Murata Manufacturing Co., Ltd. has introduced its new Type 2FR connectivity module, driven by NXP Semiconductor’s RW612 wireless microcontroller (MCU) with an integrated tri-radio. Measuring 12 × 11 mm, the tri-radio module is 50% smaller than a discrete implementation. It delivers high integration, efficiency and tri-radio capabilities that Murata claims is a breakthrough in IoT connectivity. Applications include smart home devices, smart appliances, enterprise and industrial automation as well as smart city and smart energy solutions.

The module supports communication protocols such as dual-band Wi-Fi 6, Bluetooth Low Energy (LE) 5.3, 802.15.4 and Ethernet. Importantly today, Type 2FR is ready for Matter, allowing compatibility with Matter over Wi-Fi, Matter over Thread and Matter over Ethernet.

The Wi-Fi and Ethernet capability allows the IoT device to function as a border router to address new applications, according to the company.

The module features a 260-MHz Arm Cortex-M33 core, 1.2-MB RAM, 16-MB flash memory and NXP EdgeLock security to meet a broad spectrum of IoT applications. The module  can operate in co-processor mode. The RW612 is supported by the NXP MCUXpresso ecosystem of software and tools. The solution has full regulatory certification and offers multiple external antenna options for compliance and reliability.

Murata will showcase its Matter-enabled tri-radio module portfolio at CES 2024, LVCC, West Hall, Booth #6300. Samples will be available at the same time.

Insight SiP has unveiled the ISP3080 UWB-BLE module, a fully integrated device that only requires power to create a fully functioning ultra-wideband (UWB) and Bluetooth Low Energy (BLE) node, complete with integrated antennas. Sized at 12 × 12 × 1.5 mm, the module incorporates both system-in-package technology for miniaturization of RF technologies and the company’s proprietary Antenna-in-Package techniques.

The UWB-BLE module is based on the QM31100 UWB transceiver with the latest UWB technology from Qorvo together with Nordic Semiconductor’s nRF52833 BLE chip. According to Insight SiP, the UWB solution significantly improves power consumption and interoperability when compared to previous generations, and conforms to the FiRa standard, which is rapidly gaining acceptance.

The device enables UWB connections to other vendors’ FiRa compatible chipsets and UWB-equipped mobile phones including the latest generation of Apple, Google and Samsung devices. Other applications for the module include secure entry, real-time location systems, ticketing and barrier control, and hands-free key solutions.

The RF module’s ultra-low power can be achieved by using Bluetooth and the integrated accelerometer to switch on the UWB transceiver only when necessary. It offers a range of peripherals that allow a selection of digital and analog connections that include UWB, SPI, UART, I2C and programmable general purpose I/O, and on-board analog-to-digital converters.

Molex has introduced its MX60 series of contactless connectivity solutions. Designed to replace physical cables or connectors, the low-power, high-speed, solid-state devices feature miniaturized mmWave RF transceivers and built-in antennas in one package for faster and simpler device-to-device communications.

This results in greater design flexibility, seamless device pairing and increased communications reliability, said Molex. Applications include video displays and consumer electronics as well as industrial robotics and devices operating in harsh environments.

The MX60 series is based on wireless chip-to-chip technology acquired in 2021 through the purchase of core technology and intellectual property from Keyssa Inc., a provider of high-speed contactless connectivity. The technology operates at data rates from 1-to-5.4 Gbits/s on the 60-GHz band with no Wi‑Fi or Bluetooth interference.

The first devices replace traditional DisplayPort, Gigabit Ethernet and USB SuperSpeed connectors to reduce development time, cost and risk, said Molex. A space-saving, contactless solution that provides USB2 and other low-speed interfaces is currently in development.

“Every piece of real estate counts when designing smartphones, AR/VR glasses, smartwatches and other consumer devices,” said Walter Rivera, senior manager, Wireless Connectivity Product Manager for the Micro Solutions Business Unit at Molex, in a statement. “By combining USB2 and other low-speed interfaces in one contactless solution, we will offer product developers a critical head-start as they won’t have to worry about fitting extra components into ever-shrinking form factors.”

The MX60 series also improves product reliability in harsh environmental conditions, such as dust, moisture and corrosion. The contact-free solutions are sealed and provide lower risk in applications with ingress and repeated motions including high-vibration and rotational products, in comparison to physical metal-to-metal contacts.

These solutions can be used in a range of applications including smartphones, AR/VR glasses, tablets, self-driving vehicles, video walls, industrial robotics, medical wearables and wireless docking stations.

Production samples are available for the MX60 USB SuperSpeed for high-vibration and harsh environments, including mobile devices and networking applications; the MX60 Gigabit Ethernet for wireless infrastructure, industrial automation, medtech and networking applications; and the MX60 DisplayPort Main and Auxiliary, a high-speed replacement for conventional DisplayPort connectors.

STMicroelectronics has introduced its Teseo-LIV4F GNSS module that leverages the company’s Teseo IV single-die receiver technology, which includes L1 and L5 frequency-band support. It provides positioning accuracy better than one meter in embedded geolocation systems.

Delivering simultaneous multi-constellation and multi-band GNSS, the Teseo-LIV4F also extends multi-constellation compatibility to include navigation with Indian constellation (NavIC or IRNSS, the Indian Regional Navigation Satellite System).

Easing design with the single-die receiver technology, the low power consumption modules in an ultra-compact form factor come with Teseo-LIV4FSW firmware. This allows users to leverage the Teseo Suite PC-based application for free firmware configuration and updating, while the evaluation environment saves development time.

The Teseo-LIV4F module can be used for a variety of position, navigation and timing (PNT) applications. These include insurance, goods tracking, tolling, anti-theft systems, people and pet location, vehicle tracking, emergency calls, fleet management, vehicle sharing, diagnostics and public transportation. It provides real-time assisted GNSS that allows prediction of satellite data based on previous observations.

The Teseo-LIV4F GNSS module with an on-board temperature-compensated crystal oscillator (TCXO) and dedicated real-time clock (RTC) oscillator offers fast time to first fix (TTFF). Key features include 49-mA GNSS L1 and L5 tracking current and 10-μA standby current for extended battery runtime and tracking sensitivity of -162 dBm to help maintain accuracy when signal strength is low.

The Teseo-LIV4F module is officially certified in accordance with CE, FCC and ICES regulations. The operating temperature range from -40°C to 85°C enables use in harsh environments such as outdoors and in factories.

In production, the Teseo-LIV4F GNSS module is available in a 9.7 × 10.1-mm LCC-18 pin package. It is covered by ST’s extended product-longevity assurance for industrial ICs.

Infineon also offers the Teseo-LIV4FM dual-band GNSS measurement engine module with the same size and pin-out of the Teseo-LIV4F. It provides precise positioning for applications such as micro mobility, agriculture and navigation with centimeter level accuracy using the MCU-host RTK/PPP algorithm. Engineering samples of Teseo-LIV4FM are available now with production scheduled for the end of 2023.