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Leadframe

Leadframes facilitate the connection of electronic components within circuit assemblies. Key specifications include Board Thickness, Clip Length, Clip Style, and Frame Width. These attributes are essential for ensuring compatibility in board-to-board and cable interconnect applications.

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What are Leadframe ?

Leadframes are structural components used to support and connect electronic parts in circuit assemblies. They are commonly utilized in applications such as board-to-board and cable interconnects, as well as in production electronics assembly. Important specifications for leadframes include Board Thickness, which affects mechanical stability; Clip Length, which influences the secure fit of components; and Frame Width, which determines the overall footprint and compatibility with PCB designs. Ensuring these specifications align with existing design constraints is crucial for effective sourcing and procurement.

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Part & Mfr Total Stock Pricing & RFQ AEC Qualified Automotive Grade Board Thickness Clip Length Clip Style Clip Type Color Conflict Minerals Contact Finish Contact Material Country of Origin EAN Features Frame Thickness Frame Width Halogen Free Humidity Rating Industrial Grade Lead Spacing Lead Style Medical Grade Military Grade Mounting Type Pin Length Pitch Prop 65 SVHC Present Storage Temperature Tape & Reel Termination Termination Style UPC
1544143-2
1544143-2
TE Connectivity
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 - - 0.025" (0.64mm) 0.055" (1.40mm) DIL G1 - - Tin Phosphor Bronze - - - 0.010" (0.25mm) 0.713" (18.10mm) - - - - - - - - 0.358" (9.10mm) 0.100" (2.54mm) - - - - Through Hole - -
1544172-2
1544172-2
TE Connectivity
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 - - - 0.055" (1.40mm) DIL Y1 - - Tin Phosphor Bronze - - - 0.010" (0.25mm) 0.713" (18.10mm) - - - - - - - - 0.358" (9.10mm) 0.100" (2.54mm) - - - - Through Hole - -
1544172-1
1544172-1
TE Connectivity
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 - - - 0.055" (1.40mm) DIL Y1 - - Tin Phosphor Bronze - - - 0.010" (0.25mm) 0.713" (18.10mm) - - - - - - - - 0.358" (9.10mm) 0.100" (2.54mm) - - - - Through Hole - -
1544184-1
1544184-1
TE Connectivity
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 - - - 0.055" (1.40mm) DIL Y1 - - Tin Phosphor Bronze - - - 0.010" (0.25mm) 0.713" (18.10mm) - - - - - - - - 0.260" (6.60mm) 0.100" (2.54mm) - - - - Through Hole - -
1544222-1
1544222-1
TE Connectivity
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 - - 0.025" (0.64mm) 0.055" (1.40mm) SIL Y1 - - Tin Phosphor Bronze - - - 0.010" (0.25mm) 0.713" (18.10mm) - - - - - - - - 0.374" (9.50mm) 0.100" (2.54mm) - - - - Through Hole - -
1544315-2
1544315-2
TE Connectivity
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 - - - 0.071" (1.80mm) SIL Y1 - - Tin - - - - 0.014" (0.35mm) 0.713" (18.10mm) - - - - - - - - 0.374" (9.50mm) 0.100" (2.54mm) - - - - Through Hole - -
1544443-4
1544443-4
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 - - 0.039" (1.00mm) 0.055" (1.40mm) DIL G1 - - Tin - - - - 0.010" (0.25mm) 0.713" (18.10mm) - - - - - - - - 0.358" (9.10mm) 0.100" (2.54mm) - - - - Through Hole - -
1544256-1
1544256-1
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 - - 0.047" (1.19mm) 0.071" (1.80mm) SIL Y1 - - Tin Phosphor Bronze - - - 0.010" (0.25mm) 0.713" (18.10mm) - - - - - - - - 0.374" (9.50mm) 0.100" (2.54mm) - - - - Through Hole - -
1989461-9
1989461-9
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1989461-8
1989461-8
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1544242-1
1544242-1
TE Connectivity
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 - - 0.045" (1.14mm) 0.055" (1.40mm) SIL Y1 - - Tin Phosphor Bronze - - - 0.010" (0.25mm) 0.713" (18.10mm) - - - - - - - - 0.374" (9.50mm) 0.100" (2.54mm) - - - - Through Hole - -
1-1989461-5
1-1989461-5
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1544210-2
1544210-2
TE Connectivity
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 - - 0.063" (1.60mm) 0.043" (1.10mm) SIL Y1 - - Tin Phosphor Bronze - - - 0.010" (0.25mm) 0.713" (18.10mm) - - - - - - - - 0.338" (8.59mm) 0.100" (2.54mm) - - - - Through Hole - -
Showing 51-63 of 63 products

About Leadframe

Leadframe components play a vital role in the realm of electronic interconnects, particularly in board-to-board and cable interconnect applications. These components are designed to facilitate reliable connections while ensuring optimal performance in various electronic systems.

When sourcing leadframe components, it is crucial to consider several important attributes such as board thickness, clip length, clip style, clip type, frame thickness, frame width, pin length, and pitch. These specifications directly impact the compatibility and functionality of the components within your design constraints.

Leadframe components are commonly used in new product design and prototyping, production electronics assembly, maintenance and field replacement, as well as engineering evaluation and qualification. Understanding the applications of leadframe components can significantly enhance your procurement-driven multi-sourcing strategies.

Before submitting a request for quotation (RFQ), it is advisable to compare critical specifications first. Validate the lifecycle status and explore alternate-source options to mitigate sourcing risks. Confirming mechanical and electrical compatibility with existing design constraints is essential to ensure successful integration into your projects.

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