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Specialized

Specialized Backplane Connectors facilitate high-density interconnections in electronic systems. Key attributes include Connector Style, Contact Finish, and Number of Columns. These connectors are essential for applications such as board-to-board interconnects and production electronics assembly.

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What are Specialized ?

Specialized Backplane Connectors are designed for specific interconnection needs in electronic systems, providing reliable connections in compact spaces. They are commonly used in applications like board-to-board and cable interconnects, as well as in new product design and prototyping. Important specifications for selection include Connector Style, which affects compatibility with mating connectors; Contact Finish, which influences conductivity and corrosion resistance; and Mounting Type, which determines installation methods. Ensuring these specifications align with existing design constraints is crucial for successful procurement.

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Part & Mfr Total Stock Pricing & RFQ Color Connector Style Connector Type Connector Usage Contact Finish Contact Finish Thickness Contact Layout, Typical Features Mounting Type Number of Columns Number of Positions Number of Positions Loaded Number of Rows Pitch Termination
50015-5084ALF
50015-5084ALF
Amphenol ICC
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 Black High Density (HDC, HDI, HPC) Header, Male Pins Daughtercard Gold or Gold, GXT™ 30.0µin (0.76µm) - Mating Guide Through Hole 21 84 All 4 0.100" (2.54mm) Solder
50015-5084JLF
50015-5084JLF
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 Black High Density (HDC, HDI, HPC) Header, Male Pins Daughtercard Gold or Gold, GXT™ 30.0µin (0.76µm) - Mating Guide Through Hole 21 84 All 4 0.100" (2.54mm) Solder
50015-5096GLF
50015-5096GLF
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 Black High Density (HDC, HDI, HPC) Header, Male Pins Daughtercard Gold or Gold, GXT™ 30.0µin (0.76µm) - Mating Guide Through Hole 24 96 All 4 0.100" (2.54mm) Solder
50015-5096JLF
50015-5096JLF
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 Black High Density (HDC, HDI, HPC) Header, Male Pins Daughtercard Gold or Gold, GXT™ 30.0µin (0.76µm) - Mating Guide Through Hole 24 96 All 4 0.100" (2.54mm) Solder
50015-5100ALF
50015-5100ALF
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 Black High Density (HDC, HDI, HPC) Header, Male Pins Daughtercard Gold or Gold, GXT™ 30.0µin (0.76µm) - Mating Guide Through Hole 25 100 All 4 0.100" (2.54mm) Solder
50015-5100CLF
50015-5100CLF
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 Black High Density (HDC, HDI, HPC) Header, Male Pins Daughtercard Gold or Gold, GXT™ 30.0µin (0.76µm) - Mating Guide Through Hole 25 100 All 4 0.100" (2.54mm) Solder
50357-1168DLF
50357-1168DLF
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 Black High Density (HDC, HDI, HPC) Header, Male Pins - Gold 30.0µin (0.76µm) - - Through Hole 42 168 All 4 0.100" (2.54mm) Solder
50015-5100DLF
50015-5100DLF
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 Black High Density (HDC, HDI, HPC) Header, Male Pins Daughtercard Gold or Gold, GXT™ 30.0µin (0.76µm) - Mating Guide Through Hole 25 100 All 4 0.100" (2.54mm) Solder
50015-5120DLF
50015-5120DLF
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 Black High Density (HDC, HDI, HPC) Header, Male Pins Daughtercard Gold or Gold, GXT™ 30.0µin (0.76µm) - Mating Guide Through Hole 30 120 All 4 0.100" (2.54mm) Solder
50015-5120JLF
50015-5120JLF
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 Black High Density (HDC, HDI, HPC) Header, Male Pins Daughtercard Gold or Gold, GXT™ 30.0µin (0.76µm) - Mating Guide Through Hole 30 120 All 4 0.100" (2.54mm) Solder
50015-5128CLF
50015-5128CLF
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 Black High Density (HDC, HDI, HPC) Header, Male Pins Daughtercard Gold or Gold, GXT™ 30.0µin (0.76µm) - Mating Guide Through Hole 32 128 All 4 0.100" (2.54mm) Solder
50015-5128DLF
50015-5128DLF
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 Black High Density (HDC, HDI, HPC) Header, Male Pins Daughtercard Gold or Gold, GXT™ 30.0µin (0.76µm) - Mating Guide Through Hole 32 128 All 4 0.100" (2.54mm) Solder
50015-5128GLF
50015-5128GLF
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 Black High Density (HDC, HDI, HPC) Header, Male Pins Daughtercard Gold or Gold, GXT™ 30.0µin (0.76µm) - Mating Guide Through Hole 32 128 All 4 0.100" (2.54mm) Solder
50015-5128JLF
50015-5128JLF
Amphenol ICC
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 Black High Density (HDC, HDI, HPC) Header, Male Pins Daughtercard Gold or Gold, GXT™ 30.0µin (0.76µm) - Mating Guide Through Hole 32 128 All 4 0.100" (2.54mm) Solder
50015-5132JLF
50015-5132JLF
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 Black High Density (HDC, HDI, HPC) Header, Male Pins Daughtercard Gold or Gold, GXT™ 30.0µin (0.76µm) - Mating Guide Through Hole 32 132 All 4 0.100" (2.54mm) Solder
50015-5136CLF
50015-5136CLF
Amphenol ICC
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 Black High Density (HDC, HDI, HPC) Header, Male Pins Daughtercard Gold or Gold, GXT™ 30.0µin (0.76µm) - Mating Guide Through Hole 34 136 All 4 0.100" (2.54mm) Solder
50015-5140ALF
50015-5140ALF
Amphenol ICC
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 Black High Density (HDC, HDI, HPC) Header, Male Pins Daughtercard Gold or Gold, GXT™ 30.0µin (0.76µm) - Mating Guide Through Hole 35 140 All 4 0.100" (2.54mm) Solder
50357-5036GLF
50357-5036GLF
Amphenol ICC
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 Black High Density (HDC, HDI, HPC) Header, Male Pins - Gold or Gold, GXT™ 30.0µin (0.76µm) - - Through Hole 9 36 All 4 0.100" (2.54mm) Solder
50015-5140JLF
50015-5140JLF
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 Black High Density (HDC, HDI, HPC) Header, Male Pins Daughtercard Gold or Gold, GXT™ 30.0µin (0.76µm) - Mating Guide Through Hole 35 140 All 4 0.100" (2.54mm) Solder
50015-5160ALF
50015-5160ALF
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 Black High Density (HDC, HDI, HPC) Header, Male Pins Daughtercard Gold or Gold, GXT™ 30.0µin (0.76µm) - Mating Guide Through Hole 40 160 All 4 0.100" (2.54mm) Solder
50015-5164ALF
50015-5164ALF
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 Black High Density (HDC, HDI, HPC) Header, Male Pins Daughtercard Gold or Gold, GXT™ 30.0µin (0.76µm) - Mating Guide Through Hole 41 164 All 4 0.100" (2.54mm) Solder
50015-5164CLF
50015-5164CLF
Amphenol ICC
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 Black High Density (HDC, HDI, HPC) Header, Male Pins Daughtercard Gold or Gold, GXT™ 30.0µin (0.76µm) - Mating Guide Through Hole 41 164 All 4 0.100" (2.54mm) Solder
50015-5164GLF
50015-5164GLF
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 Black High Density (HDC, HDI, HPC) Header, Male Pins Daughtercard Gold or Gold, GXT™ 30.0µin (0.76µm) - Mating Guide Through Hole 41 164 All 4 0.100" (2.54mm) Solder
50015-5164JLF
50015-5164JLF
Amphenol ICC
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 Black High Density (HDC, HDI, HPC) Header, Male Pins Daughtercard Gold or Gold, GXT™ 30.0µin (0.76µm) - Mating Guide Through Hole 41 164 All 4 0.100" (2.54mm) Solder
50015-5168GLF
50015-5168GLF
Amphenol ICC
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 Black High Density (HDC, HDI, HPC) Header, Male Pins Daughtercard Gold or Gold, GXT™ 30.0µin (0.76µm) - Mating Guide Through Hole 42 168 All 4 0.100" (2.54mm) Solder
50015-5168JLF
50015-5168JLF
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 Black High Density (HDC, HDI, HPC) Header, Male Pins Daughtercard Gold or Gold, GXT™ 30.0µin (0.76µm) - Mating Guide Through Hole 42 168 All 4 0.100" (2.54mm) Solder
50015-5180ALF
50015-5180ALF
Amphenol ICC
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 Black High Density (HDC, HDI, HPC) Header, Male Pins Daughtercard Gold or Gold, GXT™ 30.0µin (0.76µm) - Mating Guide Through Hole 45 180 All 4 0.100" (2.54mm) Solder
50015-5180JLF
50015-5180JLF
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 Black High Density (HDC, HDI, HPC) Header, Male Pins Daughtercard Gold or Gold, GXT™ 30.0µin (0.76µm) - Mating Guide Through Hole 45 180 All 4 0.100" (2.54mm) Solder
0758610105
0758610105
Molex
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 Gray GbX Header, Male Pins - Gold 30.0µin (0.76µm) - - Through Hole 10 50 All 5 0.073" (1.85mm) Press-Fit
50015-5192ALF
50015-5192ALF
Amphenol ICC
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 Black High Density (HDC, HDI, HPC) Header, Male Pins Daughtercard Gold or Gold, GXT™ 30.0µin (0.76µm) - Mating Guide Through Hole 48 192 All 4 0.100" (2.54mm) Solder
50015-5200ALF
50015-5200ALF
Amphenol ICC
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 Black High Density (HDC, HDI, HPC) Header, Male Pins Daughtercard Gold or Gold, GXT™ 30.0µin (0.76µm) - Mating Guide Through Hole 50 200 All 4 0.100" (2.54mm) Solder
50015-5208CLF
50015-5208CLF
Amphenol ICC
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 Black High Density (HDC, HDI, HPC) Header, Male Pins Daughtercard Gold or Gold, GXT™ 30.0µin (0.76µm) - Mating Guide Through Hole 52 208 All 4 0.100" (2.54mm) Solder
50015-5220ALF
50015-5220ALF
Amphenol ICC
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 Black High Density (HDC, HDI, HPC) Header, Male Pins Daughtercard Gold or Gold, GXT™ 30.0µin (0.76µm) - Mating Guide Through Hole 55 220 All 4 0.100" (2.54mm) Solder
50015-5220CLF
50015-5220CLF
Amphenol ICC
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 Black High Density (HDC, HDI, HPC) Header, Male Pins Daughtercard Gold or Gold, GXT™ 30.0µin (0.76µm) - Mating Guide Through Hole 55 220 All 4 0.100" (2.54mm) Solder
50015-5240ALF
50015-5240ALF
Amphenol ICC
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 Black High Density (HDC, HDI, HPC) Header, Male Pins Daughtercard Gold or Gold, GXT™ 30.0µin (0.76µm) - Mating Guide Through Hole 60 240 All 4 0.100" (2.54mm) Solder
50015-5240JLF
50015-5240JLF
Amphenol ICC
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 Black High Density (HDC, HDI, HPC) Header, Male Pins Daughtercard Gold or Gold, GXT™ 30.0µin (0.76µm) - Mating Guide Through Hole 60 240 All 4 0.100" (2.54mm) Solder
50015-5280ALF
50015-5280ALF
Amphenol ICC
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 Black High Density (HDC, HDI, HPC) Header, Male Pins Daughtercard Gold or Gold, GXT™ 30.0µin (0.76µm) - Mating Guide Through Hole 70 280 All 4 0.100" (2.54mm) Solder
50015-5280JLF
50015-5280JLF
Amphenol ICC
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 Black High Density (HDC, HDI, HPC) Header, Male Pins Daughtercard Gold or Gold, GXT™ 30.0µin (0.76µm) - Mating Guide Through Hole 70 280 All 4 0.100" (2.54mm) Solder
50015-5300JLF
50015-5300JLF
Amphenol ICC
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 Black High Density (HDC, HDI, HPC) Header, Male Pins Daughtercard Gold or Gold, GXT™ 30.0µin (0.76µm) - Mating Guide Through Hole 75 300 All 4 0.100" (2.54mm) Solder
1737080002
1737080002
Download Datasheet for 1737080002
Molex
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 Black - Receptacle - Gold 30.0µin (0.76µm) - - Through Hole, Right Angle - 1 All 1 - Press-Fit
50015-5320ALF
50015-5320ALF
Amphenol ICC
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 Black High Density (HDC, HDI, HPC) Header, Male Pins Daughtercard Gold or Gold, GXT™ 30.0µin (0.76µm) - Mating Guide Through Hole 80 320 All 4 0.100" (2.54mm) Solder
50015-5320JLF
50015-5320JLF
Amphenol ICC
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 Black High Density (HDC, HDI, HPC) Header, Male Pins Daughtercard Gold or Gold, GXT™ 30.0µin (0.76µm) - Mating Guide Through Hole 80 320 All 4 0.100" (2.54mm) Solder
50015-XX019LF
50015-XX019LF
Amphenol ICC
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 Black High Density (HDC, HDI, HPC) Header, Male Pins Daughtercard - 30.0µin (0.76µm) - Mating Guide Through Hole - - All 4 0.100" (2.54mm) Solder
50102-XX003LF
50102-XX003LF
Download Datasheet for 50102-XX003LF
Amphenol ICC
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 Black High Density (HDC, HDI, HPC) Header, Male Pins - Gold or Gold, GXT™ 30.0µin (0.76µm) - - Through Hole - 405 All 3 0.100" (2.54mm) Press-Fit
50122-1216JLF
50122-1216JLF
Amphenol ICC
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 Black High Density (HDC, HDI, HPC) Header, Male Pins - Gold 30.0µin (0.76µm) - Mating Guide Board Edge, Through Hole, Right Angle 54 216 All 4 0.100" (2.54mm) Solder
50294-1027ELF
50294-1027ELF
Amphenol ICC
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 - High Density (HDC, HDI, HPC) Receptacle, Female Sockets Daughtercard Gold 30.0µin (0.76µm) - Mating Guide Through Hole, Right Angle 9 27 All 3 0.100" (2.54mm) Solder
50294-1030ELF
50294-1030ELF
Amphenol ICC
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 - High Density (HDC, HDI, HPC) Receptacle, Female Sockets Daughtercard Gold 30.0µin (0.76µm) - Mating Guide Through Hole, Right Angle 10 30 All 3 0.100" (2.54mm) Solder
50294-1030HLF
50294-1030HLF
Amphenol ICC
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 - High Density (HDC, HDI, HPC) Receptacle, Female Sockets Daughtercard Gold 30.0µin (0.76µm) - Mating Guide Through Hole, Right Angle 10 30 All 3 0.100" (2.54mm) Solder
50294-1036HLF
50294-1036HLF
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 - High Density (HDC, HDI, HPC) Receptacle, Female Sockets Daughtercard Gold 30.0µin (0.76µm) - Mating Guide Through Hole, Right Angle 12 36 All 3 0.100" (2.54mm) Solder
6766011-1
6766011-1
TE Connectivity
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Showing 3651-3700 of 38,888 products

About Specialized

Specialized backplane connectors are critical components in electronic systems, facilitating reliable connections between circuit boards and other devices. These connectors are engineered to meet specific application requirements, ensuring optimal performance in demanding environments.

When sourcing specialized connectors, it is essential to consider several important attributes, including color, connector style, connector type, and connector usage. These factors play a significant role in determining the suitability of a connector for your specific application.

Applications for specialized backplane connectors include board-to-board and cable interconnects, new product design and prototyping, production electronics assembly, maintenance and field replacement, as well as engineering evaluation and qualification. Understanding these applications can help you make informed decisions during the procurement process.

Before submitting a request for quotation (RFQ), buyers should validate lifecycle status and explore alternate-source options to mitigate sourcing risks. It is also crucial to confirm mechanical and electrical compatibility with existing design constraints. Prioritizing parametric filtering based on critical specifications will streamline the selection process and enhance sourcing efficiency.

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