Teledyne e2v’s chips target space-based applications with significantly improved performance, protection against radiation, and spatial efficiency.
Teledyne e2v recently released two products that support both SWaP and performance for edge computing and satellite development. The two devices, a multicore processor and high-density onboard memory, each have upgraded specs from existing technology and afford new design versatility.
As the number of LEO satellite launches increases, more designers may face new limitations on size, power consumption, and radiation tolerance. Moving a terrestrial system to an aerospace system is not as easy as simply ensuring the devices can survive a launch; it requires additional development hours to guarantee correct operation outside the bounds of our atmosphere. Teledyne’s new devices can potentially make this transition much easier.
Powerful, Multicore Processing in Space
Teledyne e2v is developing the LX2160 and LX2160A 16-core Arm-based processors to target embedded applications. Within the confines of our atmosphere, the rad-hard LX2160A can provide high-performance computing for embedded or edge applications.
The LX2160 and LX2160A (datasheet linked) provide 8 MB of L2 cache, and each possesses multiple different interfaces that allow data to be transferred into and out of the processor as quickly as possible. These include up to 100-Gb Ethernet, multiple PCIe Gen3.0 blocks, and a 50-Gbps encryption engine to secure data (along with standard I2C, UART, SPI, and CAN buses).
The LX2160 and LX2160A each incorporate numerous processing and peripheral features. Image used courtesy of Teledyne e2v
The processors support up to 200 k DMIPs—a 100% improvement from previous generations of Teledyne e2v space-based offerings. Furthermore, the LX2160 is qualified to NASA and ECSS specifications and operates in a temperature range from -55°C to 125°C. Radiation testing and reports accompany the two processors.
High-Density DDR4 Memory
Complementing the multicore processors, Teledyne e2v has also released more information on its integrated DDR4 memory chips for space-grade applications. While processing speed is certainly an important metric, memory latency and bandwidth must also be just as performant to support modern applications such as AI/ML or embedded designs.
The Teledyne e2v DDR4 chips come in densities of 4 GB and 8 GB per chip, with a bus width of 72 bits (64-bit data and 8-bit ECC). The chips support up to 2,400 MT/s in a small package size to conserve weight and power consumption in embedded space applications.
The Alpha Data development kit has already included the Teledyne e2v memory chip with an FPGA. Image used courtesy of Alpha Data
The DDR4 solution is not limited to Teledyne e2v processors. The device is compatible with any processor or FPGA with a built-in DDR4 controller. As such, designers are free to select the processor and memory combination to best suit their needs. The DDR4 chips are qualified for both NASA and ECSS Level 1, with radiation tolerance and reports available.
