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Headers, Male Pins

Headers, Male Pins facilitate electrical connections between circuit boards and cables. Key attributes include Connector Type, Contact Finish, and Current Rating. These components are essential for applications such as production electronics assembly and engineering evaluation.

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What are Headers, Male Pins ?

Headers, Male Pins are electrical connectors designed to establish connections between printed circuit boards and cables. They are commonly used in board-to-board and cable interconnect applications, making them vital for new product design and prototyping. Important specifications for selection include Contact Finish, which affects conductivity and durability; Current Rating (Amps), which determines the maximum load the connector can handle; and Contact Length, which ensures compatibility with mating components. It's crucial for procurement teams to validate lifecycle status and consider alternate sourcing options to mitigate supply chain risks.

Parts in this category

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Part & Mfr Total Stock Pricing & RFQ Connector Type Contact Finish Contact Finish Thickness Contact Length Contact Material Contact Shape Contact Type Current Rating Current Rating (Amps) Fastening Type Features Ingress Protection Insulation Color Insulation Height Insulation Material Lead Spacing Lead Style Material Flammability Rating Mounting Type Number of Positions Number of Positions Loaded Number of Rows Operating Temperature Overall Contact Length Pitch Row Spacing Shrouding Storage Temperature Style Tape & Reel Termination Termination Style Voltage Rating
929836-02-31-RK
929836-02-31-RK
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3M Electronic Solutions
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 Header Tin 200.0碌in (5.08碌m) 0.235" (5.97mm) Copper Alloy Square Male Pin - 2.5A Push-Pull - - Black 0.100" (2.54mm) Polycyclohexylenedimethylene Terephthalate (PCT) - - UL94 V-0 Through Hole 62 All 2 -40°C ~ 105°C 0.545" (13.84mm) 0.100" (2.54mm) 0.100" (2.54mm) Unshrouded - Board to Board - Solder - -
929836-03-31-RK
929836-03-31-RK
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3M Electronic Solutions
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 Header Tin 200.0碌in (5.08碌m) 0.235" (5.97mm) Copper Alloy Square Male Pin - 2.5A Push-Pull - - Black 0.100" (2.54mm) Polycyclohexylenedimethylene Terephthalate (PCT) - - UL94 V-0 Through Hole 62 All 2 -40°C ~ 105°C 0.745" (18.92mm) 0.100" (2.54mm) 0.100" (2.54mm) Unshrouded - Board to Board - Solder - -
929836-04-31-RK
929836-04-31-RK
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3M Electronic Solutions
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 Header Tin 200.0碌in (5.08碌m) 0.235" (5.97mm) Copper Alloy Square Male Pin - 2.5A Push-Pull - - Black 0.100" (2.54mm) Polycyclohexylenedimethylene Terephthalate (PCT) - - UL94 V-0 Through Hole 62 All 2 -40°C ~ 105°C 0.845" (21.46mm) 0.100" (2.54mm) 0.100" (2.54mm) Unshrouded - Board to Board - Solder - -
929836-05-31-RK
929836-05-31-RK
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3M Electronic Solutions
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 Header Tin 200.0碌in (5.08碌m) 0.235" (5.97mm) Copper Alloy Square Male Pin - 2.5A Push-Pull - - Black 0.100" (2.54mm) Polycyclohexylenedimethylene Terephthalate (PCT) - - UL94 V-0 Through Hole 62 All 2 -40°C ~ 105°C 0.945" (24.00mm) 0.100" (2.54mm) 0.100" (2.54mm) Unshrouded - Board to Board - Solder - -
929836-08-31-RK
929836-08-31-RK
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3M Electronic Solutions
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 Header Tin 200.0碌in (5.08碌m) 0.235" (5.97mm) Copper Alloy Square Male Pin - 2.5A Push-Pull - - Black 0.100" (2.54mm) Polycyclohexylenedimethylene Terephthalate (PCT) - - UL94 V-0 Through Hole 62 All 2 -40°C ~ 105°C 0.645" (16.38mm) 0.100" (2.54mm) 0.100" (2.54mm) Unshrouded - Board to Board - Solder - -
929836-09-31-RK
929836-09-31-RK
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3M Electronic Solutions
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 Header Tin 200.0碌in (5.08碌m) 0.235" (5.97mm) Copper Alloy Square Male Pin - 2.5A Push-Pull - - Black 0.100" (2.54mm) Polycyclohexylenedimethylene Terephthalate (PCT) - - UL94 V-0 Through Hole 62 All 2 -40°C ~ 105°C 0.480" (12.19mm) 0.100" (2.54mm) 0.100" (2.54mm) Unshrouded - Board to Board - Solder - -
TSW-127-05-S-S
TSW-127-05-S-S
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Samtec Inc.
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 Header Tin 30.0碌in (0.76碌m) 0.105" (2.67mm) Phosphor Bronze Square Male Pin - - Push-Pull - - Black 0.100" (2.54mm) Polybutylene Terephthalate (PBT) - - UL94 V-0 Through Hole 27 All 1 -55°C ~ 125°C 0.335" (8.51mm) 0.100" (2.54mm) - Unshrouded - Board to Board or Cable - Solder - -
TSW-121-07-S-S
TSW-121-07-S-S
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Samtec Inc.
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 Header Tin 30.0碌in (0.76碌m) 0.230" (5.84mm) Phosphor Bronze Square Male Pin - - Push-Pull - - Black 0.100" (2.54mm) Polybutylene Terephthalate (PBT) - - UL94 V-0 Through Hole 21 All 1 -55°C ~ 125°C 0.430" (10.92mm) 0.100" (2.54mm) - Unshrouded - Board to Board or Cable - Solder - -
TSW-110-23-S-D
TSW-110-23-S-D
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Samtec Inc.
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 Header Tin 30.0碌in (0.76碌m) 0.230" (5.84mm) Phosphor Bronze Square Male Pin - - Push-Pull - - Black 0.100" (2.54mm) Polybutylene Terephthalate (PBT) - - UL94 V-0 Through Hole 20 All 2 -55°C ~ 125°C 0.445" (11.30mm) 0.100" (2.54mm) 0.100" (2.54mm) Unshrouded - Board to Board or Cable - Solder - -
TSW-120-23-S-S
TSW-120-23-S-S
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Samtec Inc.
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 Header Tin 30.0碌in (0.76碌m) 0.230" (5.84mm) Phosphor Bronze Square Male Pin - - Push-Pull - - Black 0.100" (2.54mm) Polybutylene Terephthalate (PBT) - - UL94 V-0 Through Hole 20 All 1 -55°C ~ 125°C 0.445" (11.30mm) 0.100" (2.54mm) - Unshrouded - Board to Board or Cable - Solder - -
TSW-225-10-T-S
TSW-225-10-T-S
Samtec Inc.
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 Header Tin - 0.230" (5.84mm) Phosphor Bronze Square Male Pin - - Push-Pull - - Black 0.100" (2.54mm) Polybutylene Terephthalate (PBT) - - UL94 V-0 Through Hole 25 All 1 -55°C ~ 105°C 0.830" (21.08mm) 0.200" (5.08mm) - Unshrouded - Board to Board or Cable - Solder - -
9-103330-0-25
9-103330-0-25
TE Connectivity
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 Header, Breakaway Tin 100.0碌in (2.54碌m) 0.230" (5.84mm) Copper Alloy Square Male Pin - 3A Push-Pull - - Black 0.238" (6.05mm) Thermoplastic - - UL94 V-0 Through Hole, Right Angle 50 All 2 -65°C ~ 105°C - 0.100" (2.54mm) 0.100" (2.54mm) Unshrouded - Board to Board or Cable - Solder - -
HTSW-108-08-S-D-RA
HTSW-108-08-S-D-RA
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Samtec Inc.
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 Header Tin 30.0碌in (0.76碌m) 0.230" (5.84mm) Phosphor Bronze Square Male Pin - Varies by Wire Gauge Push-Pull - - Natural 0.240" (6.10mm) Liquid Crystal Polymer (LCP) - - UL94 V-0 Through Hole, Right Angle 16 All 2 -55°C ~ 125°C - 0.100" (2.54mm) 0.100" (2.54mm) Unshrouded - Board to Board or Cable - Solder - -
ZSS-105-03-L-D-665
ZSS-105-03-L-D-665
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Samtec Inc.
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 Header, Elevated Tin 10.0碌in (0.25碌m) 0.250" (6.35mm) Phosphor Bronze Square Male Pin - 3A Push-Pull Keying Slot - Black 0.665" (16.89mm) Polyester, Glass Filled - - UL94 V-0 Through Hole 10 All 2 -55°C ~ 125°C 0.830" (21.08mm) 0.100" (2.54mm) 0.100" (2.54mm) Shrouded - 4 Wall - Board to Board or Cable - Solder - -
0026481211
0026481211
Molex
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 Header, Breakaway Tin 60.0碌in (1.52碌m) 0.450" (11.43mm) Brass Square Male Pin - - Push-Pull - - Black 0.128" (3.25mm) Polyester, Glass Filled - - UL94 V-0 Through Hole 21 All 1 - 0.750" (19.05mm) 0.156" (3.96mm) - Unshrouded - Board to Board or Cable - Solder - -
0416710021
0416710021
Molex
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 Header, Breakaway Tin 15.0碌in (0.38碌m) 0.450" (11.43mm) Brass Square Male Pin - - Friction Lock - - Black 0.500" (12.70mm) Polyester - - UL94 V-0 Through Hole 22 All 1 - 0.750" (19.05mm) 0.156" (3.96mm) - Shrouded - 1 Wall - Board to Board or Cable - Solder - -
TSM-105-01-S-DH-001
TSM-105-01-S-DH-001
Download Datasheet for TSM-105-01-S-DH-001
Samtec Inc.
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 Header Tin 30.0碌in (0.76碌m) 0.230" (5.84mm) Phosphor Bronze Square Male Pin - - Push-Pull - - Black 0.240" (6.10mm) Liquid Crystal Polymer (LCP) - - UL94 V-0 Surface Mount, Right Angle 10 9 2 -55°C ~ 125°C - 0.100" (2.54mm) 0.100" (2.54mm) Unshrouded - Board to Board or Cable - Solder - -
TSM-105-01-S-DH-002
TSM-105-01-S-DH-002
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Samtec Inc.
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 Header Tin 30.0碌in (0.76碌m) 0.230" (5.84mm) Phosphor Bronze Square Male Pin - - Push-Pull - - Black 0.240" (6.10mm) Liquid Crystal Polymer (LCP) - - UL94 V-0 Surface Mount, Right Angle 10 9 2 -55°C ~ 125°C - 0.100" (2.54mm) 0.100" (2.54mm) Unshrouded - Board to Board or Cable - Solder - -
TSM-105-01-S-DH-006
TSM-105-01-S-DH-006
Download Datasheet for TSM-105-01-S-DH-006
Samtec Inc.
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 Header Tin 30.0碌in (0.76碌m) 0.230" (5.84mm) Phosphor Bronze Square Male Pin - - Push-Pull - - Black 0.240" (6.10mm) Liquid Crystal Polymer (LCP) - - UL94 V-0 Surface Mount, Right Angle 10 9 2 -55°C ~ 125°C - 0.100" (2.54mm) 0.100" (2.54mm) Unshrouded - Board to Board or Cable - Solder - -
TSM-105-01-S-DH-007
TSM-105-01-S-DH-007
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Samtec Inc.
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 Header Tin 30.0碌in (0.76碌m) 0.230" (5.84mm) Phosphor Bronze Square Male Pin - - Push-Pull - - Black 0.240" (6.10mm) Liquid Crystal Polymer (LCP) - - UL94 V-0 Surface Mount, Right Angle 10 9 2 -55°C ~ 125°C - 0.100" (2.54mm) 0.100" (2.54mm) Unshrouded - Board to Board or Cable - Solder - -
TSM-105-01-S-DH-008
TSM-105-01-S-DH-008
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Samtec Inc.
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 Header Tin 30.0碌in (0.76碌m) 0.230" (5.84mm) Phosphor Bronze Square Male Pin - - Push-Pull - - Black 0.240" (6.10mm) Liquid Crystal Polymer (LCP) - - UL94 V-0 Surface Mount, Right Angle 10 9 2 -55°C ~ 125°C - 0.100" (2.54mm) 0.100" (2.54mm) Unshrouded - Board to Board or Cable - Solder - -
TSM-105-01-S-DH-009
TSM-105-01-S-DH-009
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Samtec Inc.
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 Header Tin 30.0碌in (0.76碌m) 0.230" (5.84mm) Phosphor Bronze Square Male Pin - - Push-Pull - - Black 0.240" (6.10mm) Liquid Crystal Polymer (LCP) - - UL94 V-0 Surface Mount, Right Angle 10 9 2 -55°C ~ 125°C - 0.100" (2.54mm) 0.100" (2.54mm) Unshrouded - Board to Board or Cable - Solder - -
TSM-105-01-SS-DH-A
TSM-105-01-SS-DH-A
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Samtec Inc.
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 Header Tin 30.0碌in (0.76碌m) 0.230" (5.84mm) Phosphor Bronze Square Male Pin - - Push-Pull Board Guide - Black 0.240" (6.10mm) Liquid Crystal Polymer (LCP) - - UL94 V-0 Surface Mount, Right Angle 10 All 2 -55°C ~ 125°C - 0.100" (2.54mm) 0.100" (2.54mm) Unshrouded - Board to Board or Cable - Solder - -
TSM-105-02-S-DV-LC-P
TSM-105-02-S-DV-LC-P
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Samtec Inc.
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 Header Tin 30.0碌in (0.76碌m) 0.320" (8.13mm) Phosphor Bronze Square Male Pin - - Push-Pull Board Lock, Pick and Place - Black 0.100" (2.54mm) Liquid Crystal Polymer (LCP) - - UL94 V-0 Surface Mount 10 All 2 -55°C ~ 125°C - 0.100" (2.54mm) 0.100" (2.54mm) Unshrouded - Board to Board or Cable - Solder - -
TSM-107-03-L-DH-LC
TSM-107-03-L-DH-LC
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Samtec Inc.
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 Header Tin 10.0碌in (0.25碌m) 0.420" (10.67mm) Phosphor Bronze Square Male Pin - - Push-Pull Board Lock - Black 0.240" (6.10mm) Liquid Crystal Polymer (LCP) - - UL94 V-0 Surface Mount, Right Angle 14 All 2 -55°C ~ 125°C - 0.100" (2.54mm) 0.100" (2.54mm) Unshrouded - Board to Board or Cable - Solder - -
TSM-108-01-L-DH-003
TSM-108-01-L-DH-003
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Samtec Inc.
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 Header Tin 10.0碌in (0.25碌m) 0.230" (5.84mm) Phosphor Bronze Square Male Pin - - Push-Pull - - Black 0.240" (6.10mm) Liquid Crystal Polymer (LCP) - - UL94 V-0 Surface Mount, Right Angle 16 15 2 -55°C ~ 125°C - 0.100" (2.54mm) 0.100" (2.54mm) Unshrouded - Board to Board or Cable - Solder - -
TSM-108-01-L-DH-010
TSM-108-01-L-DH-010
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Samtec Inc.
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 Header Tin 10.0碌in (0.25碌m) 0.230" (5.84mm) Phosphor Bronze Square Male Pin - - Push-Pull - - Black 0.240" (6.10mm) Liquid Crystal Polymer (LCP) - - UL94 V-0 Surface Mount, Right Angle 16 15 2 -55°C ~ 125°C - 0.100" (2.54mm) 0.100" (2.54mm) Unshrouded - Board to Board or Cable - Solder - -
TSM-108-01-L-DH-014
TSM-108-01-L-DH-014
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Samtec Inc.
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 Header Tin 10.0碌in (0.25碌m) 0.230" (5.84mm) Phosphor Bronze Square Male Pin - - Push-Pull - - Black 0.240" (6.10mm) Liquid Crystal Polymer (LCP) - - UL94 V-0 Surface Mount, Right Angle 16 15 2 -55°C ~ 125°C - 0.100" (2.54mm) 0.100" (2.54mm) Unshrouded - Board to Board or Cable - Solder - -
TSM-108-01-L-DV-LC-P
TSM-108-01-L-DV-LC-P
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Samtec Inc.
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 Header Tin 10.0碌in (0.25碌m) 0.230" (5.84mm) Phosphor Bronze Square Male Pin - - Push-Pull Board Lock, Pick and Place - Black 0.100" (2.54mm) Liquid Crystal Polymer (LCP) - - UL94 V-0 Surface Mount 16 All 2 -55°C ~ 125°C - 0.100" (2.54mm) 0.100" (2.54mm) Unshrouded - Board to Board or Cable - Solder - -
TSM-108-01-S-SV-A-P
TSM-108-01-S-SV-A-P
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Samtec Inc.
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 Header Tin 30.0碌in (0.76碌m) 0.230" (5.84mm) Phosphor Bronze Square Male Pin - - Push-Pull Board Guide, Pick and Place - Black 0.100" (2.54mm) Liquid Crystal Polymer (LCP) - - UL94 V-0 Surface Mount 8 All 1 -55°C ~ 125°C - 0.100" (2.54mm) - Unshrouded - Board to Board or Cable - Solder - -
TSM-108-01-SM-SV-A-P
TSM-108-01-SM-SV-A-P
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Samtec Inc.
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 Header Tin 30.0碌in (0.76碌m) 0.230" (5.84mm) Phosphor Bronze Square Male Pin - - Push-Pull Board Guide, Pick and Place - Black 0.100" (2.54mm) Liquid Crystal Polymer (LCP) - - UL94 V-0 Surface Mount 8 All 1 -55°C ~ 125°C - 0.100" (2.54mm) - Unshrouded - Board to Board or Cable - Solder - -
TSM-108-02-S-SH-A
TSM-108-02-S-SH-A
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Samtec Inc.
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 Header Tin 30.0碌in (0.76碌m) 0.320" (8.13mm) Phosphor Bronze Square Male Pin - - Push-Pull Board Guide - Black 0.120" (3.05mm) Liquid Crystal Polymer (LCP) - - UL94 V-0 Surface Mount, Right Angle 8 All 1 -55°C ~ 125°C - 0.100" (2.54mm) - Unshrouded - Board to Board or Cable - Solder - -
TSM-111-02-F-DV-A
TSM-111-02-F-DV-A
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Samtec Inc.
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 Header Tin 3.00碌in (0.076碌m) 0.320" (8.13mm) Phosphor Bronze Square Male Pin - - Push-Pull Board Guide - Black 0.100" (2.54mm) Liquid Crystal Polymer (LCP) - - UL94 V-0 Surface Mount 22 All 2 -55°C ~ 125°C - 0.100" (2.54mm) 0.100" (2.54mm) Unshrouded - Board to Board or Cable - Solder - -
TSM-111-02-F-DV-LC
TSM-111-02-F-DV-LC
Download Datasheet for TSM-111-02-F-DV-LC
Samtec Inc.
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 Header Tin 3.00碌in (0.076碌m) 0.320" (8.13mm) Phosphor Bronze Square Male Pin - - Push-Pull Board Lock - Black 0.100" (2.54mm) Liquid Crystal Polymer (LCP) - - UL94 V-0 Surface Mount 22 All 2 -55°C ~ 125°C - 0.100" (2.54mm) 0.100" (2.54mm) Unshrouded - Board to Board or Cable - Solder - -
TFM-108-01-L-S-A
TFM-108-01-L-S-A
Samtec Inc.
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 Header Tin 15.0碌in (0.38碌m) 0.131" (3.33mm) Phosphor Bronze Square Male Pin - 2.9A per Contact Push-Pull Board Guide - Black 0.220" (5.60mm) Liquid Crystal Polymer (LCP) - - UL94 V-0 Through Hole 8 All 1 -55°C ~ 125°C - 0.050" (1.27mm) - Shrouded - 4 Wall - Board to Board or Cable - Solder - 275VAC
TFM-108-01-L-S
TFM-108-01-L-S
Samtec Inc.
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 Header Tin 15.0碌in (0.38碌m) 0.131" (3.33mm) Phosphor Bronze Square Male Pin - 2.9A per Contact Push-Pull - - Black 0.220" (5.60mm) Liquid Crystal Polymer (LCP) - - UL94 V-0 Through Hole 8 All 1 -55°C ~ 125°C - 0.050" (1.27mm) - Shrouded - 4 Wall - Board to Board or Cable - Solder - 275VAC
TMMH-111-01-F-DV
TMMH-111-01-F-DV
Samtec Inc.
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 Header, Cuttable Tin 3.00碌in (0.076碌m) 0.126" (3.20mm) Phosphor Bronze Square Male Pin - - Push-Pull - - Black 0.079" (2.00mm) Liquid Crystal Polymer (LCP) - - UL94 V-0 Surface Mount 22 All 2 -55°C ~ 125°C - 0.079" (2.00mm) 0.079" (2.00mm) Unshrouded - Board to Board or Cable - Solder - -
TMM-112-01-F-D-RA
TMM-112-01-F-D-RA
Download Datasheet for TMM-112-01-F-D-RA
Samtec Inc.
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 Header Tin 3.00碌in (0.076碌m) 0.126" (3.20mm) Phosphor Bronze Square Male Pin - 3.2A per Row Push-Pull - - Black 0.155" (3.94mm) Liquid Crystal Polymer (LCP) - - - Through Hole, Right Angle 24 All 2 -55°C ~ 125°C - 0.079" (2.00mm) 0.079" (2.00mm) Unshrouded - Board to Board or Cable - Solder - -
TMM-112-01-FM-D-RA
TMM-112-01-FM-D-RA
Download Datasheet for TMM-112-01-FM-D-RA
Samtec Inc.
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 Header Tin 3.00碌in (0.076碌m) 0.126" (3.20mm) Phosphor Bronze Square Male Pin - 3.2A per Row Push-Pull - - Black 0.155" (3.94mm) Liquid Crystal Polymer (LCP) - - - Through Hole, Right Angle 24 All 2 -55°C ~ 125°C - 0.079" (2.00mm) 0.079" (2.00mm) Unshrouded - Board to Board or Cable - Solder - -
TMM-112-06-F-D
TMM-112-06-F-D
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Samtec Inc.
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 Header Tin 3.00碌in (0.076碌m) 0.126" (3.20mm) Phosphor Bronze Square Male Pin - 3.2A per Row Push-Pull - - Black 0.059" (1.50mm) Liquid Crystal Polymer (LCP) - - - Through Hole 24 All 2 -55°C ~ 125°C 0.377" (9.58mm) 0.079" (2.00mm) 0.079" (2.00mm) Unshrouded - Board to Board or Cable - Solder - -
TMM-119-02-T-D
TMM-119-02-T-D
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Samtec Inc.
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 Header Tin - 0.146" (3.71mm) Phosphor Bronze Square Male Pin - 3.2A per Contact Push-Pull - - Black 0.059" (1.50mm) Liquid Crystal Polymer (LCP) - - - Through Hole 38 All 2 -55°C ~ 105°C 0.323" (8.20mm) 0.079" (2.00mm) 0.079" (2.00mm) Unshrouded - Board to Board or Cable - Solder - -
TMM-119-03-T-D
TMM-119-03-T-D
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Samtec Inc.
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 Header Tin - 0.157" (4.00mm) Phosphor Bronze Square Male Pin - 3.2A per Contact Push-Pull - - Black 0.059" (1.50mm) Liquid Crystal Polymer (LCP) - - - Through Hole 38 All 2 -55°C ~ 105°C 0.323" (8.20mm) 0.079" (2.00mm) 0.079" (2.00mm) Unshrouded - Board to Board or Cable - Solder - -
TMM-105-01-S-D-SM-P
TMM-105-01-S-D-SM-P
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Samtec Inc.
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 Header Tin 30.0碌in (0.76碌m) 0.126" (3.20mm) Phosphor Bronze Square Male Pin - 3.2A per Contact Push-Pull Pick and Place - Black 0.059" (1.50mm) Liquid Crystal Polymer (LCP) - - UL94 V-0 Surface Mount 10 All 2 -55°C ~ 125°C - 0.079" (2.00mm) 0.079" (2.00mm) Unshrouded - Board to Board or Cable - Solder - -
TMS-110-03-S-S-RA
TMS-110-03-S-S-RA
Samtec Inc.
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 Header Tin 30.0碌in (0.76碌m) 0.125" (3.18mm) Phosphor Bronze Square Male Pin - 5A per Contact Push-Pull - - Black 0.098" (2.50mm) Liquid Crystal Polymer (LCP) - - UL94 V-0 Through Hole, Right Angle 10 All 1 -55°C ~ 125°C - 0.050" (1.27mm) - Unshrouded - Board to Board - Solder - -
TMM-106-06-G-D-SM-P
TMM-106-06-G-D-SM-P
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Samtec Inc.
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 Header Gold 20.0碌in (0.51碌m) 0.168" (4.27mm) Phosphor Bronze Square Male Pin - 3.2A per Contact Push-Pull Pick and Place - Black 0.059" (1.50mm) Liquid Crystal Polymer (LCP) - - UL94 V-0 Surface Mount 12 All 2 -55°C ~ 125°C - 0.079" (2.00mm) 0.079" (2.00mm) Unshrouded - Board to Board or Cable - Solder - -
TMM-107-06-G-D-SM
TMM-107-06-G-D-SM
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Samtec Inc.
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 Header Gold 20.0碌in (0.51碌m) 0.168" (4.27mm) Phosphor Bronze Square Male Pin - 3.2A per Contact Push-Pull - - Black 0.059" (1.50mm) Liquid Crystal Polymer (LCP) - - UL94 V-0 Surface Mount 14 All 2 -55°C ~ 125°C - 0.079" (2.00mm) 0.079" (2.00mm) Unshrouded - Board to Board or Cable - Solder - -
TMM-108-05-L-D-SM-P
TMM-108-05-L-D-SM-P
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Samtec Inc.
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 Header Tin 10.0碌in (0.25碌m) 0.065" (1.65mm) Phosphor Bronze Square Male Pin - 3.2A per Contact Push-Pull Pick and Place - Black 0.059" (1.50mm) Liquid Crystal Polymer (LCP) - - UL94 V-0 Surface Mount 16 All 2 -55°C ~ 125°C - 0.079" (2.00mm) 0.079" (2.00mm) Unshrouded - Board to Board or Cable - Solder - -
TMM-110-01-F-D-SM-007
TMM-110-01-F-D-SM-007
Download Datasheet for TMM-110-01-F-D-SM-007
Samtec Inc.
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 Header Tin 3.00碌in (0.076碌m) 0.126" (3.20mm) Phosphor Bronze Square Male Pin - 3.2A per Contact Push-Pull - - Black 0.059" (1.50mm) Liquid Crystal Polymer (LCP) - - UL94 V-0 Surface Mount 20 19 2 -55°C ~ 125°C - 0.079" (2.00mm) 0.079" (2.00mm) Unshrouded - Board to Board or Cable - Solder - -
TMM-110-01-F-D-SM-020
TMM-110-01-F-D-SM-020
Download Datasheet for TMM-110-01-F-D-SM-020
Samtec Inc.
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 Header Tin 3.00碌in (0.076碌m) 0.126" (3.20mm) Phosphor Bronze Square Male Pin - 3.2A per Contact Push-Pull - - Black 0.059" (1.50mm) Liquid Crystal Polymer (LCP) - - UL94 V-0 Surface Mount 20 19 2 -55°C ~ 125°C - 0.079" (2.00mm) 0.079" (2.00mm) Unshrouded - Board to Board or Cable - Solder - -
TMM-110-06-F-D-SM
TMM-110-06-F-D-SM
Download Datasheet for TMM-110-06-F-D-SM
Samtec Inc.
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Stock on Request
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 Header Tin 3.00碌in (0.076碌m) 0.168" (4.27mm) Phosphor Bronze Square Male Pin - 3.2A per Contact Push-Pull - - Black 0.059" (1.50mm) Liquid Crystal Polymer (LCP) - - UL94 V-0 Surface Mount 20 All 2 -55°C ~ 125°C - 0.079" (2.00mm) 0.079" (2.00mm) Unshrouded - Board to Board or Cable - Solder - -
Showing 489101-489150 of 520,809 products

About Headers, Male Pins

Headers, Male Pins are critical components used in a variety of electronic applications, particularly for board-to-board and cable interconnects. These connectors facilitate seamless connections between different circuit boards or between a circuit board and a cable, making them indispensable in new product design, prototyping, and production electronics assembly.

When sourcing Headers, Male Pins, it is essential to consider several important attributes that can impact performance and compatibility. Key specifications include Connector Type, Contact Finish, Contact Finish Thickness, Contact Length, Contact Material, Contact Shape, and Contact Type. Understanding these attributes will help you select the right connector for your specific application needs.

Applications for Headers, Male Pins range from engineering evaluation and qualification to maintenance and field replacement. They are also widely used in procurement-driven multi-sourcing scenarios, where validating lifecycle status and exploring alternate-source options are crucial.

Before submitting a Request for Quotation (RFQ), buyers should prioritize comparing critical specifications and confirming mechanical and electrical compatibility with existing design constraints. Utilizing parametric filtering can significantly reduce sourcing risks and ensure that the selected components meet the necessary requirements.

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