.100" (2.54mm) - - - - Board to Board - Kinked Pin, Solder - 550VAC
ESW-108-58-L-D
ESW-108-58-L-D
Download Datasheet for ESW-108-58-L-D
Samtec Inc.
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 Elevated Socket Tin 10.0µin (0.25µm) 0.090" (2.29mm) - - Forked - 5.2A per Contact - - Push-Pull - - - - - Black 0.635" (16.13mm) - - - - UL94 V-0 - Through Hole 16 All 2 -55°C ~ 125°C - - - 0.100" (2.54mm) - 0.100" (2.54mm) - - Board to Board - Solder - 550VAC
ESW-108-58-S-D-LL
ESW-108-58-S-D-LL
Download Datasheet for ESW-108-58-S-D-LL
Samtec Inc.
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 Elevated Socket Tin 30.0µin (0.76µm) 0.090" (2.29mm) - - Forked - 5.2A per Contact - - Push-Pull - - - - - Black 0.635" (16.13mm) - - - - UL94 V-0 - Through Hole 16 All 2 -55°C ~ 125°C - - - 0.100" (2.54mm) - 0.100" (2.54mm) - - Board to Board - Kinked Pin, Solder - 550VAC
ESW-108-58-S-S-LL
ESW-108-58-S-S-LL
Download Datasheet for ESW-108-58-S-S-LL
Samtec Inc.
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 Elevated Socket Tin 30.0µin (0.76µm) 0.090" (2.29mm) - - Forked - 5.2A per Contact - - Push-Pull - - - - - Black 0.635" (16.13mm) - - - - UL94 V-0 - Through Hole 8 All 1 -55°C ~ 125°C - - - 0.100" (2.54mm) - - - - Board to Board - Kinked Pin, Solder - 550VAC
5031750312
5031750312
Molex
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ESW-108-59-G-D-LL
ESW-108-59-G-D-LL
Download Datasheet for ESW-108-59-G-D-LL
Samtec Inc.
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 Elevated Socket Gold 20.0µin (0.51µm) 0.280" (7.11mm) - - Forked - 5.2A per Contact - - Push-Pull - - - - - Black 0.635" (16.13mm) - - - - UL94 V-0 - Through Hole 16 All 2 -55°C ~ 125°C - - - 0.100" (2.54mm) - 0.100" (2.54mm) - - Board to Board - Kinked Pin, Solder - 550VAC
ESW-108-59-G-S-LL
ESW-108-59-G-S-LL
Download Datasheet for ESW-108-59-G-S-LL
Samtec Inc.
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 Elevated Socket Gold 20.0µin (0.51µm) 0.280" (7.11mm) - - Forked - 5.2A per Contact - - Push-Pull - - - - - Black 0.635" (16.13mm) - - - - UL94 V-0 - Through Hole 8 All 1 -55°C ~ 125°C - - - 0.100" (2.54mm) - - - - Board to Board - Kinked Pin, Solder - 550VAC
ESW-108-59-S-D-LL
ESW-108-59-S-D-LL
Download Datasheet for ESW-108-59-S-D-LL
Samtec Inc.
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 Elevated Socket Tin 30.0µin (0.76µm) 0.280" (7.11mm) - - Forked - 5.2A per Contact - - Push-Pull - - - - - Black 0.635" (16.13mm) - - - - UL94 V-0 - Through Hole 16 All 2 -55°C ~ 125°C - - - 0.100" (2.54mm) - 0.100" (2.54mm) - - Board to Board - Kinked Pin, Solder - 550VAC
ESW-108-59-S-S
ESW-108-59-S-S
Download Datasheet for ESW-108-59-S-S
Samtec Inc.
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 Elevated Socket Tin 30.0µin (0.76µm) 0.280" (7.11mm) - - Forked - 5.2A per Contact - - Push-Pull - - - - - Black 0.635" (16.13mm) - - - - UL94 V-0 - Through Hole 8 All 1 -55°C ~ 125°C - - - 0.100" (2.54mm) - - - - Board to Board - Solder - 550VAC
ESW-108-59-S-S-LL
ESW-108-59-S-S-LL
Download Datasheet for ESW-108-59-S-S-LL
Samtec Inc.
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 Elevated Socket Tin 30.0µin (0.76µm) 0.280" (7.11mm) - - Forked - 5.2A per Contact - - Push-Pull - - - - - Black 0.635" (16.13mm) - - - - UL94 V-0 - Through Hole 8 All 1 -55°C ~ 125°C - - - 0.100" (2.54mm) - - - - Board to Board - Kinked Pin, Solder - 550VAC
ESW-108-69-G-D-LL
ESW-108-69-G-D-LL
Download Datasheet for ESW-108-69-G-D-LL
Samtec Inc.
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 Elevated Socket Gold 20.0µin (0.51µm) 0.180" (4.57mm) - - Forked - 5.2A per Contact - - Push-Pull - - - - - Black 0.735" (18.67mm) - - - - UL94 V-0 - Through Hole 16 All 2 -55°C ~ 125°C - - - 0.100" (2.54mm) - 0.100" (2.54mm) - - Board to Board - Kinked Pin, Solder - 550VAC
ESW-108-69-G-S-LL
ESW-108-69-G-S-LL
Download Datasheet for ESW-108-69-G-S-LL
Samtec Inc.
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 Elevated Socket Gold 20.0µin (0.51µm) 0.180" (4.57mm) - - Forked - 5.2A per Contact - - Push-Pull - - - - - Black 0.735" (18.67mm) - - - - UL94 V-0 - Through Hole 8 All 1 -55°C ~ 125°C - - - 0.100" (2.54mm) - - - - Board to Board - Kinked Pin, Solder - 550VAC
5031750403
5031750403
Molex
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ESW-108-69-S-D-LL
ESW-108-69-S-D-LL
Download Datasheet for ESW-108-69-S-D-LL
Samtec Inc.
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Price on request
Price and Stock
on Request
Stock on Request
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 Elevated Socket Tin 30.0µin (0.76µm) 0.180" (4.57mm) - - Forked - 5.2A per Contact - - Push-Pull - - - - - Black 0.735" (18.67mm) - - - - UL94 V-0 - Through Hole 16 All 2 -55°C ~ 125°C - - - 0.100" (2.54mm) - 0.100" (2.54mm) - - Board to Board - Kinked Pin, Solder - 550VAC
ESW-108-69-S-S-LL
ESW-108-69-S-S-LL
Download Datasheet for ESW-108-69-S-S-LL
Samtec Inc.
Stock on Request
Send RFQ
Price on request
Price and Stock
on Request
Stock on Request
Send RFQ
 Elevated Socket Tin 30.0µin (0.76µm) 0.180" (4.57mm) - - Forked - 5.2A per Contact - - Push-Pull - - - - - Black 0.735" (18.67mm) - - - - UL94 V-0 - Through Hole 8 All 1 -55°C ~ 125°C - - - 0.100" (2.54mm) - - - - Board to Board - Kinked Pin, Solder - 550VAC
ESW-109-12-G-D-LL
ESW-109-12-G-D-LL
Download Datasheet for ESW-109-12-G-D-LL
Samtec Inc.
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 Elevated Socket Gold 20.0µin (0.51µm) 0.090" (2.29mm) - - Forked - 5.2A per Contact - - Push-Pull - - - - - Black 0.435" (11.05mm) - - - - UL94 V-0 - Through Hole 18 All 2 -55°C ~ 125°C - - - 0.100" (2.54mm) - 0.100" (2.54mm) - - Board to Board - Kinked Pin, Solder - 550VAC
ESW-109-12-L-S-LL
ESW-109-12-L-S-LL
Download Datasheet for ESW-109-12-L-S-LL
Samtec Inc.
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 Elevated Socket Tin 10.0µin (0.25µm) 0.090" (2.29mm) - - Forked - 5.2A per Contact - - Push-Pull - - - - - Black 0.435" (11.05mm) - - - - UL94 V-0 - Through Hole 9 All 1 -55°C ~ 125°C - - - 0.100" (2.54mm) - - - - Board to Board - Kinked Pin, Solder - 550VAC
ESW-109-12-S-S-LL
ESW-109-12-S-S-LL
Download Datasheet for ESW-109-12-S-S-LL
Samtec Inc.
Stock on Request
Send RFQ
Price on request
Price and Stock
on Request
Stock on Request
Send RFQ
 Elevated Socket Tin 30.0µin (0.76µm) 0.090" (2.29mm) - - Forked - 5.2A per Contact - - Push-Pull - - - - - Black 0.435" (11.05mm) - - - - UL94 V-0 - Through Hole 9 All 1 -55°C ~ 125°C - - - 0.100" (2.54mm) - - - - Board to Board - Kinked Pin, Solder - 550VAC
Showing 144001-144050 of 206,944 products

About Headers, Receptacles, Female Sockets

Headers, Receptacles, and Female Sockets are essential components in the realm of electronic interconnects, facilitating reliable connections between circuit boards and cables. This category encompasses a variety of connector types, including board-to-board, board-to-cable/wire, and board-to-FPC configurations, catering to diverse application needs.

When sourcing Headers, Receptacles, and Female Sockets, it is crucial to consider important attributes such as connector type, contact finish, contact finish thickness, contact length, and current rating. These specifications play a significant role in ensuring compatibility with existing designs and meeting performance requirements.

Applications for these components range from new product design and prototyping to production electronics assembly and maintenance. They are integral in engineering evaluations and qualifications, as well as in procurement-driven multi-sourcing strategies.

For optimal sourcing, buyers should prioritize comparing critical specifications and validating lifecycle status. It is advisable to confirm mechanical and electrical compatibility with existing design constraints before submitting a Request for Quotation (RFQ). By focusing on parametric filtering, buyers can effectively reduce sourcing risks and ensure they select the most suitable components for their projects.

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